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EP0438222
European procedure
Extract from the Register of European Patents
EP About this file: EP0438222
| EP0438222 - Low modulus silicone sealants [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 26.07.1996 Database last updated on 02.09.2024 | Most recent event Tooltip | 26.07.1996 | No opposition filed within time limit | published on 11.09.1996 [1996/37] | Applicant(s) | For all designated states Dow Corning Corporation 3901 S. Saginaw Road Midland, Michigan 48686-0994 / US | [N/P] |
| Former [1992/45] | For all designated states DOW CORNING CORPORATION 3901 S. Saginaw Road Midland Michigan 48686-0994 / US | ||
| Former [1991/30] | For all designated states DOW CORNING CORPORATION Midland, Michigan 48686-0994 / US | Inventor(s) | 01 /
Chu, Hsien-Kun 6 Harvest Hill Wethersfield, Connecticut / US | 02 /
Kamis, Russell Peter 2960 Yoder, Apt. B Midland, Michigan / US | 03 /
Lower, Loren Dale 612 Sylvan Lane Midland, Michigan / US | [1991/30] | Representative(s) | Laredo, Jack Joseph, et al Elkington and Fife, Prospect House, 8 Pembroke Road Sevenoaks Kent TN13 1XR / GB | [N/P] |
| Former [1991/30] | Laredo, Jack Joseph, et al Elkington and Fife Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | Application number, filing date | 91300115.2 | 08.01.1991 | [1991/30] | Priority number, date | US19900465702 | 16.01.1990 Original published format: US 465702 | [1991/30] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0438222 | Date: | 24.07.1991 | Language: | EN | [1991/30] | Type: | A3 Search report | No.: | EP0438222 | Date: | 22.01.1992 | Language: | EN | [1992/04] | Type: | B1 Patent specification | No.: | EP0438222 | Date: | 20.09.1995 | Language: | EN | [1995/38] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.12.1991 | Classification | IPC: | C08K9/04, C08L83/14, C08K13/02, C08L83/07 | [1991/30] | CPC: |
C09K3/1018 (EP,US);
C08K9/04 (EP,US);
C08L83/14 (EP,US);
C09K2200/0239 (EP,US)
| C-Set: |
C08K9/04, C08L83/14 (EP,US)
| Designated contracting states | BE, DE, FR, GB, IT [1991/30] | Title | German: | Silikondichtungsmasse mit niedrigem Modul | [1991/30] | English: | Low modulus silicone sealants | [1991/30] | French: | Compositions d'étanchéité avec module bas à base de siloxanes | [1991/30] | Examination procedure | 24.02.1992 | Examination requested [1992/18] | 07.12.1993 | Despatch of a communication from the examining division (Time limit: M06) | 16.06.1994 | Reply to a communication from the examining division | 01.08.1994 | Despatch of a communication from the examining division (Time limit: M04) | 20.10.1994 | Reply to a communication from the examining division | 14.12.1994 | Despatch of communication of intention to grant (Approval: Yes) | 17.03.1995 | Communication of intention to grant the patent | 19.06.1995 | Fee for grant paid | 19.06.1995 | Fee for publishing/printing paid | Opposition(s) | 21.06.1996 | No opposition filed within time limit [1996/37] | Fees paid | Renewal fee | 08.12.1992 | Renewal fee patent year 03 | 07.12.1993 | Renewal fee patent year 04 | 06.12.1994 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US4293616 (SMITH JR ALFRED H, et al); | [Y]EP0163439 (DOW CORNING [GB], et al); | [X]US4683251 (MIKAMI RYUZO [US]); | [X]US4888380 (KAMIS RUSSELL P [US], et al); | [AP]EP0369291 (BAYER AG [DE]); | [YP]EP0404326 (DOW CORNING [US]) |