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Extract from the Register of European Patents

EP About this file: EP0228200

EP0228200 - Thermal protective device with bimetal for semiconductor devices and the like [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.05.1993
Database last updated on 16.11.2024
Most recent event   Tooltip20.05.1993No opposition filed within time limitpublished on 07.07.1993 [1993/27]
Applicant(s)For all designated states
Texas Instruments Incorporated
13500 North Central Expressway
Dallas, Texas 75265 / US
[N/P]
Former [1987/28]For all designated states
TEXAS INSTRUMENTS INCORPORATED
13500 North Central Expressway
Dallas Texas 75265 / US
Inventor(s)01 / Calenda, Ciro
Viale Olimpico Parco Cerimele IS. D, INT. 18
I-81031 Aversa (Caserta) / IT
02 / Imbimbo, Fiorentino
Vico Secondo Montesanto 26
I-80135 Napoli / IT
03 / Notaro, Giuseppe
Via Del Tintoretto, 2
I-80038 Pomigliano d'Arco / IT
[1987/28]
Representative(s)Abbott, David John, et al
Abel & Imray 20 Red Lion Street
London WC1R 4PQ / GB
[N/P]
Former [1987/28]Abbott, David John, et al
Abel & Imray Northumberland House 303-306 High Holborn
London, WC1V 7LH / GB
Application number, filing date86309426.403.12.1986
[1987/28]
Priority number, dateIT1985004887304.12.1985         Original published format: IT 4887385
[1987/28]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0228200
Date:08.07.1987
Language:EN
[1987/28]
Type: A3 Search report 
No.:EP0228200
Date:30.08.1989
Language:EN
[1989/35]
Type: B1 Patent specification 
No.:EP0228200
Date:15.07.1992
Language:EN
[1992/29]
Search report(s)(Supplementary) European search report - dispatched on:EP12.07.1989
ClassificationIPC:H01H37/54, H01H37/04
[1987/28]
CPC:
H01H37/5436 (EP,US); H01H37/54 (EP,US); H01H2037/046 (EP,US)
Designated contracting statesDE,   FR,   GB,   NL,   SE [1987/28]
TitleGerman:Thermische Schutzanordnung mit Bimetall für Halbleitereinrichtungen und dergleichen[1987/28]
English:Thermal protective device with bimetal for semiconductor devices and the like[1987/28]
French:Dispositif de protection thermique avec bimétal pour dispositifs semi-conducteurs et similaires[1987/28]
Examination procedure19.01.1990Examination requested  [1990/12]
25.10.1990Despatch of a communication from the examining division (Time limit: M04)
28.02.1991Reply to a communication from the examining division
30.04.1991Despatch of a communication from the examining division (Time limit: M04)
31.08.1991Reply to a communication from the examining division
28.10.1991Despatch of communication of intention to grant (Approval: Yes)
14.01.1992Communication of intention to grant the patent
11.02.1992Fee for grant paid
11.02.1992Fee for publishing/printing paid
Opposition(s)16.04.1993No opposition filed within time limit [1993/27]
Fees paidRenewal fee
13.12.1988Renewal fee patent year 03
14.12.1989Renewal fee patent year 04
10.12.1990Renewal fee patent year 05
10.12.1991Renewal fee patent year 06
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Lapses during opposition  TooltipSE15.07.1992
[1993/11]
Documents cited:Search[A]GB1028382  (STANDARD TELEPHONES CABLES LTD);
 [A]DE2035398  ;
 [A]US3861032  (SCHMITT DONALD J);
 [A]GB2021320  (SUNDSTRAND DATA CONTROL)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.