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EP0376620
European procedure
Extract from the Register of European Patents
EP About this file: EP0376620
| EP0376620 - Method for processing plastic packaged electronic devices [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 20.02.1998 Database last updated on 19.03.2026 | Most recent event Tooltip | 20.02.1998 | No opposition filed within time limit | published on 08.04.1998 [1998/15] | Applicant(s) | For all designated states NCR International, Inc. 1700 South Patterson Boulevard Dayton Ohio 45479 / US | [N/P] |
| Former [1996/23] | For all designated states NCR International, Inc. 1700 South Patterson Boulevard Dayton, Ohio 45479 / US | ||
| Former [1994/40] | For all designated states AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL INC. 1700 South Patterson Boulevard Dayton, Ohio 45479 / US | ||
| Former [1993/28] | For all designated states NCR INTERNATIONAL INC. 1700 South Patterson Boulevard Dayton, Ohio 45479 / US | ||
| Former [1990/27] | For all designated states NCR CORPORATION World Headquarters Dayton, Ohio 45479 / US | Inventor(s) | 01 /
Elliott, Blaine Keith 95 Nob Hill Columbia South Carolina 29201 / US | [1990/27] | Representative(s) | Irish, Vivien Elizabeth International IP Department NCR Limited 206 Marylebone Road London NW1 6LY / GB | [N/P] |
| Former [1997/28] | Irish, Vivien Elizabeth International IP Department, NCR Limited, 206 Marylebone Road London NW1 6LY / GB | ||
| Former [1996/24] | Robinson, Robert George International Intellectual Property Department, NCR LIMITED, 915 High Road, North Finchley London N12 8QJ / GB | ||
| Former [1994/40] | Robinson, Robert George International Patent Department, AT&T GIS Limited, 915 High Road, North Finchley London N12 8QJ / GB | ||
| Former [1990/27] | Robinson, Robert George International Patent Department NCR Limited 915 High Road North Finchley London N12 8QJ / GB | Application number, filing date | 89313408.0 | 21.12.1989 | [1990/27] | Priority number, date | US19880289858 | 27.12.1988 Original published format: US 289858 | [1990/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0376620 | Date: | 04.07.1990 | Language: | EN | [1990/27] | Type: | A3 Search report | No.: | EP0376620 | Date: | 31.07.1991 | Language: | EN | [1991/31] | Type: | B1 Patent specification | No.: | EP0376620 | Date: | 16.04.1997 | Language: | EN | [1997/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.06.1991 | Classification | IPC: | H01L21/56, H01L21/48, H01L23/31 | [1991/35] | CPC: |
H10W74/01 (EP,US);
H05K3/341 (EP,US);
H05K2201/10689 (EP,US);
H05K2203/1105 (EP,US);
H05K2203/304 (EP,US);
Y02P70/50 (EP,US)
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| Former IPC [1990/27] | H01L21/56, H01L21/48 | Designated contracting states | DE, ES, FR, GB, IT [1990/27] | Title | German: | Verarbeitungsverfahren für mit Plastik umhüllte elektronische Anordnungen | [1990/27] | English: | Method for processing plastic packaged electronic devices | [1990/27] | French: | Procédé pour le traitement de dispositifs électroniques encapsulés en plastique | [1990/27] | Examination procedure | 09.01.1992 | Examination requested [1992/11] | 08.04.1993 | Despatch of a communication from the examining division (Time limit: M04) | 16.06.1993 | Reply to a communication from the examining division | 14.04.1994 | Despatch of a communication from the examining division (Time limit: M02) | 07.05.1994 | Reply to a communication from the examining division | 16.05.1995 | Despatch of a communication from the examining division (Time limit: M04) | 16.06.1995 | Reply to a communication from the examining division | 19.08.1996 | Despatch of communication of intention to grant (Approval: No) | 10.10.1996 | Despatch of communication of intention to grant (Approval: later approval) | 15.10.1996 | Communication of intention to grant the patent | 27.01.1997 | Fee for grant paid | 27.01.1997 | Fee for publishing/printing paid | Opposition(s) | 17.01.1998 | No opposition filed within time limit [1998/15] | Fees paid | Renewal fee | 10.12.1991 | Renewal fee patent year 03 | 17.12.1992 | Renewal fee patent year 04 | 18.12.1993 | Renewal fee patent year 05 | 20.12.1994 | Renewal fee patent year 06 | 02.01.1996 | Renewal fee patent year 07 | 02.01.1997 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y] IEEE 26th Annual Proceedings - Reliability Physics 1988 14 April 1988, Monterey, CA, US, pages 83 - 89; R.LIN ET AL.: "Moisture Induced Package Cracking in Plastic Encapsulated Surface MountComponents During Solder Reflow Process" [Y] | [A] IEEE 26th Annual Proceedings - Reliability Physics 1988 14 April 1988, Monterey, CA, US, pages 90 - 95; M.KITANO ET AL.: "Analysis of Package Cracking During Reflow Soldering Process" [A] | [Y] Le Vide - Technique-Applications, 18e Anne, No.106, July/August 1963 PARIS FR pages 363 - 373; , D.BAKER: "Etanchit et dgazage dans les transistors encapsuls par soudage froid et par soudage lectrique" [Y] |