-
EP0294190
European procedure
Extract from the Register of European Patents
EP About this file: EP0294190
| EP0294190 - A resin sealed semiconductor device and a method for making the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 18.11.1995 Database last updated on 16.11.2024 | Most recent event Tooltip | 18.11.1995 | No opposition filed within time limit | published on 10.01.1996 [1996/02] | Applicant(s) | For all designated states NIPPONDENSO CO., LTD. 1-1, Showa-cho Kariya-shi Aichi-ken / JP | [N/P] |
| Former [1988/49] | For all designated states NIPPONDENSO CO., LTD. 1-1, Showa-cho Kariya-shi Aichi-ken / JP | Inventor(s) | 01 /
Shibata, Hiroshi 3-105, Taisho-cho Kariya-shi Aichi / JP | 02 /
Maehara, Fuyuki 5-33-1, Tenno-cho Kariya-shi Aichi / JP | 03 /
Shintai, Akira 1-20-275, Minamikasuya Chita-shi Aichi / JP | 04 /
Kato, Hidetoshi 1541-30, Hanagawa-cho Suzuka-shi Mie / JP | [1988/49] | Representative(s) | Dempster, Benjamin John Naftel, et al Withers & Rogers LLP 4 More London Riverside London SE1 2AU / GB | [N/P] |
| Former [1992/23] | Dempster, Benjamin John Naftel, et al Withers & Rogers 4 Dyer's Buildings, Holborn London EC1N 2JT / GB | ||
| Former [1988/49] | Hartley, David Withers & Rogers 4 Dyer's Buildings Holborn London, EC1N 2JT / GB | Application number, filing date | 88305024.7 | 02.06.1988 | [1988/49] | Priority number, date | JP19870142043 | 05.06.1987 Original published format: JP 14204387 | JP19880108520 | 30.04.1988 Original published format: JP 10852088 | [1988/49] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0294190 | Date: | 07.12.1988 | Language: | EN | [1988/49] | Type: | A3 Search report | No.: | EP0294190 | Date: | 14.11.1990 | Language: | EN | [1990/46] | Type: | B1 Patent specification | No.: | EP0294190 | Date: | 18.01.1995 | Language: | EN | [1995/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.09.1990 | Classification | IPC: | H01L23/29, H01L23/10, H02J7/26 | [1995/03] | CPC: |
H01L23/02 (KR);
H01L23/04 (KR);
H01L23/49541 (EP,US);
H01L25/0655 (EP,US);
H02J7/24 (EP,US);
H01L2924/0002 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [1988/49] | H01L23/30, H01L23/10, H02J7/26 | Designated contracting states | DE, FR, GB, IT [1988/49] | Title | German: | Mit Harz eingekapselte Halbleiteranordnung und Verfahren zu deren Herstellung | [1988/49] | English: | A resin sealed semiconductor device and a method for making the same | [1988/49] | French: | Dispositif semi-conducteur capsulé en résine et son procédé de fabrication | [1988/49] | Examination procedure | 10.05.1991 | Examination requested [1991/38] | 23.09.1992 | Despatch of a communication from the examining division (Time limit: M06) | 02.04.1993 | Reply to a communication from the examining division | 19.08.1993 | Despatch of a communication from the examining division (Time limit: M04) | 10.12.1993 | Reply to a communication from the examining division | 11.03.1994 | Despatch of communication of intention to grant (Approval: Yes) | 21.07.1994 | Communication of intention to grant the patent | 19.10.1994 | Fee for grant paid | 19.10.1994 | Fee for publishing/printing paid | Opposition(s) | 19.10.1995 | No opposition filed within time limit [1996/02] | Fees paid | Renewal fee | 12.06.1990 | Renewal fee patent year 03 | 17.06.1991 | Renewal fee patent year 04 | 09.06.1992 | Renewal fee patent year 05 | 14.06.1993 | Renewal fee patent year 06 | 11.06.1994 | Renewal fee patent year 07 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP60065555 ; | [A]JP58025250 ; | [Y]FR2514962 (BOSCH GMBH ROBERT [DE]); | [Y]EP0206771 (TOSHIBA KK [JP]); | [Y]DE3019239 (SIEMENS AG [DE]); | [A]US4092487 (IMAI TAKESHI); | [A]EP0093029 (DUCELLIER & CIE [FR]); | [A]US4530003 (BLAIR KELVIN R [US], et al) | [A] - PATENT ABSTRACTS OF JAPAN vol. 9, no. 201 (E-336)(1924) 17 August 1985, & JP-A-60 065 555 (TOSHIBA) 15 April 1985, & JP60065555 A 19850415 | [A] - PATENT ABSTRACTS OF JAPAN vol. 7, no. 103 (E-173)(1248) 06 May 1983, & JP-A-58 025 250 (HITACHI) 15 February 1983, & JP58025250 A 19830215 |