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Extract from the Register of European Patents

EP About this file: EP0480585

EP0480585 - Device for conveying printed circuit board [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  31.01.1997
Database last updated on 11.09.2024
Most recent event   Tooltip07.12.2007Lapse of the patent in a contracting state
Updated state(s): FR
published on 09.01.2008  [2008/02]
Applicant(s)For all designated states
NIHON DEN-NETSU KEIKI CO., LTD.
27-1, Shimomaruko 2-chome Ohta-ku
Tokyo / JP
[N/P]
Former [1992/16]For all designated states
NIHON DEN-NETSU KEIKI CO., LTD.
27-1, Shimomaruko 2-chome
Ohta-ku Tokyo / JP
Inventor(s)01 / Kondo, Kenshi
3-5, Okura 1-chome
Setagaya-ku, Tokyo / JP
[1992/16]
Representative(s)Allam, Peter Clerk, et al
Lloyd Wise Commonwealth House, 1-19 New Oxford Street
London WC1A 1LW / GB
[N/P]
Former [1992/16]Allam, Peter Clerk, et al
LLOYD WISE, TREGEAR & CO. Norman House 105-109 Strand
London WC2R 0AE / GB
Application number, filing date91308346.512.09.1991
[1992/16]
Priority number, dateJP1990026852008.10.1990         Original published format: JP 26852090
[1992/16]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0480585
Date:15.04.1992
Language:EN
[1992/16]
Type: A3 Search report 
No.:EP0480585
Date:29.09.1993
Language:EN
[1993/39]
Type: B1 Patent specification 
No.:EP0480585
Date:27.03.1996
Language:EN
[1996/13]
Search report(s)(Supplementary) European search report - dispatched on:EP12.08.1993
ClassificationIPC:H05K13/00, B65G17/26
[1993/36]
CPC:
H05K13/0061 (EP,US); B65G17/26 (EP,US); B65G2201/02 (EP,US);
B65G2207/14 (EP,US)
Former IPC [1992/16]H05K13/00
Designated contracting statesBE,   DE,   FR,   GB,   IT,   NL [1992/16]
TitleGerman:Vorrichtung zur Förderung von Leiterplatten[1992/16]
English:Device for conveying printed circuit board[1992/16]
French:Dispositif de transport de plaquettes à circuits imprimés[1992/16]
Examination procedure14.12.1993Examination requested  [1994/06]
09.06.1995Despatch of communication of intention to grant (Approval: No)
21.09.1995Despatch of communication of intention to grant (Approval: later approval)
29.09.1995Communication of intention to grant the patent
19.12.1995Fee for grant paid
19.12.1995Fee for publishing/printing paid
Opposition(s)28.12.1996No opposition filed within time limit [1997/12]
Fees paidRenewal fee
16.09.1993Renewal fee patent year 03
08.09.1994Renewal fee patent year 04
08.09.1995Renewal fee patent year 05
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Lapses during opposition  TooltipBE27.03.1996
FR27.03.1996
IT27.03.1996
NL27.03.1996
[2006/14]
Former [2003/07]BE27.03.1996
IT27.03.1996
NL27.03.1996
FR23.08.1996
Former [1999/42]BE27.03.1996
IT27.03.1996
FR23.08.1996
Former [1997/12]BE27.03.1996
FR23.08.1996
Former [1996/52]BE27.03.1996
Documents cited:Search[A]GB2148831  (USM CORP);
 [AP]EP0393796  (SOLTEC BV [NL]);
 [A]DE3540475  (SIEMENS AG [DE]);
 [A]EP0356265  (UNIVERSAL INSTRUMENTS CORP [US]);
 [A]EP0308006  (PHILIPS NV [NL]);
 [AD]EP0317213  (NIPPON DENNETSU KEIKI KK [JP])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.