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Extract from the Register of European Patents

EP About this file: EP0451500

EP0451500 - Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.09.1998
Database last updated on 02.11.2024
Most recent event   Tooltip17.02.2006Change - lapse in a contracting state
Updated state(s): FR		published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1991/42]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Lauffer, John Matthew
RD. 1 Box 371B
Waverly, New York, 14892 / US
02 / Schumacher, Richard Anthony
53 Coventry Road
Endicott, New York, 13760 / US
[1991/42]
Representative(s)Rach, Werner, et al
IBM Deutschland Management & Business Support GmbH Patentwesen u. Urheberrecht
71137 Ehningen / DE
[N/P]
Former [1997/28]Rach, Werner, Dr., et al
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
70548 Stuttgart / DE
Former [1997/24]Teufel, Fritz, Dipl.-Phys., et al
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
70548 Stuttgart / DE
Former [1995/35]Lindner-Vogt, Karin, Dipl.-Phys.
IBM Deutschland, Informationssysteme GmbH, Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1994/38]Schäfer, Wolfgang, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1993/39]Mönig, Anton, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH, Patentwesen und Urheberrecht
D-70548 Stuttgart / DE
Former [1991/42]Klocke, Peter, Dipl.-Ing.
IBM Deutschland Informationssysteme GmbH Patentwesen und Urheberrecht Pascalstrasse 100
D-70569 Stuttgart / DE
Application number, filing date91103285.205.03.1991
[1991/42]
Priority number, dateUS1990050664009.04.1990         Original published format: US 506640
[1991/42]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0451500
Date:16.10.1991
Language:EN
[1991/42]
Type: A3 Search report 
No.:EP0451500
Date:08.02.1995
Language:EN
[1995/06]
Type: B1 Patent specification 
No.:EP0451500
Date:19.11.1997
Language:EN
[1997/47]
Search report(s)(Supplementary) European search report - dispatched on:EP21.12.1994
ClassificationIPC:H05K3/46, H01L23/538, H05K1/16
[1995/03]
CPC:
H05K1/162 (EP,US); H05K2201/0175 (EP,US); H05K2201/0179 (EP,US);
H05K2201/0317 (EP,US); H05K2201/0355 (EP,US); H05K2201/09309 (EP,US);
H05K3/429 (EP,US); H05K3/4611 (EP,US); Y10S257/916 (EP,US);
Y10T29/435 (EP,US) (-)
Former IPC [1991/42]H05K3/46, H01L23/538
Designated contracting statesDE,   FR,   GB [1991/42]
TitleGerman:Gedruckte Leiterplatten und Karten mit eingefügten Dünnfilmkondensatoren und Herstellungsverfahren für diese Leiterplatten und Karten[1991/42]
English:Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards[1991/42]
French:Plaques et castes à circuits imprimés aux condensateurs à pellicule mince moulés et procédé de fabrication de celles-ci[1991/42]
Examination procedure19.12.1991Examination requested  [1992/09]
20.11.1995Despatch of a communication from the examining division (Time limit: M06)
14.05.1996Reply to a communication from the examining division
06.02.1997Despatch of communication of intention to grant (Approval: Yes)
26.05.1997Communication of intention to grant the patent
10.07.1997Fee for grant paid
10.07.1997Fee for publishing/printing paid
Opposition(s)20.08.1998No opposition filed within time limit [1998/46]
Fees paidRenewal fee
31.03.1993Renewal fee patent year 03
24.03.1994Renewal fee patent year 04
23.03.1995Renewal fee patent year 05
08.03.1996Renewal fee patent year 06
25.03.1997Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipFR19.11.1997
GB05.03.1998
[2006/14]
Former [1999/25]GB05.03.1998
FR17.04.1998
Former [1998/44]FR17.04.1998
Documents cited:Search[X]EP0045877  (IBM [US]) [X] 1,2 * abstract; page 4, line 7 - page 7, line 21; page 8, line 7 - page 11, line 30; figures 1-3, 6-11 3 *;
 [X]US4567542  (SHIMADA YUZO [JP], et al) [X] 1,2 * abstract; column 2, lines 35 - 62; column 3, line 14 - column 4, line 27; column 7, lines 17 - 33; column 8, line 64 - column 9, line 11; figures 1 - 10; tables 3, 5 *;
 [PX]JPH0298996  ;
 [A]US4858077  (SHINOHARA HIROICHI [JP], et al) [A] 1-6 * abstract; column 4, line 11 - column 6, line 40; figures 1A, 1B, 2A-2D *;
 [A]FR2514562  (THOMSON CSF [FR]) [A] 1-3 * page 3, line 4 - page 4, line 15; figure 1 *;
 [A]EP0285873  (MITSUBISHI MINING & CEMENT CO [JP]) [A] 3-9 * abstract; page 4, line 3 - page 6, line 41; claims 1-17; figures 1, 2 *;
 [A]JPH0280397  ;
 [A]US4453199  (RITCHIE KIM [US], et al) [A] 7-9 * abstract; column 4, line 35 - column 5, line 56; claim 1; figures 1-9 *
 [PX]  - PATENT ABSTRACTS OF JAPAN, (19900703), vol. 14, no. 308, Database accession no. (E - 0947), & JP02098996 A 19900411 (MITSUBISHI ELECTRIC CORP) [PX] 1,2 * abstract *
 [A]  - DATABASE WPI, 0, Derwent World Patents Index, vol. 90, no. 17, Database accession no. 90-129801, & JPH0280397 A 19900320 (MATSUSHITA ELEC IND KK) [A] 3,5,7 * abstract *
 [DA]  - C.H. BAJOREK ET AL., "Integrated, Low Inductance, Small Area Capacitors for VLSI Semiconductor Packages", IBM TECHNICAL DISCLOSURE BULLETIN, NEW YORK, USA, (198207), vol. 25, no. 2, pages 883 - 888 [DA] 1 * whole document *
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