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Extract from the Register of European Patents

EP About this file: EP0242745

EP0242745 - Method and apparatus for controlling the chemical state of an electroless plating bath [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  09.05.1991
Database last updated on 14.09.2024
Most recent event   Tooltip23.11.2007Lapse of the patent in a contracting statepublished on 26.12.2007  [2007/52]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1987/44]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / McBride, Donald Gene
2058 Cheshire Road
Binghamton, N.Y. 13903 / US
02 / Rickert, Robert George
2705 Foster Street
Endwell, N.Y. 13760 / US
[1987/44]
Representative(s)Mönig, Anton
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
70548 Stuttgart / DE
[N/P]
Former [1990/15]Mönig, Anton, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1987/44]Oechssler, Dietrich, Dr. rer. nat.
IBM Deutschland GmbH Patentwesen und Urheberrecht Schönaicher Strasse 220
D-71032 Böblingen / DE
Application number, filing date87105380.710.04.1987
[1987/44]
Priority number, dateUS1986085426221.04.1986         Original published format: US 854262
[1987/44]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0242745
Date:28.10.1987
Language:EN
[1987/44]
Type: B1 Patent specification 
No.:EP0242745
Date:04.07.1990
Language:EN
[1990/27]
Search report(s)(Supplementary) European search report - dispatched on:EP25.08.1987
ClassificationIPC:C23C18/31, C23C18/38
[1990/27]
CPC:
C23C18/1683 (EP,US)
Former IPC [1987/44]C23C18/46
Designated contracting statesDE,   FR,   GB,   IT [1987/44]
TitleGerman:Verfahren und Vorrichtung zur Kontrolle des chemischen Zustandes von einem chemischen Metallisierungsbad[1987/44]
English:Method and apparatus for controlling the chemical state of an electroless plating bath[1987/44]
French:Procédé et dispositif pour contrôler l'état chimique d'un bain de métallisation sans courant[1987/44]
Examination procedure24.02.1988Examination requested  [1988/16]
31.08.1989Despatch of communication of intention to grant (Approval: No)
11.12.1989Despatch of communication of intention to grant (Approval: later approval)
29.12.1989Communication of intention to grant the patent
22.01.1990Fee for grant paid
22.01.1990Fee for publishing/printing paid
Opposition(s)05.04.1991No opposition filed within time limit [1991/26]
Fees paidRenewal fee
13.04.1989Renewal fee patent year 03
10.04.1990Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT04.07.1990
[2007/52]
Former [1999/42]IT04.07.1990
Documents cited:Search[A]JP59226171  ;
 [A]JP53048939  ;
 [A]DE2757458  (ROCKWELL INTERNATIONAL CORP)
 [A]  - JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 127, no. 2, February 1980, pages 365-369, Princeton; M. PAUNOVIC: "An electrochemical control system for electroless copper bath"
 [A]  - CHEMICAL ABSTRACTS, vol. 97, no. 3, 19th July 1982, page 629, abstract no. 225424u, Columbus, Ohio, US; I. OHNO et al.: "Electrochemical impedance measurements applied to the study of electroless plating", & AES ELECTROLESS PLAT. SYMP., 1st 1982, Paper 16, 12 pp.
 [A]  - CHEMICAL ABSTRACTS, vol. 96, no. 20, 17th May 1982, page 582, abstract no. 171085t, Columbus, Ohio, US; I. OHNO et al.: "Electrochemical monitoring of instantaneous rate in electroless plating", & MET. AUSTRALAS. 1982, 14(2), 18-21, 23
 [A]  - PATENT ABSTRACTS OF JAPAN, vol. 9, no. 96 (C-278)[1819), 25th April 1985; & JP-A-59 226 171 (BROTHER KOGYO K.K.) 19-12-1984, & JP59226171 A 00000000
 [A]  - CHEMICAL ABSTRACTS, vol. 89, no. 22, 27th November 1978, page 277, abstract no. 184516q, Columbus, Ohio, US; & JP-A-53 048 939 (TOKYO SHIBAURA ELECTRIC CO., LTD) 02-05-1978, & JP53048939 A 00000000
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