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EP0265615
European procedure
Extract from the Register of European Patents
EP About this file: EP0265615
| EP0265615 - Environmentally secure and thermally efficient heat sink assembly [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 02.06.1994 Database last updated on 19.07.2024 | Most recent event Tooltip | 23.11.2007 | Lapse of the patent in a contracting state | published on 26.12.2007 [2007/52] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1988/18] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Arnold, Allen Joseph Box 355 Andrews rd. NR 2 La Grangeville N.Y. 12540 / US | 02 /
Courtney, Mark Gerard 38 Camelot Rd Pourghkeepsie N.Y. 12601 / US | 03 /
Kirby, Diane Neil 51 Stout Curt Pourghkeepsie N.Y. 12601 / US | 04 /
Mis, Katherine Heinz 218 Wilbur Bd Pourghkeepsie N.Y. 12603 / US | 05 /
Sutton, Kerry Louis 75 Fieldstone Bd Wappingers Falls N.Y. 12590 / US | [1993/30] |
| Former [1988/18] | 01 /
Arnold, Allen Joseph Box 355 Andrews rd. NR 2 La Grangeville N.Y. 12540 / US | ||
| 02 /
Courtney, Mark Gerard 38 Camelot Rd Pourghkeepsie N.Y. 12601 / US | |||
| 03 /
Kirby, Diane Neil 51 Stout Curt Pourghkeepsie N.Y. 12601 / US | |||
| 04 /
Mis, Katherine Heinz 218 Wilbur Bd Pourghkeepsie N.Y. 12603 / US | |||
| 05 /
Sutton, Kerry Louis 75 Fieldstone Bd Wappingers Fails N.Y. 12590 / US | Representative(s) | Colas, Alain Compagnie IBM France Département de Propriété Intellectuelle 06610 La Gaude / FR | [N/P] |
| Former [1988/18] | Colas, Alain Compagnie IBM France Département de Propriété Intellectuelle F-06610 La Gaude / FR | Application number, filing date | 87111962.4 | 18.08.1987 | [1988/18] | Priority number, date | US19860923456 | 27.10.1986 Original published format: US 923456 | [1988/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0265615 | Date: | 04.05.1988 | Language: | EN | [1988/18] | Type: | A3 Search report | No.: | EP0265615 | Date: | 05.10.1988 | Language: | EN | [1988/40] | Type: | B1 Patent specification | No.: | EP0265615 | Date: | 28.07.1993 | Language: | EN | [1993/30] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.08.1988 | Classification | IPC: | H01L23/36 | [1988/18] | CPC: |
H01L23/3675 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1988/18] | Title | German: | Kühlungsanordnung mit hohem Wärmewirkungsgrad und hoher Umgebungssicherheit | [1988/18] | English: | Environmentally secure and thermally efficient heat sink assembly | [1988/18] | French: | Assemblage de refroidissement à bon rendement thermique et à sécurité d'environnement | [1988/18] | Examination procedure | 23.08.1988 | Examination requested [1988/42] | 20.12.1991 | Despatch of a communication from the examining division (Time limit: M06) | 26.06.1992 | Reply to a communication from the examining division | 14.10.1992 | Despatch of communication of intention to grant (Approval: Yes) | 22.01.1993 | Communication of intention to grant the patent | 10.02.1993 | Fee for grant paid | 10.02.1993 | Fee for publishing/printing paid | Opposition(s) | 29.04.1994 | No opposition filed within time limit [1994/29] | Fees paid | Renewal fee | 21.08.1989 | Renewal fee patent year 03 | 20.08.1990 | Renewal fee patent year 04 | 22.08.1991 | Renewal fee patent year 05 | 17.08.1992 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IT | 28.07.1993 | [1999/42] | Documents cited: | Search | [A]US4561011 (KOHARA MASANOBU [JP], et al); | [A]WO8600754 (BURROUGHS CORP [US]) | [AD] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 6, November 1979, pages 2294-2296, New York, US; A.J. ARNOLD: "Structure for the removal of heat from an intergrated circuit module" | [A] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 4A, September 1984, pages 1880-1881, New York, US; H. GRUBER et al.: "Heat sink for thermal conduction module" |