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EP0457180
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EP About this file: EP0457180
| EP0457180 - Process for metallising a through-hole board [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 01.12.1992 Database last updated on 19.10.2024 | Most recent event Tooltip | 01.12.1992 | Application deemed to be withdrawn | published on 20.01.1993 [1993/03] | Applicant(s) | For all designated states LeaRonal (UK) plc High Peak Laboratories Ashbourne Road Buxton Derbyshire SK17 9SS / GB | [N/P] |
| Former [1991/47] | For all designated states LeaRonal (UK) plc High Peak Laboratories Ashbourne Road Buxton Derbyshire SK17 9SS / GB | Inventor(s) | 01 /
Whitlaw, Keith John 94 Green Lane Buxton, Derbyshire / GB | 02 /
Goodenough, Mark 12 Manners Close Chinley, Stockport / GB | [1991/47] | Representative(s) | Hansen, Bernd, et al Hoffmann Eitle Patent- und Rechtsanwälte Postfach 81 04 20 81904 München / DE | [N/P] |
| Former [1991/47] | Hansen, Bernd, Dr. Dipl.-Chem., et al Hoffmann, Eitle & Partner Patent- und Rechtsanwälte, Postfach 81 04 20 D-81904 München / DE | Application number, filing date | 91107477.1 | 08.05.1991 | [1991/47] | Priority number, date | GB19900010328 | 09.05.1990 Original published format: GB 9010328 | [1991/47] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0457180 | Date: | 21.11.1991 | Language: | EN | [1991/47] | Type: | A3 Search report | No.: | EP0457180 | Date: | 27.11.1991 | Language: | EN | [1991/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.10.1991 | Classification | IPC: | H05K3/42, C25D5/56 | [1991/47] | CPC: |
H05K3/424 (EP,US);
C25D5/56 (EP,US);
H05K2201/0329 (EP,US);
H05K2203/0783 (EP,US);
H05K2203/0796 (EP,US);
H05K2203/122 (EP,US);
H05K3/427 (EP,US)
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| Designated contracting states | BE, CH, DE, FR, GB, LI, NL [1991/47] | Title | German: | Metallisierungsverfahren von einer Leiterplatte mit Durchgangbohrungen | [1991/47] | English: | Process for metallising a through-hole board | [1991/47] | French: | Procédé de métallisation d'un circuit à transtraversants | [1991/47] | File destroyed: | 15.02.2000 | Examination procedure | 28.05.1992 | Application deemed to be withdrawn, date of legal effect [1993/03] | 25.08.1992 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [1993/03] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPS63125696 ; | EP0206133 [ ] (BASF AG [DE]); | WO8908375 [ ] (BLASBERG OBERFLAECHENTECH [DE]); | WO9108324 [ ] (SCHERING AG [DE]) | [A] - PATENT ABSTRACTS OF JAPAN, vol. 12, no. 373 (C-534)[3220]6th October 1988; & JP-A-63 125 696 (SEIZO MIYATA) 28-05-1988 | [A] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 373 (C-534)(3220) 6 October 1988& JP-A-63 125696 (SEIZO MIYATA) 28 May 1988, |