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Extract from the Register of European Patents

EP About this file: EP0254589

EP0254589 - Process for preparation of semiconductor device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.08.1992
Database last updated on 19.10.2024
Most recent event   Tooltip20.08.1992No opposition filed within time limitpublished on 07.10.1992 [1992/41]
Applicant(s)For all designated states
FUJITSU LIMITED
1015, Kamikodanaka, Nakahara-ku Kawasaki-shi
Kanagawa 211 / JP
[N/P]
Former [1988/04]For all designated states
FUJITSU LIMITED
1015, Kamikodanaka, Nakahara-ku
Kawasaki-shi, Kanagawa 211 / JP
Inventor(s)01 / Takasaki, Kanetake
26-10-703, Omori Kita 1-chome Ota-ku
Tokyo 143 / JP
[1988/04]
Representative(s)Lawrence, Peter Robin Broughton, et al
Gill Jennings & Every LLP Broadgate House 7 Eldon Street
London EC2M 7LH / GB
[N/P]
Former [1988/04]Lawrence, Peter Robin Broughton, et al
GILL JENNINGS & EVERY, Broadgate House, 7 Eldon Street
London EC2M 7LH / GB
Application number, filing date87306571.824.07.1987
[1988/04]
Priority number, dateJP1986017359025.07.1986         Original published format: JP 17359086
[1988/04]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0254589
Date:27.01.1988
Language:EN
[1988/04]
Type: A3 Search report 
No.:EP0254589
Date:15.03.1989
Language:EN
[1989/11]
Type: B1 Patent specification 
No.:EP0254589
Date:16.10.1991
Language:EN
[1991/42]
Search report(s)(Supplementary) European search report - dispatched on:EP24.01.1989
ClassificationIPC:H01L31/18, H01L31/02, H01L21/205
[1988/04]
CPC:
C23C16/5096 (EP,US); H01L21/205 (KR); C23C16/24 (EP,US);
H01L21/02422 (EP,US); H01L21/02532 (EP,US); H01L21/0262 (EP,US);
H01L31/18 (KR); H01L31/202 (EP,US); Y02E10/50 (EP,US);
Y02P70/50 (EP,US) (-)
Designated contracting statesDE,   FR,   GB [1988/04]
TitleGerman:Herstellungsverfahren einer Halbleitervorrichtung[1988/04]
English:Process for preparation of semiconductor device[1988/04]
French:Procédé pour la fabrication d'un dispositif semi-conducteur[1988/04]
File destroyed:03.03.2001
Examination procedure31.08.1989Examination requested  [1989/44]
12.12.1990Despatch of communication of intention to grant (Approval: Yes)
16.04.1991Communication of intention to grant the patent
28.06.1991Fee for grant paid
28.06.1991Fee for publishing/printing paid
Opposition(s)17.07.1992No opposition filed within time limit [1992/41]
Fees paidRenewal fee
10.07.1989Renewal fee patent year 03
17.07.1990Renewal fee patent year 04
13.07.1991Renewal fee patent year 05
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Documents cited:Search[A]JP59119876  ;
 [X]EP0058543  (ENERGY CONVERSION DEVICES INC [US]);
 [A]EP0016521  (FUJITSU LTD [JP]);
 [A]EP0139409  (ENERGY CONVERSION DEVICES INC [US]);
 [XP]EP0215289  (SIEMENS AG [DE]);
 [A]US4406765  (HIGASHI AKIO [JP], et al)
 [Y]  - ELECTRONICS LETTERS, vol. 18, no. 5, 4th March 1982, pages 211-213, London, GB; G.J.SMITH et al.: "Large-area low-frequency discharge-produced a-Si : H"
 [A]  - PATENT ABSTRACTS OF JAPAN, vol. 8, no. 239 (E-276)[1676], 2nd November 1984; & JP-A-59 119 876 (SUWA SEIKOSHA K.K.) 11-07-1984, & JP59119876 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.