-
EP0435469
European procedure
Extract from the Register of European Patents
EP About this file: EP0435469
| EP0435469 - Method for laser link blowing in integrated circuit fabrication [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 31.01.1997 Database last updated on 24.08.2024 | Most recent event Tooltip | 31.01.1997 | No opposition filed within time limit | published on 19.03.1997 [1997/12] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1991/27] | Inventor(s) | 01 /
Chlipala, James D. 4754 White Oak Circle Emmaus, Pennsylvania 18049 / US | [1991/27] | Representative(s) | Watts, Christopher Malcolm Kelway, et al Lucent Technologies (UK) Ltd, 5 Mornington Road Woodford Green Essex IG8 OTU / GB | [N/P] |
| Former [1991/27] | Watts, Christopher Malcolm Kelway, Dr., et al AT&T (UK) LTD. AT&T Intellectual Property Division 5 Mornington Road Woodford Green Essex IG8 OTU / GB | Application number, filing date | 90313005.2 | 29.11.1990 | [1991/27] | Priority number, date | US19890459168 | 29.12.1989 Original published format: US 459168 | [1991/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0435469 | Date: | 03.07.1991 | Language: | EN | [1991/27] | Type: | A3 Search report | No.: | EP0435469 | Date: | 01.04.1992 | Language: | EN | [1992/14] | Type: | B1 Patent specification | No.: | EP0435469 | Date: | 27.03.1996 | Language: | EN | [1996/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.02.1992 | Classification | IPC: | H01L21/768, H01L21/268 | [1996/13] | CPC: |
H01L23/5258 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [1992/14] | H01L21/90, H01L21/268 | ||
| Former IPC [1991/27] | H01L21/90, H01L23/525 | Designated contracting states | DE, FR, GB, IT [1991/27] | Title | German: | Verfahren zum Laser-Durchbrennen von Schmelzverbindungen beim Herstellen von integrierten Schaltungen | [1991/27] | English: | Method for laser link blowing in integrated circuit fabrication | [1991/27] | French: | Procédé pour faire fondre par laser des fusibles dans la fabrication des circuits intégrés | [1991/27] | Examination procedure | 18.09.1992 | Examination requested [1992/47] | 20.07.1994 | Despatch of a communication from the examining division (Time limit: M06) | 18.01.1995 | Reply to a communication from the examining division | 19.05.1995 | Despatch of communication of intention to grant (Approval: Yes) | 28.09.1995 | Communication of intention to grant the patent | 29.11.1995 | Fee for grant paid | 29.11.1995 | Fee for publishing/printing paid | Opposition(s) | 28.12.1996 | No opposition filed within time limit [1997/12] | Fees paid | Renewal fee | 16.11.1992 | Renewal fee patent year 03 | 09.11.1993 | Renewal fee patent year 04 | 16.11.1994 | Renewal fee patent year 05 | 17.11.1995 | Renewal fee patent year 06 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4155779 (AUSTON DAVID H [US], et al); | [AD]US4853758 (FISCHER FREDERICK H [US]) |