-
EP0223066
European procedure
Extract from the Register of European Patents
EP About this file: EP0223066
| EP0223066 - Device for soldering electronic components on a printed-circuit board [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.04.1990 Database last updated on 24.07.2024 | Most recent event Tooltip | 22.05.2009 | Change - representative | published on 24.06.2009 [2009/26] | Applicant(s) | For all designated states Siemens Nixdorf Informationssysteme Aktiengesellschaft Fürstenallee 7 33102 Paderborn / DE | [N/P] |
| Former [1987/22] | For all designated states Siemens Nixdorf Informationssysteme Aktiengesellschaft Fürstenallee 7 D-33102 Paderborn / DE | Inventor(s) | 01 /
Langhans, Lutz, Dr. Fasanenweg 25 D-8130 Starnberg / DE | 02 /
Meyer, Friedrich G. Bäckergasse 19 D-8137 Berg / DE | 03 /
Drake, Johannes Am Richterbusch 18 D-4790 Paderborn / DE | [1987/22] | Representative(s) | Schaumburg und Partner Patentanwälte mbB Mauerkircherstraße 31 81679 München / DE | [N/P] |
| Former [2009/26] | Schaumburg, Thoenes, Thurn, Landskron, Eckert Patentanwälte Postfach 86 07 48 81634 München / DE | ||
| Former [1987/22] | Schaumburg, Thoenes & Thurn Mauerkircherstrasse 31 D-81679 München / DE | Application number, filing date | 86114281.8 | 15.10.1986 | [1987/22] | Priority number, date | DE19853539933 | 11.11.1985 Original published format: DE 3539933 | [1987/22] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP0223066 | Date: | 27.05.1987 | Language: | DE | [1987/22] | Type: | B1 Patent specification | No.: | EP0223066 | Date: | 31.05.1989 | Language: | DE | [1989/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.04.1987 | Classification | IPC: | B23K26/06, B23K1/00, H05K3/34 | [1987/22] | CPC: |
B23K26/0673 (EP,US);
B23K1/0056 (EP,US);
B23K26/067 (EP,US);
H05K13/0465 (EP,US);
H05K3/3421 (EP,US);
H05K3/3494 (EP,US)
| Designated contracting states | AT, BE, CH, DE, ES, FR, GB, IT, LI, NL, SE [1987/30] |
| Former [1987/22] | AT, BE, CH, DE, ES, FR, GB, GR, IT, LI, LU, NL, SE | Title | German: | Vorrichtung zum Auflöten elektronischer Bauelemente auf eine Schaltungsplatine | [1987/22] | English: | Device for soldering electronic components on a printed-circuit board | [1987/22] | French: | Equipement pour le soudage de composants électroniques sur un circuit imprimé | [1987/22] | Examination procedure | 18.12.1986 | Loss of particular rights, legal effect: designated state(s) | 18.02.1987 | Despatch of communication of loss of particular rights: designated state(s) GR, LU | 07.05.1987 | Examination requested [1987/28] | 22.11.1988 | Despatch of communication of intention to grant (Approval: Yes) | 07.12.1988 | Communication of intention to grant the patent | 19.01.1989 | Fee for grant paid | 19.01.1989 | Fee for publishing/printing paid | Opposition(s) | 01.03.1990 | No opposition filed within time limit [1990/21] | Fees paid | Renewal fee | 28.10.1988 | Renewal fee patent year 03 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 17.11.1986 | GR M02 Not yet paid | 17.11.1986 | LU M02 Not yet paid |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US4020319 (SHEPARD RICHARD WILTON, et al); | [YD]FR2434002 (RAYTHEON CO [US]); | [A]EP0013345 (IBM [US]) |