Deutsch English Français

Contact

EP0245179

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

Latvia joins the Federated Register
Click here for more information on the Federated Register.

2025-04-16

More...

Extract from the Register of European Patents

EP About this file: EP0245179

EP0245179 - System for detachably mounting semiconductors on conductor substrate. [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 04.11.1993 Database last updated on 09.05.2025
Most recent event Tooltip	28.11.2003	Lapse of the patent in a contracting state New state(s): ES	published on 14.01.2004 [2004/03]
Applicant(s)	For all designated states DIGITAL EQUIPMENT CORPORATION 146 Main Street Maynard, MA 01754 / US
	[1987/46]
Inventor(s)	01 / Lee, James C.K. 28446 Christopher Lane Los Altos Hills California 94022 / US
	02 / Amdahl, Gene M. 165 Patricia Avenue Atherton California 94025 / US
	03 / Beck, Richard 10182 Parish Place Cupertino California 95014 / US
	04 / Lee, Chune 1836 Cabrillo Street San Francisco California 94121 / US
	05 / Hu, Edward 648 Kodiak Court =4 Sunnyvale California 94087 / US
	[1987/46]
Representative(s)	Mongrédien, André, et al c/o SOCIETE DE PROTECTION DES INVENTIONS 25, rue de Ponthieu F-75008 Paris / FR
	[1987/46]
Application number, filing date	87401034.1	06.05.1987
	[1987/46]
Priority number, date	US19860860725	07.05.1986 Original published format: US 860725
	[1987/46]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0245179
	Date:	11.11.1987
	Language:	EN
	[1987/46]
	Type:	A3 Search report
	No.:	EP0245179
	Date:	05.10.1988
	Language:	EN
	[1988/40]
	Type:	B1 Patent specification
	No.:	EP0245179
	Date:	30.12.1992
	Language:	EN
	[1992/53]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	16.08.1988
Classification	IPC:	H01L23/48, H01L23/50, H01L23/32	[1988/38]
	CPC:	H01L23/4006 (EP); H01L23/32 (EP); H01L23/49827 (EP); H01L2023/4043 (EP); H01L2023/4056 (EP); H01L2023/4062 (EP); (+) H01L2023/4068 (EP); H01L2924/0002 (EP); H01L2924/15312 (EP); H01L2924/16152 (EP) (-)
	C-Set:	H01L2924/0002, H01L2924/00 (EP)
	Former IPC [1987/46]	H01L23/32, H01L23/48
Designated contracting states	AT, BE, CH, DE, ES, FR, GB, GR, IT, LI, LU, NL, SE [1987/46]
Title	German:	Lösbares Montierungssystem für Halbleiter auf einem leitenden Substrat	[1987/46]
	English:	System for detachably mounting semiconductors on conductor substrate.	[1987/46]
	French:	Système de montage amovible pour semi-conducteurs sur un substrat conducteur	[1987/46]
Examination procedure	14.02.1989	Examination requested [1989/15]
	08.10.1990	Despatch of a communication from the examining division (Time limit: M06)
	10.04.1991	Reply to a communication from the examining division
	30.04.1991	Despatch of a communication from the examining division (Time limit: M06)
	31.10.1991	Reply to a communication from the examining division
	26.02.1992	Despatch of communication of intention to grant (Approval: Yes)
	24.06.1992	Communication of intention to grant the patent
	28.08.1992	Fee for grant paid
	28.08.1992	Fee for publishing/printing paid
Opposition(s)	01.10.1993	No opposition filed within time limit [1993/51]
Fees paid	Renewal fee
	18.05.1989	Renewal fee patent year 03
	30.04.1990	Renewal fee patent year 04
	31.12.1990	Renewal fee patent year 05
	15.04.1992	Renewal fee patent year 06
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	06.06.1987	AT M02 Fee paid on 24.07.1987
	06.06.1987	ES M02 Fee paid on 24.07.1987
	06.06.1987	GR M02 Fee paid on 24.07.1987
	06.06.1987	LU M02 Fee paid on 24.07.1987
	06.06.1987	SE M02 Fee paid on 24.07.1987
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition Tooltip	AT	30.12.1992
	BE	30.12.1992
	CH	30.12.1992
	GR	30.12.1992
	LI	30.12.1992
	NL	30.12.1992
	SE	30.12.1992
	ES	10.04.1993
	[2004/03]
Former [2000/04]	AT	30.12.1992
	BE	30.12.1992
	CH	30.12.1992
	GR	30.12.1992
	LI	30.12.1992
	NL	30.12.1992
	SE	30.12.1992
Former [1994/25]	AT	30.12.1992
	BE	30.12.1992
	CH	30.12.1992
	LI	30.12.1992
	NL	30.12.1992
	SE	30.12.1992
Former [1993/38]	BE	30.12.1992
	CH	30.12.1992
	LI	30.12.1992
	NL	30.12.1992
	SE	30.12.1992
Former [1993/28]	CH	30.12.1992
	LI	30.12.1992
	SE	30.12.1992
Former [1993/27]	CH	30.12.1992
	LI	30.12.1992
Documents cited:	Search	[Y]WO8500467 (SILICON CONNECTION INC [US]);
		[E]US4667219 (LEE JAMES C K [US], et al)

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.32; 35p