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Extract from the Register of European Patents

EP About this file: EP0263788

EP0263788 - Process and apparatus for depositing hydrogenated amorphous silicon on a substrate in a plasma environment [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.07.1992
Database last updated on 31.08.2024
Most recent event   Tooltip23.11.2007Lapse of the patent in a contracting state
New state(s): ES
published on 26.12.2007  [2007/52]
Applicant(s)For all designated states
INSTITUT DE MICROTECHNIQUE
Université de Neuchâtel 2, rue Bréguet
CH-2000 Neuchâtel / CH
[1988/15]
Inventor(s)01 / Curtins, Hermann
Giessen 165
CH-3236 Gampelen / CH
[1988/15]
Representative(s)Nithardt, Roland
Cabinet Moser & Cie
C/o Cabinet Roland Nithardt
Y-Parc/Chemin de la Sallaz
1400 Yverdon-les-Bains / CH
[N/P]
Former [1988/15]Nithardt, Roland
Cabinet Moser & Cie, c/o Cabinet Roland Nithardt, Y-Parc/Chemin de la Sallaz
CH-1400 Yverdon-les-Bains / CH
Application number, filing date87810548.523.09.1987
[1988/15]
Priority number, dateCH1986000386826.09.1986         Original published format: CH 386886
[1988/15]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP0263788
Date:13.04.1988
Language:FR
[1988/15]
Type: B1 Patent specification 
No.:EP0263788
Date:28.08.1991
Language:FR
[1991/35]
Search report(s)(Supplementary) European search report - dispatched on:EP16.02.1988
ClassificationIPC:C23C16/50, C23C16/22
[1988/15]
CPC:
C23C16/5096 (EP,US); C23C16/22 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   NL,   SE [1988/15]
TitleGerman:Verfahren und Vorrichtung zum Auftragen von hydriertem, amorphem Silizium auf ein Substrat in Plasmaumgebung[1988/15]
English:Process and apparatus for depositing hydrogenated amorphous silicon on a substrate in a plasma environment[1988/15]
French:Procédé et installation de dépôt de silicium amorphe hydrogène sur un substrat dans une enceinte à plasma[1988/15]
Examination procedure30.09.1988Examination requested  [1988/48]
06.12.1990Despatch of communication of intention to grant (Approval: Yes)
12.02.1991Communication of intention to grant the patent
23.04.1991Fee for grant paid
23.04.1991Fee for publishing/printing paid
Opposition(s)30.05.1992No opposition filed within time limit [1992/34]
Fees paidRenewal fee
29.09.1989Renewal fee patent year 03
28.09.1990Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT28.08.1991
GB28.08.1991
GR28.08.1991
IT28.08.1991
NL28.08.1991
SE28.08.1991
LU30.09.1991
ES09.12.1991
[2004/03]
Former [2000/04]AT28.08.1991
GB28.08.1991
GR28.08.1991
IT28.08.1991
NL28.08.1991
SE28.08.1991
LU30.09.1991
Former [1999/52]AT28.08.1991
GB28.08.1991
IT28.08.1991
NL28.08.1991
SE28.08.1991
LU30.09.1991
Former [1999/42]AT28.08.1991
GB28.08.1991
IT28.08.1991
NL28.08.1991
SE28.08.1991
Former [1992/34]AT28.08.1991
GB28.08.1991
NL28.08.1991
SE28.08.1991
Former [1992/15]AT28.08.1991
NL28.08.1991
SE28.08.1991
Former [1992/13]SE28.08.1991
Documents cited:Search[A]US4226898  (OVSHINSKY STANFORD R [US], et al);
 [A]US4406765  (HIGASHI AKIO [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.