EP0413565 - Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 30.08.1996 Database last updated on 19.10.2024 | Most recent event Tooltip | 17.04.2015 | Change - lapse in a contracting state | published on 20.05.2015 [2015/21] | Applicant(s) | For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP | [N/P] |
Former [1991/08] | For all designated states HITACHI, LTD. 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 / JP | Inventor(s) | 01 /
Shoji, Mitsuyoshi 1621-9, Tomobe, Jyuoh-machi Taga-gun, Ibaraki-ken / JP | 02 /
Morihara, Atsushi 42-28, Taisei-cho Katsuta-shi, Ibaraki-ken / JP | 03 /
Nakakawaji, Takayuki 1-19-5-404, Ishinazaka-cho Hitachi-shi, Ibaraki-ken / JP | 04 /
Ito, Yutaka 1-16, Yamato-cho Takahagi-shi, Ibaraki-ken / JP | 05 /
Komatsuzaki, Shigeki 219, Kanaya-cho Mito-shi, Ibaraki-ken / JP | 06 /
Naganuma, Yoshio 2-20-1, Mizuki-cho Hitachi-shi, Ibaraki-ken / JP | 07 /
Yokoyama, Hiroshi 4-11-7, Ohse-cho Hitachi-shi, Ibaraki-ken / JP | 08 /
Nakagawa, Yusaku 2137-23, Tajiri-cho Hitachi-shi, Ibaraki-ken / JP | [1991/08] | Representative(s) | Paget, Hugh Charles Edward, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
Former [1994/06] | Paget, Hugh Charles Edward, et al MEWBURN ELLIS York House 23 Kingsway London WC2B 6HP / GB | ||
Former [1991/08] | Paget, Hugh Charles Edward MEWBURN ELLIS 2 Cursitor Street London EC4A 1BQ / GB | Application number, filing date | 90308941.5 | 14.08.1990 | [1991/08] | Priority number, date | JP19890211358 | 18.08.1989 Original published format: JP 21135889 | [1991/08] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0413565 | Date: | 20.02.1991 | Language: | EN | [1991/08] | Type: | B1 Patent specification | No.: | EP0413565 | Date: | 25.10.1995 | Language: | EN | [1995/43] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.11.1990 | Classification | IPC: | H01L23/433, H01L23/473, C10M105/50, C10M107/38 | [1995/43] | CPC: |
H01L23/4338 (EP);
C10M105/68 (EP);
C10M105/76 (EP);
C10M107/38 (EP);
H01L2224/16 (EP);
H01L2224/73253 (EP);
|
Former IPC [1991/08] | H01L23/473, H01L23/433, C10M105/76, C10M107/38 | Designated contracting states | DE, FR, GB, NL [1991/08] | Title | German: | Kühlsystem für ein Halbleiterelement, Halbleitermodul bestehend aus einem solchen System und ein thermisch leitender Kühlkörper dafür | [1995/43] | English: | Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor | [1991/08] | French: | Système de refroidissement pour un dispositif semi-conducteur, module semi-conducteur ayant un tel système et utilisant un corps de refroidissement thermoconducteur | [1991/08] |
Former [1991/08] | Kühlsystem für ein Halbleiterelement, Halbleitermodul bestehend aus einem solchen System und ein dafür thermisch leitender Kühlkörper | Examination procedure | 10.10.1990 | Examination requested [1991/08] | 13.07.1993 | Despatch of a communication from the examining division (Time limit: M06) | 23.02.1994 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time | 05.05.1994 | Reply to a communication from the examining division | 11.11.1994 | Despatch of communication of intention to grant (Approval: Yes) | 23.03.1995 | Communication of intention to grant the patent | 02.05.1995 | Fee for grant paid | 02.05.1995 | Fee for publishing/printing paid | Opposition(s) | 26.07.1996 | No opposition filed within time limit [1996/42] | Request for further processing for: | 05.05.1994 | Request for further processing filed | 05.05.1994 | Full payment received (date of receipt of payment) Request granted | 16.06.1994 | Decision despatched | Fees paid | Renewal fee | 27.08.1992 | Renewal fee patent year 03 | 27.08.1993 | Renewal fee patent year 04 | 23.08.1994 | Renewal fee patent year 05 | 22.08.1995 | Renewal fee patent year 06 |
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Former [1996/28] | DE | 26.01.1996 | Documents cited: | Search | [Y]JP62236135 ; | [Y]JP60089817 ; | [Y]JP63150384 ; | [Y]JP63225917 ; | [A]JP63258992 ; | [A]JP63027599 ; | [A]JP63255288 ; | [A]JP62015295 ; | [YD]EP0288183 | [Y] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 104 (P-685) 06 April 1988, & JP-A-62 236135 (HITACHI MAXELL LTD) 16 October 1987,, & JP62236135 A 19871016 | [Y] - PATENT ABSTRACTS OF JAPAN vol. 9, no. 236 (P-390) 21 September 1985, & JP-A-60 089817 (HITACHI MAXELL LTD) 20 May 1985,, & JP60089817 A 19850520 | [Y] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 421 (C-541) 08 November 1988, & JP-A-63 150384 (HITACHI LTD) 23 June 1988,, & JP63150384 A 19880623 | [Y] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 027 (P-815) 20 January 1989, & JP-A-63 225917 (MITSUBISHI ELECTRIC CORP.) 20 September 1988,, & JP63225917 A 19880920 | [A] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 069 (C-569) 16 February 1989, & JP-A-63 258992 (HITACHI METALS LTD) 26 October 1988,, & JP63258992 A 19881026 | [A] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 237 (C-509) 06 July 1988, & JP-A-63 027599 (HITACHI LTD) 05 February 1988,, & JP63027599 A 19880205 | [A] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 063 (C-568) 13 February 1989, & JP-A-63 255288 (SHIN ETSU CHEM CO LTD) 21 October 1988,, & JP63255288 A 19881021 | [A] - PATENT ABSTRACTS OF JAPAN vol. 11, no. 192 (C-429) 19 June 1987, & JP-A-62 015295 (HITACHI LTD) 23 January 1987,, & JP62015295 A 19870123 |