-
EP0489326
European procedure
Extract from the Register of European Patents
EP Citations: EP0489326
| Cited in | Search | Type: | Patent literature | Publication No.: | JP1296061
[Y] ; | Type: | Patent literature | Publication No.: | JP2196454
[A] ; | Type: | Patent literature | Publication No.: | US4546619
[X] (ROHNER THOMAS G [US]); | Type: | Patent literature | Publication No.: | US4812733
[X] (TOBEY RICHARD [US]); | Type: | Patent literature | Publication No.: | AU503641B
[A] (CONTROL DATA CORP) | Type: | Non-patent literature | Publication information: | [Y] - RESEARCH DISCLOSURE NO 28905 no. 289, May 1988, HAVANT GB page 263 'Cooling Packet for Electronic Components' | Type: | Non-patent literature | Publication information: | [Y] - FUJITSU-SCIENTIFIC AND TECHNICAL JOURNAL vol. 15, no. 3, 1979, KAWASAKI JP pages 47 - 62 YAMAMOTO H. ET AL 'Limitation on Forced Air Cooling in High Speed Computers' | Type: | Non-patent literature | Publication information: | [Y] - IBM TECHNICAL DISCLOSURE BULLETIN vol. 32, no. 5A, October 1989, NEW YORK US page 222 'REGULATION OF HUMIDITY IN MEMORY DEVICES' | Type: | Non-patent literature | Publication information: | [Y] - PATENT ABSTRACTS OF JAPAN vol. 014, no. 083 (M-0936)16 February 1990 & JP-A-1 296 061 ( MITSUBISHI ELECTRIC CORP ) 29 November 1989, & JP1296061 A 19891129 | Type: | Non-patent literature | Publication information: | [Y] - IBM TECHNICAL DISCLOSURE BULLETIN vol. 33, no. 1A, June 1990, NEW YORK US pages 254 - 255 'LOW TEMPERATURE COMPUTER PACKAGE WITH MULTIPLE THERMAL ZONES' | Type: | Non-patent literature | Publication information: | [A] - RESEARCH DISCLOSURE NO 30976 no. 309, January 1990, HAVANT GB page 55 'Thermal Control Scheme for Boiling Cooling of Chips with Attached Extended Surfaces' | Type: | Non-patent literature | Publication information: | [A] - PATENT ABSTRACTS OF JAPAN vol. 014, no. 476 (E-991)17 October 1990 & JP-A-2 196 454 ( HITACHI LTD ) 3 August 1990, & JP2196454 A 19900803 | Type: | Non-patent literature | Publication information: | [A] - IBM TECHNICAL DISCLOSURE BULLETIN vol. 8, no. 11, April 1966, NEW YORK US page 1692 CHU R. C. 'COUNTER-FLOW COOLING SYSTEM' |