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Extract from the Register of European Patents

EP About this file: EP0473067

EP0473067 - Wafer processing reactor [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  08.11.1996
Database last updated on 12.07.2024
Most recent event   Tooltip08.11.1996No opposition filed within time limitpublished on 27.12.1996 [1996/52]
Applicant(s)For all designated states
Applied Materials, Inc.
P.O. Box 58039
Santa Clara, California 95052 / US
[N/P]
Former [1992/10]For all designated states
APPLIED MATERIALS INC.
PO Box 58039
Santa Clara California 95052 / US
Inventor(s)01 / Anderson, Roger N.
1824 Nestorita Way
San Jose, CA 95124 / US
02 / Lindstrom, Paul R.
120 Hawks Peak Road
Aptos, CA 95003 / US
03 / Johnson, Wayne
12019 S. Appaloosa
Phoenix, AZ 85044 / US
[1996/01]
Former [1992/10]01 / Anderson, Roger N.
1824 Nestorita Way
San Jose, California 95124 / US
02 / Lindstrom, Paul R.
120 Hawks Peak Road
Aptos, California 95003 / US
03 / Johnson, Wayne
12019 S. Appaloosa
Phoenix, Arizona 85044 / US
Representative(s)Kahler, Kurt
Patentanwälte Kahler, Käck, Fiener Vorderer Anger 239
86899 Landsberg/Lech / DE
[N/P]
Former [1992/45]Kahler, Kurt, Dipl.-Ing.
Patentanwälte Kahler, Käck, Fiener & Sturm P.O. Box 12 49
D-87712 Mindelheim / DE
Former [1992/10]Kahler, Kurt, Dipl.-Ing.
Patentanwälte Kahler, Käck, Fiener & Sturm P.O. Box 12 49
D-87712 Mindelheim / DE
Application number, filing date91114081.222.08.1991
[1992/10]
Priority number, dateUS1990057195723.08.1990         Original published format: US 571957
[1992/10]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0473067
Date:04.03.1992
Language:EN
[1992/10]
Type: B1 Patent specification 
No.:EP0473067
Date:03.01.1996
Language:EN
[1996/01]
Search report(s)(Supplementary) European search report - dispatched on:EP13.12.1991
ClassificationIPC:C23C16/44, C23C16/42, C23C16/46, C23C16/48
[1996/01]
CPC:
C23C16/455 (EP)
Former IPC [1992/10]C23C16/44
Designated contracting statesDE,   GB [1992/10]
TitleGerman:Reaktor zur Behandlung von Halbleiterscheiben.[1996/01]
English:Wafer processing reactor[1992/10]
French:Réacteur pour le traitement de plaquettes[1992/10]
Former [1992/10]Reaktor für Behandlung von Wafers
MiscellaneousEPB 1996/01: Teilanmeldung 95106353.6 eingereicht am 22/08/91
EPB 1996/01: Divisional application 95106353.6 filed on 22/08/91
EPB 1996/01: Demande divisionnaire 95106353.6 déposée le 22/08/91
Examination procedure14.08.1992Examination requested  [1992/42]
19.01.1994Despatch of a communication from the examining division (Time limit: M06)
25.07.1994Reply to a communication from the examining division
24.10.1994Despatch of communication of intention to grant (Approval: Yes)
09.05.1995Communication of intention to grant the patent
08.08.1995Fee for grant paid
08.08.1995Fee for publishing/printing paid
Divisional application(s)EP95106353.6  / EP0688887
Opposition(s)05.10.1996No opposition filed within time limit [1996/52]
Fees paidRenewal fee
30.08.1993Renewal fee patent year 03
31.08.1994Renewal fee patent year 04
31.08.1995Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JP56013718  ;
 [X]WO8912703  ;
 [Y]WO9007019  ;
 [A]EP0254654
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 5, no. 63 (E-54)(735) 28 April 1981 & JP-A-56 013 718 ( HITACHI SEISAKUSHO K.K. ) 10 February 1981, & JP56013718 A 19810210
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.