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Extract from the Register of European Patents

EP About this file: EP0266877

EP0266877 - Metallized substrates and process for their production [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  30.10.1992
Database last updated on 31.08.2024
Most recent event   Tooltip07.07.2007Change - inventorpublished on 08.08.2007  [2007/32]
Applicant(s)For all designated states
ENGELHARD CORPORATION
Menlo Park, CN 40 Edison
New Jersey 08818 / US
[N/P]
Former [1988/19]For all designated states
ENGELHARD CORPORATION
Menlo Park, CN 40
Edison New Jersey 08818 / US
Inventor(s)01 / Nguyen, Pascaline H.
3 Tharp Lane
Marlboro New Jersey / US
[1988/19]
Representative(s)Fisher, Adrian John, et al
Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[N/P]
Former [1988/19]Fisher, Adrian John, et al
CARPMAELS & RANSFORD 43 Bloomsbury Square
London WC1A 2RA / GB
Application number, filing date87308018.810.09.1987
[1988/19]
Priority number, dateUS1986090634510.09.1986         Original published format: US 906345
[1988/19]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0266877
Date:11.05.1988
Language:EN
[1988/19]
Type: A3 Search report 
No.:EP0266877
Date:13.12.1989
Language:EN
[1989/50]
Search report(s)(Supplementary) European search report - dispatched on:EP27.10.1989
ClassificationIPC:H01L21/48, H05K3/06, C04B41/51
[1988/19]
CPC:
H05K3/246 (EP,US); H05K1/00 (KR); C03C17/40 (EP,US);
C04B41/5111 (EP,US); C04B41/88 (EP,US); H01L21/4846 (EP,US);
H01L21/4867 (EP,US); H01L23/49866 (EP,US); H01L2924/0002 (EP,US);
H01L2924/3011 (EP,US); H05K1/092 (EP,US); H05K2203/121 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1988/19]
TitleGerman:Metallisierte Substrate und deren Herstellungsverfahren[1988/19]
English:Metallized substrates and process for their production[1988/19]
French:Substrats métallisés et procédé pour leur fabrication[1988/19]
File destroyed:12.06.1999
Examination procedure21.05.1990Examination requested  [1990/29]
13.02.1992Despatch of a communication from the examining division (Time limit: M04)
24.06.1992Application deemed to be withdrawn, date of legal effect  [1992/51]
22.07.1992Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1992/51]
Fees paidRenewal fee
11.07.1989Renewal fee patent year 03
03.07.1990Renewal fee patent year 04
26.06.1991Renewal fee patent year 05
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Documents cited:Search[Y]JP61089655  ;
 [X]FR2411491  (BALTRUSHAITIS VALENTINAS [SU]);
 [A]GB1527108  (WESTERN ELECTRIC CO)
 [YD]  - IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. SC-5, no. 6, December 1970, pages 292-303; M. CAULTON et al.: "Microwave Integrated-Circuit Technology-A Survey"
 [Y]  - PATENT ABSTRACTS OF JAPAN, vol. 10, no. 263 (E-435)(2319), 9 September 1986; & JP-A-61 089 655 (FUJI XEROX CO. LTD.) 07.05.1986, & JP61089655 A 19860909
 [Y]  - PHILIPS TECHNISCHE RUNDSCHAU, vol. 35, no. 5, 1975/76, pages 156-162; W. FUNK: "Dickschichttechnologie"
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.