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EP0254444
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EP About this file: EP0254444
| EP0254444 - Moulded integrated-circuit module [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 31.05.1988 Database last updated on 06.07.2024 | Most recent event Tooltip | 07.07.2007 | Change - inventor | published on 08.08.2007 [2007/32] | Applicant(s) | For all designated states Hitachi Maxell Ltd. No 1-1-88, Ushitora Ibaraki-shi Osaka-fu / JP | [1988/04] | Inventor(s) | 01 /
Yamamoto, Hiroshi 3-14 Kubogaoka-3-chome Moriyamachi Kitasoma-gun Ibaraki-ken / JP | 02 /
Arakawa, Ryutaro 1468-5 Oaza Furumagi Ishigemachi Yuki-gun Ibaraki-ken / JP | 03 /
Yanaka, Yoshimi 2-3-104 Togashira-1-chome Toride-shi / JP | 04 /
Fukuda, Tuyoshi 4-7 Kubogaoka-3-chome Moriyamachi Kitasoma-gun Ibaraki-ken / JP | [1988/04] | Representative(s) | Williams, Trevor John, et al J.A. KEMP & CO. 14 South Square Gray's Inn London WC1R 5EU / GB | [1988/04] | Application number, filing date | 87305919.0 | 03.07.1987 | [1988/04] | Priority number, date | JP19860157918 | 07.07.1986 Original published format: JP 15791886 | [1988/04] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0254444 | Date: | 27.01.1988 | Language: | EN | [1988/04] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.11.1987 | Classification | IPC: | H01L23/48, H01L23/30 | [1988/04] | CPC: |
G06K19/07747 (EP);
H01L21/52 (KR);
G06K19/07745 (EP);
H01L23/3107 (EP);
H01L23/3135 (EP);
H01L23/49855 (EP);
H01L23/5388 (EP);
H01L2224/48465 (EP);
H01L24/45 (EP);
H01L24/48 (EP);
H01L2924/00014 (EP);
H01L2924/00015 (EP);
H01L2924/01322 (EP);
H01L2924/14 (EP);
H01L2924/181 (EP);
H01L2924/18165 (EP)
(-)
| C-Set: |
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/00015, H01L2224/05599 (EP);
H01L2924/00015, H01L2224/45099 (EP);
H01L2924/00015, H01L2224/85399 (EP);
H01L2924/14, H01L2924/00 (EP); | Designated contracting states | DE, FR, GB [1988/04] | Title | German: | Vergossenes Modul für integrierte Schaltungen | [1988/04] | English: | Moulded integrated-circuit module | [1988/04] | French: | Module moulé pour circuit intégré | [1988/04] | File destroyed: | 29.08.1994 | Examination procedure | 27.05.1988 | Application withdrawn by applicant [1988/29] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]FR2520541 (FLONIC SA [FR]); | [Y]EP0071255 (SIEMENS AG [DE]); | [X]GB2081974 (GAO GES AUTOMATION ORG); | [A]US4151543 (HAYAKAWA MASAO [JP], et al); | [A]US4300153 (HAYAKAWA MASAO, et al); | [A]EP0107061 (PHILIPS PATENTVERWALTUNG [DE], et al) |