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Extract from the Register of European Patents

EP About this file: EP0478879

EP0478879 - A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board [Right-click to bookmark this link]
Former [1992/15]Secondary board for mounting of components having differing bonding requirements
[1994/42]
StatusNo opposition filed within time limit
Status updated on  19.08.1995
Database last updated on 15.07.2024
Most recent event   Tooltip15.08.2008Change - applicantpublished on 17.09.2008  [2008/38]
Applicant(s)For all designated states
Hewlett-Packard Company
3000 Hanover Street
Palo Alto, CA 94304-1112 / US
[N/P]
Former [2008/38]For all designated states
Hewlett-Packard Company
3000 Hanover Street
Palo Alto CA 94304-1112 / US
Former [1992/15]For all designated states
Hewlett-Packard Company
Mail Stop 20 B-O, 3000 Hanover Street
Palo Alto, California 94304 / US
Inventor(s)01 / Chang, Cheng-Cheng
3365 St. Michael Drive
Palo Alto, California 94306 / US
02 / Hanlon, Lawrence
287 Oak Hurst Place
Menlo Park, California 94025 / US
[1992/15]
Representative(s)Schoppe, Fritz
Schoppe, Zimmermann, Stöckeler & Zinkler
Patentanwälte
Postfach 246
82043 Pullach bei München / DE
[N/P]
Former [1992/15]Schoppe, Fritz, Dipl.-Ing.
Patentanwalt, Georg-Kalb-Strasse 9
D-82049 Pullach / DE
Application number, filing date91104477.421.03.1991
[1992/15]
Priority number, dateUS1990059089301.10.1990         Original published format: US 590893
[1992/15]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0478879
Date:08.04.1992
Language:EN
[1992/15]
Type: A3 Search report 
No.:EP0478879
Date:01.07.1992
Language:EN
[1992/27]
Type: B1 Patent specification 
No.:EP0478879
Date:19.10.1994
Language:EN
[1994/42]
Search report(s)(Supplementary) European search report - dispatched on:EP11.05.1992
ClassificationIPC:H05K3/36, H01L23/538
[1992/15]
CPC:
H01L23/5385 (EP,US); H01L23/04 (EP,US); H01L23/5384 (EP,US);
H05K3/363 (EP,US); H01L2924/0002 (EP,US); H01L2924/01079 (EP,US);
H05K1/141 (EP,US); H05K2201/096 (EP,US); H05K2201/10666 (EP,US);
H05K2201/10681 (EP,US); H05K2203/0455 (EP,US); H05K3/3468 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB [1992/15]
TitleGerman:System für das Zusammenschalten elektrischer Komponenten mit verschiedenen Verbindungserfordernissen zum Montieren der Komponenten auf Leiterplatten[1994/42]
English:A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board[1994/42]
French:System d'interconnection des éléments électriques ayant des exigences de liaison différentes pour leur montage sur un plaquette imprimée[1994/42]
Former [1992/15]Sekundäre Leiterplatte zum Montieren von Komponenten mit verschiedenen Verbindungserfordernissen
Former [1992/15]Secondary board for mounting of components having differing bonding requirements
Former [1992/15]Plaquette secondaire pour le montage de composants ayant des exigences de liaison différentes
File destroyed:20.04.2002
Examination procedure23.12.1992Examination requested  [1993/08]
21.01.1994Despatch of communication of intention to grant (Approval: Yes)
05.04.1994Communication of intention to grant the patent
07.06.1994Fee for grant paid
07.06.1994Fee for publishing/printing paid
Opposition(s)20.07.1995No opposition filed within time limit [1995/41]
Fees paidRenewal fee
26.02.1993Renewal fee patent year 03
24.02.1994Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]GB1136753  (ENGLISH ELECTRIC COMPUTERS LTD);
 [A]US3888639  (HASTINGS MYRON L, et al);
 [A]DE3328547  (HAGENUK TELECOM GMBH)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.