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EP0323856
European procedure
Extract from the Register of European Patents
EP About this file: EP0323856
| EP0323856 - Substrate structure for composite semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 09.04.1998 Database last updated on 02.11.2024 | Most recent event Tooltip | 09.04.1998 | No opposition filed within time limit | published on 27.05.1998 [1998/22] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 72, Horikawa-cho, Saiwai-ku Kawasaki-shi Kanagawa-ken 210-8572 / JP | [N/P] |
| Former [1989/28] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP | Inventor(s) | 01 /
Kitahara, Koichi c/o Patent Division Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome Minato-ku Tokyo 105 / JP | 02 /
Natsume, Yoshinori c/o Patent Division Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome Minato-ku Tokyo 105 / JP | 03 /
Hosoki, Yoshinori c/o Patent Division Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome Minato-ku Tokyo 105 / JP | [1989/28] | Representative(s) | Henkel & Partner mbB Patentanwaltskanzlei, Rechtsanwaltskanzlei Maximiliansplatz 21 80333 München / DE | [N/P] |
| Former [1989/28] | Henkel, Feiler, Hänzel & Partner Möhlstrasse 37 D-81675 München / DE | Application number, filing date | 89100183.6 | 05.01.1989 | [1989/28] | Priority number, date | JP19880000465 | 05.01.1988 Original published format: JP 46588 | [1989/28] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0323856 | Date: | 12.07.1989 | Language: | EN | [1989/28] | Type: | A3 Search report | No.: | EP0323856 | Date: | 20.02.1991 | Language: | EN | [1991/08] | Type: | B1 Patent specification | No.: | EP0323856 | Date: | 04.06.1997 | Language: | EN | [1997/23] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 03.01.1991 | Classification | IPC: | H01L21/76 | [1989/28] | CPC: |
H01L21/762 (EP,US);
H01L21/30 (KR);
H01L21/76264 (EP,US);
H01L21/76275 (EP,US);
H01L21/76286 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1989/28] | Title | German: | Substratsstruktur für zusammengesetztes Halbleiterbauelement | [1989/28] | English: | Substrate structure for composite semiconductor device | [1989/28] | French: | Structure de substrat pour dispositif à semi-conducteur composite | [1989/28] | Examination procedure | 02.02.1989 | Examination requested [1989/28] | 09.05.1994 | Despatch of a communication from the examining division (Time limit: M06) | 28.09.1994 | Reply to a communication from the examining division | 30.12.1994 | Despatch of a communication from the examining division (Time limit: M06) | 20.06.1995 | Reply to a communication from the examining division | 28.08.1995 | Despatch of a communication from the examining division (Time limit: M06) | 07.03.1996 | Reply to a communication from the examining division | 26.07.1996 | Despatch of communication of intention to grant (Approval: Yes) | 09.12.1996 | Communication of intention to grant the patent | 19.03.1997 | Fee for grant paid | 19.03.1997 | Fee for publishing/printing paid | Opposition(s) | 05.03.1998 | No opposition filed within time limit [1998/22] | Fees paid | Renewal fee | 17.12.1990 | Renewal fee patent year 03 | 10.01.1992 | Renewal fee patent year 04 | 15.01.1993 | Renewal fee patent year 05 | 11.01.1994 | Renewal fee patent year 06 | 10.01.1995 | Renewal fee patent year 07 | 10.01.1996 | Renewal fee patent year 08 | 08.01.1997 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]EP0031260 (THOMSON CSF [FR]); | [Y]EP0156964 (MOTOROLA INC [US]) | [Y] - PROCEEDINGS OF THE IEEE 1987 CUSTOM INTEGRATED CIRCUITS CONFERENCE. 4-7 May 1987, pages 443-446, Portland, Oregon, US; Y. OHATA et al.: "Dielectrically isolated intelligent power switch" | Examination | EP0217288 |