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Extract from the Register of European Patents

EP About this file: EP0281704

EP0281704 - Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.01.1995
Database last updated on 20.12.2024
Most recent event   Tooltip12.01.1995No opposition filed within time limitpublished on 01.03.1995 [1995/09]
Applicant(s)For all designated states
Sheldahl, Inc.
1150 Sheldahl Road Northfield
Minnesota 55057 / US
[N/P]
Former [1988/37]For all designated states
Sheldahl, Inc.
1150 Sheldahl Road
Northfield Minnesota 55057 / US
Inventor(s)01 / Gilleo, Kenneth B.
806 Highland
Northfield Minnesota 55057 / US
02 / Tibesar, Marion A.
207 North Poplar Street
Northfield Minnesota 55057 / US
03 / Chabot, Stephen E.
108 Chaparral Drive
Apple Valle Minnesota 55124 / US
[1988/37]
Representative(s)MacGregor, Gordon, et al
Eric Potter Clarkson LLP Park View House 58 The Ropewalk
Nottingham NG1 5DD / GB
[N/P]
Former [1988/37]MacGregor, Gordon, et al
ERIC POTTER CLARKSON St. Mary's Court St. Mary's Gate
Nottingham, NG1 1LE / GB
Application number, filing date87308968.409.10.1987
[1988/37]
Priority number, dateUS1987005852005.06.1987         Original published format: US 58520
US1987001262409.02.1987         Original published format: US 12624
[1988/37]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0281704
Date:14.09.1988
Language:EN
[1988/37]
Type: A3 Search report 
No.:EP0281704
Date:29.11.1989
Language:EN
[1989/48]
Type: B1 Patent specification 
No.:EP0281704
Date:09.03.1994
Language:EN
[1994/10]
Search report(s)(Supplementary) European search report - dispatched on:EP11.10.1989
ClassificationIPC:H05K3/42, H05K3/46, H05K3/12, H05K3/10
[1988/37]
CPC:
H05K3/4053 (EP,US); B41F15/0854 (EP,US); H05K3/1233 (EP,US);
H05K1/0393 (EP,US); H05K1/095 (EP,US); H05K2201/0347 (EP,US);
H05K2201/09981 (EP,US); H05K2203/082 (EP,US); H05K3/4069 (EP,US);
H05K3/4664 (EP,US); Y10T29/49165 (EP,US) (-)
Designated contracting statesDE,   FR,   GB,   IT [1988/37]
TitleGerman:Verfahren und Vorrichtung zur Herstellung von leitfähigen siebgedruckten Durchleitlöchern unter Verwendung von metallisch plattierten Dickpolymerfilmen[1988/37]
English:Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films[1988/37]
French:Procédé et dispositif de fabrication de trous conducteurs sérigraphiés par utilisation de films polyméres épais métallisés[1988/37]
Examination procedure17.11.1989Examination requested  [1990/02]
22.07.1992Despatch of a communication from the examining division (Time limit: M06)
15.12.1992Reply to a communication from the examining division
04.05.1993Despatch of communication of intention to grant (Approval: Yes)
16.08.1993Communication of intention to grant the patent
29.10.1993Fee for grant paid
29.10.1993Fee for publishing/printing paid
Opposition(s)10.12.1994No opposition filed within time limit [1995/09]
Fees paidRenewal fee
09.10.1989Renewal fee patent year 03
30.10.1990Renewal fee patent year 04
10.10.1991Renewal fee patent year 05
09.10.1992Renewal fee patent year 06
11.10.1993Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]GB2030007  (ROGERS CORP);
 [A]GB2143473  (INT STANDARD ELECTRIC CORP);
 [A]US3741116  (GREEN M, et al);
 [A]EP0194247  (SVECIA SILKSCREEN MASKINER AB [SE]);
 [A]GB2078448  (STANDARD TELEPHONES CABLES LTD);
 [A]WO8200938  (SERRAS PAULET EDOUARD [FR])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.