EP0401701 - Thin film bonding apparatus having adjustable film cutoff unit [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.08.1995 Database last updated on 16.07.2024 | Most recent event Tooltip | 30.11.2007 | Lapse of the patent in a contracting state Updated state(s): FR | published on 02.01.2008 [2008/01] | Applicant(s) | For all designated states SOMAR CORPORATION 11-2, Ginza 4-chome Chuo-ku Tokyo 104 / JP | [N/P] |
Former [1991/43] | For all designated states SOMAR CORPORATION 11-2, Ginza 4-chome Chuo-ku Tokyo 104 / JP | ||
Former [1990/50] | For all designated states SOMAR CORPORATION 11-2, Ginza 4-chome Chuo-ku Tokyo / JP | Inventor(s) | 01 /
Nagafuchi, Yasuhiro 3-20-19, Katsutadai-Minami Yachio-shi, Chiba / JP | 02 /
Seki, Mitsuhiro 2-5-14, Toyo, Koto-ku Tokyo / JP | 03 /
Sumi, Shigeo 8-11, Ayase, Hasuda-shi Saitama / JP | 04 /
Hamamura, Fumio 5-25-25, Hiyoshi, Kohoku-ku Yokohama-shi, Kanagawa / JP | [1990/50] | Representative(s) | Boeters, Hans Dietrich, et al BOETERS & LIECK Oberanger 32 80331 München / DE | [N/P] |
Former [1994/08] | Boeters, Hans Dietrich, Dr., et al Patentanwälte Boeters & Bauer, Bereiteranger 15 D-81541 München / DE | ||
Former [1990/50] | Boeters, Hans Dietrich, Dr. Patentanwälte Boeters & Bauer Bereiteranger 15 D-81541 München / DE | Application number, filing date | 90110469.5 | 01.06.1990 | [1990/50] | Priority number, date | JP19890141966 | 04.06.1989 Original published format: JP 14196689 | [1990/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0401701 | Date: | 12.12.1990 | Language: | EN | [1990/50] | Type: | B1 Patent specification | No.: | EP0401701 | Date: | 05.10.1994 | Language: | EN | [1994/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.09.1990 | Classification | IPC: | B32B31/20, B26D5/04 | [1990/50] | CPC: |
B32B37/226 (EP,US);
B26D1/385 (EP,US);
B26D5/04 (EP,US);
B32B38/0004 (EP,US);
B32B38/185 (EP,US);
B32B2457/08 (EP,US);
H05K3/0079 (EP,US);
Y10T156/1322 (EP,US);
Y10T156/1339 (EP,US);
| Designated contracting states | DE, FR, GB, IT [1990/50] | Title | German: | Einstellbare Schneidvorrichtung für eine Folienbahn | [1990/50] | English: | Thin film bonding apparatus having adjustable film cutoff unit | [1990/50] | French: | Dispositif de coupe ajustable d'une feuille | [1990/50] | Examination procedure | 13.12.1990 | Examination requested [1991/06] | 05.07.1993 | Despatch of a communication from the examining division (Time limit: M04) | 15.11.1993 | Reply to a communication from the examining division | 17.12.1993 | Despatch of communication of intention to grant (Approval: Yes) | 05.04.1994 | Communication of intention to grant the patent | 28.06.1994 | Fee for grant paid | 28.06.1994 | Fee for publishing/printing paid | Opposition(s) | 06.07.1995 | No opposition filed within time limit [1995/39] | Fees paid | Renewal fee | 29.06.1992 | Renewal fee patent year 03 | 08.06.1993 | Renewal fee patent year 04 | 23.06.1994 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 05.10.1994 | IT | 05.10.1994 | [2006/14] |
Former [1999/42] | IT | 05.10.1994 | |
FR | 03.03.1995 | ||
Former [1995/36] | FR | 03.03.1995 | Documents cited: | Search | [Y]EP0283741 (SOMAR CORP [JP]); | [Y]US3750510 (GABRIELS L); | [AP]EP0320965 (SOMAR CORP [JP]); | [A]EP0125584 (HAKUTO KK [JP], et al); | [A]GB2190029 (ESKOFOT AS); | [A]US4585509 (OBAYASHI TOSHIO [JP]) |