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Extract from the Register of European Patents

EP About this file: EP0413565

EP0413565 - Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.08.1996
Database last updated on 19.10.2024
Most recent event   Tooltip17.04.2015Change - lapse in a contracting statepublished on 20.05.2015  [2015/21]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo 101 / JP
[N/P]
Former [1991/08]For all designated states
HITACHI, LTD.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101 / JP
Inventor(s)01 / Shoji, Mitsuyoshi
1621-9, Tomobe, Jyuoh-machi
Taga-gun, Ibaraki-ken / JP
02 / Morihara, Atsushi
42-28, Taisei-cho
Katsuta-shi, Ibaraki-ken / JP
03 / Nakakawaji, Takayuki
1-19-5-404, Ishinazaka-cho
Hitachi-shi, Ibaraki-ken / JP
04 / Ito, Yutaka
1-16, Yamato-cho
Takahagi-shi, Ibaraki-ken / JP
05 / Komatsuzaki, Shigeki
219, Kanaya-cho
Mito-shi, Ibaraki-ken / JP
06 / Naganuma, Yoshio
2-20-1, Mizuki-cho
Hitachi-shi, Ibaraki-ken / JP
07 / Yokoyama, Hiroshi
4-11-7, Ohse-cho
Hitachi-shi, Ibaraki-ken / JP
08 / Nakagawa, Yusaku
2137-23, Tajiri-cho
Hitachi-shi, Ibaraki-ken / JP
[1991/08]
Representative(s)Paget, Hugh Charles Edward, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
[N/P]
Former [1994/06]Paget, Hugh Charles Edward, et al
MEWBURN ELLIS York House 23 Kingsway
London WC2B 6HP / GB
Former [1991/08]Paget, Hugh Charles Edward
MEWBURN ELLIS 2 Cursitor Street
London EC4A 1BQ / GB
Application number, filing date90308941.514.08.1990
[1991/08]
Priority number, dateJP1989021135818.08.1989         Original published format: JP 21135889
[1991/08]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0413565
Date:20.02.1991
Language:EN
[1991/08]
Type: B1 Patent specification 
No.:EP0413565
Date:25.10.1995
Language:EN
[1995/43]
Search report(s)(Supplementary) European search report - dispatched on:EP28.11.1990
ClassificationIPC:H01L23/433, H01L23/473, C10M105/50, C10M107/38
[1995/43]
CPC:
H01L23/4338 (EP); C10M105/68 (EP); C10M105/76 (EP);
C10M107/38 (EP); H01L2224/16 (EP); H01L2224/73253 (EP);
H01L2924/01014 (EP); H01L2924/01019 (EP); H01L2924/15312 (EP) (-)
Former IPC [1991/08]H01L23/473, H01L23/433, C10M105/76, C10M107/38
Designated contracting statesDE,   FR,   GB,   NL [1991/08]
TitleGerman:Kühlsystem für ein Halbleiterelement, Halbleitermodul bestehend aus einem solchen System und ein thermisch leitender Kühlkörper dafür[1995/43]
English:Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor[1991/08]
French:Système de refroidissement pour un dispositif semi-conducteur, module semi-conducteur ayant un tel système et utilisant un corps de refroidissement thermoconducteur[1991/08]
Former [1991/08]Kühlsystem für ein Halbleiterelement, Halbleitermodul bestehend aus einem solchen System und ein dafür thermisch leitender Kühlkörper
Examination procedure10.10.1990Examination requested  [1991/08]
13.07.1993Despatch of a communication from the examining division (Time limit: M06)
23.02.1994Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
05.05.1994Reply to a communication from the examining division
11.11.1994Despatch of communication of intention to grant (Approval: Yes)
23.03.1995Communication of intention to grant the patent
02.05.1995Fee for grant paid
02.05.1995Fee for publishing/printing paid
Opposition(s)26.07.1996No opposition filed within time limit [1996/42]
Request for further processing for:05.05.1994Request for further processing filed
05.05.1994Full payment received (date of receipt of payment)
Request granted
16.06.1994Decision despatched
Fees paidRenewal fee
27.08.1992Renewal fee patent year 03
27.08.1993Renewal fee patent year 04
23.08.1994Renewal fee patent year 05
22.08.1995Renewal fee patent year 06
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Former [1996/28]DE26.01.1996
Documents cited:Search[Y]JP62236135  ;
 [Y]JP60089817  ;
 [Y]JP63150384  ;
 [Y]JP63225917  ;
 [A]JP63258992  ;
 [A]JP63027599  ;
 [A]JP63255288  ;
 [A]JP62015295  ;
 [YD]EP0288183
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 12, no. 104 (P-685) 06 April 1988, & JP-A-62 236135 (HITACHI MAXELL LTD) 16 October 1987,, & JP62236135 A 19871016
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 9, no. 236 (P-390) 21 September 1985, & JP-A-60 089817 (HITACHI MAXELL LTD) 20 May 1985,, & JP60089817 A 19850520
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 12, no. 421 (C-541) 08 November 1988, & JP-A-63 150384 (HITACHI LTD) 23 June 1988,, & JP63150384 A 19880623
 [Y]  - PATENT ABSTRACTS OF JAPAN vol. 13, no. 027 (P-815) 20 January 1989, & JP-A-63 225917 (MITSUBISHI ELECTRIC CORP.) 20 September 1988,, & JP63225917 A 19880920
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 13, no. 069 (C-569) 16 February 1989, & JP-A-63 258992 (HITACHI METALS LTD) 26 October 1988,, & JP63258992 A 19881026
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 12, no. 237 (C-509) 06 July 1988, & JP-A-63 027599 (HITACHI LTD) 05 February 1988,, & JP63027599 A 19880205
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 13, no. 063 (C-568) 13 February 1989, & JP-A-63 255288 (SHIN ETSU CHEM CO LTD) 21 October 1988,, & JP63255288 A 19881021
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 11, no. 192 (C-429) 19 June 1987, & JP-A-62 015295 (HITACHI LTD) 23 January 1987,, & JP62015295 A 19870123
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.