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EP0366027
European procedure
Extract from the Register of European Patents
EP About this file: EP0366027
| EP0366027 - Wafer flood polishing [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 16.07.1994 Database last updated on 03.01.2025 | Most recent event Tooltip | 16.07.1994 | No opposition filed within time limit | published on 07.09.1994 [1994/36] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1990/18] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Cote, William J. 20 Logwood Circle Essex Junction Vermont 05452 / US | 02 /
Leach, Michael A. 38 North No. B Bristol Vermont 05443 / US | [1990/18] | Representative(s) | Mönig, Anton IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht 70548 Stuttgart / DE | [N/P] |
| Former [1993/24] | Mönig, Anton, Dipl.-Ing. IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht D-70548 Stuttgart / DE | ||
| Former [1990/18] | Kreidler, Eva-Maria, Dr. rer. nat. IBM Deutschland GmbH Patentwesen und Urheberrecht Schönaicher Strasse 220 D-71032 Böblingen / DE | Application number, filing date | 89119566.1 | 21.10.1989 | [1990/18] | Priority number, date | US19880263842 | 28.10.1988 Original published format: US 263842 | [1990/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0366027 | Date: | 02.05.1990 | Language: | EN | [1990/18] | Type: | A3 Search report | No.: | EP0366027 | Date: | 09.01.1991 | Language: | EN | [1991/02] | Type: | B1 Patent specification | No.: | EP0366027 | Date: | 15.09.1993 | Language: | EN | [1993/37] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.11.1990 | Classification | IPC: | B24B37/04, H01L21/00 | [1990/18] | CPC: |
H01L21/31053 (EP,US);
B24B37/013 (EP,US);
B24B37/015 (EP,US);
B24B37/04 (EP,US);
B24B37/042 (EP,US);
B24B49/16 (EP,US)
| Designated contracting states | DE, FR, GB [1990/18] | Title | German: | Polieren von Wafern in einem Flüssigkeitsbad | [1990/18] | English: | Wafer flood polishing | [1990/18] | French: | Polissage immergé de galettes semi-conductrices | [1990/18] | Examination procedure | 20.08.1990 | Examination requested [1990/41] | 13.03.1992 | Despatch of a communication from the examining division (Time limit: M04) | 09.07.1992 | Reply to a communication from the examining division | 13.11.1992 | Despatch of communication of intention to grant (Approval: Yes) | 15.03.1993 | Communication of intention to grant the patent | 07.04.1993 | Fee for grant paid | 07.04.1993 | Fee for publishing/printing paid | Opposition(s) | 16.06.1994 | No opposition filed within time limit [1994/36] | Fees paid | Renewal fee | 13.12.1990 | Renewal fee patent year 03 | 22.10.1992 | Renewal fee patent year 04 |
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