EP0444469 - High density internconnect [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.10.1996 Database last updated on 24.08.2024 | Most recent event Tooltip | 25.10.1996 | No opposition filed within time limit | published on 11.12.1996 [1996/50] | Applicant(s) | For all designated states Hughes Aircraft Company 7200 Hughes Terrace P.O. Box 45066 Los Angeles, California 90045-0066 / US | [N/P] |
Former [1992/27] | For all designated states Hughes Aircraft Company 7200 Hughes Terrace P.O. Box 45066 Los Angeles, California 90045-0066 / US | ||
Former [1991/36] | For all designated states HUGHES AIRCRAFT COMPANY P.O. Box 80028 Los Angeles, CA 90080-0028 / US | Inventor(s) | 01 /
Gates, James L. 1332 Arcadia Vista, California 92083 / US | [1991/36] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstrasse 4 80802 München / DE | [N/P] |
Former [1991/36] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Maximilianstrasse 58 D-80538 München / DE | Application number, filing date | 91101954.5 | 12.02.1991 | [1991/36] | Priority number, date | US19900486669 | 28.02.1990 Original published format: US 486669 | [1991/36] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0444469 | Date: | 04.09.1991 | Language: | EN | [1991/36] | Type: | A3 Search report | No.: | EP0444469 | Date: | 18.03.1992 | Language: | EN | [1992/12] | Type: | B1 Patent specification | No.: | EP0444469 | Date: | 20.12.1995 | Language: | EN | [1995/51] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 31.01.1992 | Classification | IPC: | H01L21/60, H01L23/485 | [1991/36] | CPC: |
H01L24/80 (EP,US);
H01L23/49811 (EP,US);
H05K3/3436 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01049 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/14 (EP,US);
H05K2201/09427 (EP,US);
Y02P70/50 (EP,US);
| Designated contracting states | DE, FR, GB, IT, NL [1991/36] | Title | German: | Zwischenverbindung hoher Dichte | [1991/36] | English: | High density internconnect | [1991/36] | French: | Interconnexion haute densité | [1991/36] | Examination procedure | 17.09.1992 | Examination requested [1992/46] | 17.01.1994 | Despatch of a communication from the examining division (Time limit: M06) | 24.06.1994 | Reply to a communication from the examining division | 07.07.1994 | Despatch of a communication from the examining division (Time limit: M04) | 07.11.1994 | Reply to a communication from the examining division | 06.02.1995 | Despatch of communication of intention to grant (Approval: Yes) | 23.06.1995 | Communication of intention to grant the patent | 19.09.1995 | Fee for grant paid | 19.09.1995 | Fee for publishing/printing paid | Opposition(s) | 21.09.1996 | No opposition filed within time limit [1996/50] | Fees paid | Renewal fee | 22.01.1993 | Renewal fee patent year 03 | 17.01.1994 | Renewal fee patent year 04 | 19.01.1995 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]WO8001220 (HUGHES AIRCRAFT CO [US]); | [A]EP0281026 (HONEYWELL INC [US]); | [A]EP0336232 (FRIEDRICH DIETER [DE], et al); | [XP]FR2639787 (THOMSON CSF [FR]); | [XP]US4935627 (ZIMMERMANN PETER H [US], et al) | [A] - IEEE 35th ELECTRONIC COMPONENTS CONFERENCE,Washington DC , 20-22 May 1985 New York , US pages 122 - 126; A.D.KNIGHT ET AL: "Surface soldered pinless module connector" | Examination | - The Oxford Encyclopedic English Dictionary pg.726 |