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Extract from the Register of European Patents

EP About this file: EP0350593

EP0350593 - Electronic package with heat spreader member [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  14.06.1996
Database last updated on 25.09.2024
Most recent event   Tooltip28.12.2002Lapse of the patent in a contracting state
New state(s): NL		published on 12.02.2003  [2003/07]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1990/03]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Anschel, Morris
4612 Salem Drive
Binghamton New York 13903 / US
02 / Sammakia, Bahgat Ghaleb
834 Oakdale Rd.
Johnson City New York 13790 / US
[1990/03]
Representative(s)Schäfer, Wolfgang
IBM Deutschland
Informationssysteme GmbH
Patentwesen und Urheberrecht
70548 Stuttgart / DE
[N/P]
Former [1994/37]Schäfer, Wolfgang, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1990/03]Klocke, Peter, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht Pascalstrasse 100
D-70569 Stuttgart / DE
Application number, filing date89108688.613.05.1989
[1990/03]
Priority number, dateUS1988021872513.07.1988         Original published format: US 218725
[1990/03]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0350593
Date:17.01.1990
Language:EN
[1990/03]
Type: A3 Search report 
No.:EP0350593
Date:05.12.1990
Language:EN
[1990/49]
Type: B1 Patent specification 
No.:EP0350593
Date:09.08.1995
Language:EN
[1995/32]
Search report(s)(Supplementary) European search report - dispatched on:EP16.10.1990
ClassificationIPC:H01L23/36, H01L23/42
[1990/48]
CPC:
H01L23/3735 (EP,US); H01L23/3675 (EP,US); H01L23/3737 (EP,US);
H01L23/433 (EP,US); H01L2924/16152 (EP,US)
Former IPC [1990/03]H01L23/36
Designated contracting statesAT,   CH,   DE,   ES,   FR,   GB,   IT,   LI,   NL,   SE [1990/03]
TitleGerman:Elektronische Vorrichtung mit Wärmeverteilungskörper[1990/03]
English:Electronic package with heat spreader member[1990/03]
French:Ensemble électronique avec corps dissipateur de chaleur[1990/03]
Examination procedure12.05.1990Examination requested  [1990/28]
04.12.1992Despatch of a communication from the examining division (Time limit: M06)
03.06.1993Reply to a communication from the examining division
29.10.1993Despatch of a communication from the examining division (Time limit: M04)
11.02.1994Reply to a communication from the examining division
18.07.1994Despatch of communication of intention to grant (Approval: Yes)
07.11.1994Communication of intention to grant the patent
10.11.1994Fee for grant paid
10.11.1994Fee for publishing/printing paid
Opposition(s)10.05.1996No opposition filed within time limit [1996/31]
Fees paidRenewal fee
13.12.1990Renewal fee patent year 03
21.05.1992Renewal fee patent year 04
19.05.1993Renewal fee patent year 05
19.05.1994Renewal fee patent year 06
19.05.1995Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT09.08.1995
CH09.08.1995
ES09.08.1995
LI09.08.1995
NL09.08.1995
SE09.11.1995
[2003/07]
Former [2002/24]AT09.08.1995
CH09.08.1995
ES09.08.1995
LI09.08.1995
SE09.11.1995
Former [1997/13]AT09.08.1995
CH09.08.1995
LI09.08.1995
SE09.11.1995
Former [1996/14]AT09.08.1995
SE09.11.1995
Documents cited:Search[Y]JP60062141  ;
 [Y]JP61134045  ;
 [Y]JP61168946  ;
 [A]JP60143653  ;
 [A]JP61145266  ;
 [X]FR2555812  (NEC CORP [JP])
 [Y]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 30, no. 10, March 1988, NEW YORK US pages 310 - 311; "Thermal enhancement and mechanical protection cover"
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 9, no. 193 (E-334)(1916) 09 August 1985, & JP-A-60 062 141 (HITACHI SEISAKUSHO) 10 April 1985, & JP60062141 A 19850410
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 10, no. 329 (E-452)(2385) 08 November 1986, & JP-A-61 134 045 (NEC CORPORATION) 21 June 1986, & JP61134045 A 19860621
 [Y]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 24, no. 1A, June 1981, NEW YORK US page 14 W.A.Campo et al.: "Heat spreader with thermal grease"
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 10, no. 376 (E-464)(2433) 13 December 1986, & JP-A-61 168 946 (HITACHI) 30 July 1986, & JP61168946 A 19860730
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 20, no. 4, September 1977, NEW YORK US page 1433 V.Y.DOO et al.: "Controlled gap in semiconductor packages"
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 9, no. 305 (E-363)(2028) 03 December 1985, & JP-A-60 143 653 (HITACHI SEISAKUSHO) 29 July 1985, & JP60143653 A 19850729
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 10, no. 339 (C-385)(2395) 15 November 1986, & JP-A-61 145 266 (SUMITOMO ELECTRIC IND) 02 July 1986, & JP61145266 A 19860702
 [XP]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 31, no. 3, August 1988, NEW YORK US pages 451 - 452; "Low-cost,high-power,multi-chip module design"
Examination   - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 30, no. 10, March 1988, New York, US, pp. 310-311; "Thermal enhancement and mechanical protection cover"
    - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 24, no. 1A, June 1981, New York, US, p. 14, W.A. CAMPO et al.: "Heat spreader with thermal grease"
    - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 31, no. 3, August 1988, New York, US, pp. 451-452; "Low-cost, high-power, multi-chip module design"
    - VLSI Technology, ed. by S.M. Sze, McGraw-Hill Book Company, 1st ed. 1983, pp. 559-560
    - IBM Technical Disclosure Bulletin, vol. 21, no. 6, Nov. 1978, Armonk, New York, US, p. 2430; E.G. Loeffel and A.W. Rzant: "Heat transfer apparatus for semiconductor chip".
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.