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EP0273725
European procedure
Extract from the Register of European Patents
EP About this file: EP0273725
| EP0273725 - Encapsulated semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 01.04.1994 Database last updated on 31.08.2024 | Most recent event Tooltip | 01.04.1994 | No opposition filed within time limit | published on 25.05.1994 [1994/21] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 72, Horikawa-cho, Saiwai-ku Kawasaki-shi Kanagawa-ken 210-8572 / JP | [N/P] |
| Former [1988/27] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP | Inventor(s) | 01 /
Yamaji, Yasuhiro c/o Patent Division Toshiba Corporation Principal Office 1-1, Shibaura 1-chome Minato-ku Tokyo / JP | 02 /
Takahashi, Kenji c/o Patent Division Toshiba Corporation Principal Office 1-1, Shibaura 1-chome Minato-ku Tokyo / JP | 03 /
Hirata, Seiichi c/o Patent Division Toshiba Corporation Principal Office 1-1, Shibaura 1-chome Minato-ku Tokyo / JP | 04 /
Sakurai, Toshiharu c/o Patent Division Toshiba Corporation Principal Office 1-1, Shibaura 1-chome Minato-ku Tokyo / JP | [1988/27] | Representative(s) | Freed, Arthur Woolf, et al Marks & Clerk Incorporating Edward Evans Barker 90 Long Acre London WC2E 9RA / GB | [N/P] |
| Former [1992/01] | Freed, Arthur Woolf, et al MARKS & CLERK, 57-60 Lincoln's Inn Fields London WC2A 3LS / GB | ||
| Former [1988/27] | Sturt, Clifford Mark MARKS & CLERK 57-60 Lincoln's Inn Fields London WC2A 3LS / GB | Application number, filing date | 87311419.3 | 23.12.1987 | [1988/27] | Priority number, date | JP19860313754 | 26.12.1986 Original published format: JP 31375486 | [1988/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0273725 | Date: | 06.07.1988 | Language: | EN | [1988/27] | Type: | A3 Search report | No.: | EP0273725 | Date: | 31.08.1988 | Language: | EN | [1988/35] | Type: | B1 Patent specification | No.: | EP0273725 | Date: | 02.06.1993 | Language: | EN | [1993/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.07.1988 | Classification | IPC: | H01L23/31, H01L23/495 | [1993/22] | CPC: |
H01L23/3107 (EP,US);
H01L23/49541 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/181, H01L2924/00012 (US,EP) |
| Former IPC [1988/27] | H01L23/30, H01L23/48 | Designated contracting states | DE, FR, GB [1988/27] | Title | German: | Umhüllte Halbleiteranordnung | [1988/27] | English: | Encapsulated semiconductor device | [1988/27] | French: | Dispositif semi-conducteur encapsulé | [1988/27] | Examination procedure | 06.01.1988 | Examination requested [1988/27] | 11.05.1992 | Despatch of communication of intention to grant (Approval: Yes) | 02.10.1992 | Communication of intention to grant the patent | 07.01.1993 | Fee for grant paid | 07.01.1993 | Fee for publishing/printing paid | Opposition(s) | 03.03.1994 | No opposition filed within time limit [1994/21] | Fees paid | Renewal fee | 18.12.1989 | Renewal fee patent year 03 | 11.12.1990 | Renewal fee patent year 04 | 09.12.1991 | Renewal fee patent year 05 | 09.10.1992 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP61184855 ; | [A]JP61166052 ; | [A]JP61191055 | [A] - 23RD ANNUAL PROCEEDINGS OF RELIABILITY PHYSICS 1985, Orlando, Florida, 26th-28th March 1985, pages 192-197, IEEE, New York, US, I. FUKUZAWA et al.: "Moisture resistance degradation of plastic LSIs by reflow soldering" | [A] - PATENT ABSTRACTS OF JAPAN, vol. 11, no. 7 (E-469)[2454], 9th January 1987; & JP-A-61 184 855 (OKI ELECTRIC CO. LTD) 18-08-1986, & JP61184855 A 00000000 | [A] - PATENT ABSTRACTS OF JAPAN, vol. 10, no. 370 (E-463)[2427], 10th December 1986; & JP-A-61 166 052 (HITACHI LTD) 26-07-1986, & JP61166052 A 00000000 | [A] - PATENT ABSTRACTS OF JAPAN, vol. 11, no. 20 (E-472)[2467], 20th January 1987; & JP-A-61 191 055 (TOSHIBA CORP.) 25-08-1986, & JP61191055 A 00000000 |