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EP0228212
European procedure
Extract from the Register of European Patents
EP About this file: EP0228212
| EP0228212 - Integrated circuit device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.06.1992 Database last updated on 02.11.2024 | Most recent event Tooltip | 31.07.2009 | Change - representative | published on 02.09.2009 [2009/36] | Applicant(s) | For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP | [N/P] |
| Former [1987/28] | For all designated states HITACHI, LTD. 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 / JP | Inventor(s) | 01 /
Funamoto, Takao 10-35, Ayukawa-cho 6-chome Hitachi-shi Ibaraki 316 / JP | 02 /
Katou, Mituo 19-1, Ishinazaka-cho 1-chome Hitachi-shi Ibaraki 319-12 / JP | 03 /
Kajiwara, Ryoichi 20-1, Mizuki-cho 2-chome Hitachi-shi Ibaraki 316 / JP | 04 /
Matsuzaka, Takeshi 9-5, Nishi-narusawa-cho 4-chome Hitachi-shi Ibaraki 316 / JP | 05 /
Shida, Tomohiko 11-11, Namekawa-hon-cho 3-chome Hitachi-shi Ibaraki 317 / JP | 06 /
Takahashi, Kazuya 3600-267, Nakane Katsuta-shi Ibaraki 312 / JP | 07 /
Wachi, Hiroshi 1-4, Suehiro-cho 3-chome Hitachi-shi Ibaraki 316 / JP | 08 /
Watanabe, Masatoshi 19-8, Kanesawa-cho 6-chome Hitachi-shi Ibaraki 316 / JP | 09 /
Yamada, Minoru 60-17, Koyata Iruma-shi Saitama 358 / JP | 10 /
Sugawara, Katuo 15-2, Moriyama-cho 1-chome Hitachi-shi Ibaraki 316 / JP | 11 /
Nakanishi, Keiichirou Hitachi-daini Kyoushin-ryo 1-3, Higashi-koigakubo 3-chome Kokubunji-shi Tokyo 185 / JP | [1987/28] | Representative(s) | Calderbank, Thomas Roger, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
| Former [2009/36] | Calderbank, Thomas Roger, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | ||
| Former [1987/28] | Calderbank, Thomas Roger, et al MEWBURN ELLIS York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 86309619.4 | 10.12.1986 | [1987/28] | Priority number, date | JP19850280960 | 16.12.1985 Original published format: JP 28096085 | JP19860130120 | 06.06.1986 Original published format: JP 13012086 | [1987/28] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0228212 | Date: | 08.07.1987 | Language: | EN | [1987/28] | Type: | A3 Search report | No.: | EP0228212 | Date: | 27.09.1989 | Language: | EN | [1989/39] | Type: | B1 Patent specification | No.: | EP0228212 | Date: | 07.08.1991 | Language: | EN | [1991/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.08.1989 | Classification | IPC: | H05K7/20, H01L23/46, H01L23/52, H01L23/42 | [1989/37] | CPC: |
H01L23/473 (EP,US);
H01L23/5383 (EP,US);
H01L23/5385 (EP,US);
H05K1/0272 (EP,US);
H05K1/0373 (EP,US);
H01L2924/0002 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [1987/28] | H01L23/42 | Designated contracting states | DE, FR, GB [1987/28] | Title | German: | Integriertes Halbleiterbauelement | [1987/28] | English: | Integrated circuit device | [1987/28] | French: | Dispositif à circuit intégré | [1987/28] | File destroyed: | 03.03.2001 | Examination procedure | 30.01.1987 | Examination requested [1987/28] | 08.11.1989 | Request for accelerated examination filed | 18.01.1990 | Despatch of a communication from the examining division (Time limit: M04) | 18.01.1990 | Decision about request for accelerated examination - accepted: Yes | 12.09.1990 | Despatch of a communication from the examining division (Time limit: M02) | 13.09.1990 | Reply to a communication from the examining division | 14.11.1990 | Despatch of communication of intention to grant (Approval: No) | 16.01.1991 | Despatch of communication of intention to grant (Approval: later approval) | 28.01.1991 | Communication of intention to grant the patent | 17.04.1991 | Fee for grant paid | 17.04.1991 | Fee for publishing/printing paid | Opposition(s) | 08.05.1992 | No opposition filed within time limit [1992/31] | Fees paid | Renewal fee | 19.12.1988 | Renewal fee patent year 03 | 22.12.1989 | Renewal fee patent year 04 | 13.12.1990 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JP59202654 ; | [Y]DE3133485 (HERREN PETER); | [A]GB1028363 (CHAUSSON USINES SA); | [A]FR1481645 (TRANE CO) | [Y] - PATENT ABSTRACTS OF JAPAN. vol. 9, no. 65 (E-304)(1788) 26th March 1985; & JP-A-59 202 654 (NIPPON DENSHIN DENWA KOSHA) 16-11-1984, & JP59202654 A 00000000 | [A] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 23, no. 3, August 1980, page 1057, New York, US; H.D. EDMONDS et al.: "Heat exchange element for semiconductor device cooling". |