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EP0283844
European procedure
Extract from the Register of European Patents
EP About this file: EP0283844
| EP0283844 - Conductive resin composition and molded product using the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 10.09.1994 Database last updated on 14.11.2024 | Most recent event Tooltip | 10.09.1994 | No opposition filed within time limit | published on 02.11.1994 [1994/44] | Applicant(s) | For all designated states Toshiba Chemical Corporation 3-9, 3-chome, Shimbashi Minato-ku Tokyo / JP | [N/P] |
| Former [1988/39] | For all designated states Toshiba Chemical Corporation 3-9, 3-chome, Shimbashi Minato-ku Tokyo / JP | Inventor(s) | 01 /
Iwase, Hidehiro 1-21-20,Kamiigusa Suginami-ku Tokyo / JP | 02 /
Habata, Keiichi Toshiba Chemical K.K. Kawaguchi-Ryo 3-19-28, Ryoke Kawaguchi-shi Saitama-ken / JP | [1988/39] | Representative(s) | Henkel & Partner mbB Patentanwaltskanzlei, Rechtsanwaltskanzlei Maximiliansplatz 21 80333 München / DE | [N/P] |
| Former [1988/39] | Henkel, Feiler, Hänzel & Partner Möhlstrasse 37 D-81675 München / DE | Application number, filing date | 88103649.5 | 08.03.1988 | [1988/39] | Priority number, date | JP19870051998 | 09.03.1987 Original published format: JP 5199887 | JP19870051999 | 09.03.1987 Original published format: JP 5199987 | JP19870058880 | 16.03.1987 Original published format: JP 5888087 | JP19870068779 | 25.03.1987 Original published format: JP 6877987 | JP19870071568 | 27.03.1987 Original published format: JP 7156887 | JP19870071570 | 27.03.1987 Original published format: JP 7157087 | JP19870083917 | 07.04.1987 Original published format: JP 8391787 | [1988/39] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0283844 | Date: | 28.09.1988 | Language: | EN | [1988/39] | Type: | B1 Patent specification | No.: | EP0283844 | Date: | 10.11.1993 | Language: | EN | [1993/45] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.08.1988 | Classification | IPC: | G21F1/12, H05K9/00, D04H1/00, D04H1/42, H01B1/22 | [1993/45] | CPC: |
H05K9/009 (EP,US);
H01B1/00 (KR);
B29B11/16 (KR);
B29B9/14 (EP);
D04H1/42 (EP,US);
G21F1/125 (EP,US);
H01B1/22 (EP,US);
Y10T428/2907 (EP,US);
Y10T428/294 (EP,US);
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| Former IPC [1988/39] | G21F1/12, B32B5/08, B32B15/02, B32B15/14, B32B17/02, B32B25/02, H05K9/00 | Designated contracting states | DE, FR, GB [1988/39] | Title | German: | Leitende Harzkomposition und daraus geformtes Produkt | [1988/39] | English: | Conductive resin composition and molded product using the same | [1988/39] | French: | Composition de résine conductive et produit moulé avec la même matière | [1988/39] | Examination procedure | 05.04.1988 | Examination requested [1988/39] | 03.09.1990 | Despatch of a communication from the examining division (Time limit: M04) | 09.01.1991 | Reply to a communication from the examining division | 18.02.1991 | Despatch of a communication from the examining division (Time limit: M06) | 22.08.1991 | Reply to a communication from the examining division | 24.01.1992 | Despatch of a communication from the examining division (Time limit: M06) | 27.07.1992 | Reply to a communication from the examining division | 11.02.1993 | Despatch of communication of intention to grant (Approval: Yes) | 07.05.1993 | Communication of intention to grant the patent | 05.08.1993 | Fee for grant paid | 05.08.1993 | Fee for publishing/printing paid | Opposition(s) | 11.08.1994 | No opposition filed within time limit [1994/44] | Fees paid | Renewal fee | 28.03.1990 | Renewal fee patent year 03 | 27.03.1991 | Renewal fee patent year 04 | 30.03.1992 | Renewal fee patent year 05 | 30.03.1993 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | DE2154749 [ ]; | GB2095042 [ ] (WESTINGHOUSE ELECTRIC CORP); | EP0083723 [ ] (SHOWA DENKO KK [JP]); | US4533685 [ ] (HUDGIN DONALD E [US], et al) |