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EP0321067
European procedure
Extract from the Register of European Patents
EP About this file: EP0321067
| EP0321067 - Process for treating copper surface [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.07.1993 Database last updated on 21.03.2026 | Most recent event Tooltip | 24.07.1993 | No opposition filed within time limit | published on 15.09.1993 [1993/37] | Applicant(s) | For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 160 / JP | [N/P] |
| Former [1990/33] | For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 160 / JP | ||
| Former [1989/25] | For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 160 / JP | Inventor(s) | 01 /
Nakaso, Akishi 29-29, Otome-1-chome Oyama-shi / JP | 02 /
Okamura, Toshiro 1622-81, Tamado Shimodate-shi / JP | 03 /
Watanabe, Tomoko 1312, Tomobe Iwasemachi Nishiibaraki-gun Ibaraki-ken / JP | [1989/25] | Representative(s) | Cresswell, Thomas Anthony, et al J.A. Kemp & Co. 14 South Square Gray's Inn London WC1R 5JJ / GB | [N/P] |
| Former [1989/25] | Cresswell, Thomas Anthony, et al J.A. KEMP & CO. 14 South Square Gray's Inn London WC1R 5LX / GB | Application number, filing date | 88306625.0 | 20.07.1988 | [1989/25] | Priority number, date | JP19870315750 | 14.12.1987 Original published format: JP 31575087 | [1989/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0321067 | Date: | 21.06.1989 | Language: | EN | [1989/25] | Type: | B1 Patent specification | No.: | EP0321067 | Date: | 23.09.1992 | Language: | EN | [1992/39] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 16.03.1989 | Classification | IPC: | C23C18/40, B32B27/04, B32B15/08, H05K3/38 | [1989/25] | CPC: |
B32B15/04 (EP,US);
C23F1/00 (KR);
B32B15/14 (US);
B32B15/08 (US);
B32B15/092 (US);
B32B15/098 (US);
B32B15/12 (US);
B32B15/20 (US);
B32B27/281 (US);
B32B27/38 (US);
B32B27/42 (US);
C23C18/40 (EP,KR,US);
C23C22/63 (EP,US);
C23C22/83 (EP,US);
H05K3/022 (EP,US);
H05K3/385 (EP,US);
H05K3/4652 (EP,US);
B32B2311/12 (US);
B32B2457/08 (US);
H05K1/0366 (EP,US);
H05K1/0393 (EP,US);
H05K2201/0355 (EP,US);
H05K2203/0315 (EP,US);
H05K2203/1157 (EP,US);
H05K3/281 (EP,US);
H05K3/427 (EP,US);
Y10S428/901 (EP,US);
| Designated contracting states | DE, FR, GB, IT, NL [1989/25] | Title | German: | Verfahren zur Behandlung einer Kupferoberfläche | [1989/25] | English: | Process for treating copper surface | [1989/25] | French: | Procédé de traitement d'une surface de cuivre | [1989/25] | Examination procedure | 16.08.1989 | Examination requested [1989/41] | 28.12.1990 | Despatch of a communication from the examining division (Time limit: M04) | 18.04.1991 | Reply to a communication from the examining division | 22.11.1991 | Despatch of communication of intention to grant (Approval: Yes) | 18.02.1992 | Communication of intention to grant the patent | 07.05.1992 | Fee for grant paid | 07.05.1992 | Fee for publishing/printing paid | Opposition(s) | 24.06.1993 | No opposition filed within time limit [1993/37] | Fees paid | Renewal fee | 17.07.1990 | Renewal fee patent year 03 | 13.07.1991 | Renewal fee patent year 04 | 09.07.1992 | Renewal fee patent year 05 |
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