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EP0482812
European procedure
Extract from the Register of European Patents
EP About this file: EP0482812
| EP0482812 - Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.11.1998 Database last updated on 24.08.2024 | Most recent event Tooltip | 07.12.2007 | Lapse of the patent in a contracting state New state(s): NL | published on 09.01.2008 [2008/02] | Applicant(s) | For all designated states Sumitomo Electric Industries, Ltd. 5-33, Kitahama 4-chome, Chuo-ku Osaka 541 / JP | [1992/18] | Inventor(s) | 01 /
Osada, Mitsuo, c/o Itami Works Sumitomo Electric Ind.Ltd,. 1-1 Koyakita 1-chome Itami-shi, Hyogo / JP | 02 /
Kohmoto, Kenichiro, c/o Itami Works Sumitomo Electric Ind.Ltd,. 1-1 Koyakita 1-chome Itami-shi, Hyogo / JP | [1992/18] | Representative(s) | Bankes, Stephen Charles Digby, et al Baron Warren Redfern 1000 Great West Road Brentford TW8 9DW / GB | [N/P] |
| Former [1992/18] | Bankes, Stephen Charles Digby, et al BARON & WARREN 18 South End Kensington London W8 5BU / GB | Application number, filing date | 91309470.2 | 15.10.1991 | [1992/18] | Priority number, date | JP19900290092 | 26.10.1990 Original published format: JP 29009290 | [1992/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0482812 | Date: | 29.04.1992 | Language: | EN | [1992/18] | Type: | A3 Search report | No.: | EP0482812 | Date: | 20.05.1992 | Language: | EN | [1992/21] | Type: | B1 Patent specification | No.: | EP0482812 | Date: | 07.01.1998 | Language: | EN | [1998/02] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.03.1992 | Classification | IPC: | H01L23/373 | [1992/18] | CPC: |
H01L23/3736 (EP,US);
H01L2224/32188 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/73265 (EP,US);
H01L24/48 (EP,US);
H01L24/73 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01322 (EP,US);
H01L2924/14 (EP,US);
H01L2924/15153 (EP,US);
H01L2924/1517 (EP,US);
H01L2924/15312 (EP,US);
H01L2924/1532 (EP,US);
H01L2924/16195 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2224/73265, H01L2224/32245, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP); | Designated contracting states | DE, FR, GB, IT, NL [1992/18] | Title | German: | Verfahren zum Herstellen von wärmestrahlender Substraten zum Montieren von Halbleitern und gemäss diesem Verfahren hergestellte Halbleiterpackung | [1998/02] | English: | Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same | [1992/18] | French: | Procédé pour la fabrication de substrats réfroidisseurs pour le montage de semiconducteurs et empaquetage semiconducteur l'utilisant | [1992/18] |
| Former [1992/18] | Verfahren zum Herstellen von w2rmestrahlender Substraten zum Montieren von Halbleitern und gemäss diesem Verfahren hergestellte Halbleiterpackung | Examination procedure | 05.10.1992 | Examination requested [1992/50] | 12.10.1994 | Despatch of a communication from the examining division (Time limit: M04) | 16.02.1995 | Reply to a communication from the examining division | 14.09.1995 | Despatch of a communication from the examining division (Time limit: M04) | 08.01.1996 | Reply to a communication from the examining division | 12.02.1996 | Despatch of a communication from the examining division (Time limit: M02) | 13.04.1996 | Reply to a communication from the examining division | 20.02.1997 | Despatch of communication of intention to grant (Approval: Yes) | 16.06.1997 | Communication of intention to grant the patent | 25.07.1997 | Fee for grant paid | 25.07.1997 | Fee for publishing/printing paid | Opposition(s) | 08.10.1998 | No opposition filed within time limit [1998/53] | Fees paid | Renewal fee | 25.10.1993 | Renewal fee patent year 03 | 24.10.1994 | Renewal fee patent year 04 | 24.10.1995 | Renewal fee patent year 05 | 25.10.1996 | Renewal fee patent year 06 | 27.10.1997 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 11.11.1994 | 04 M02 Fee paid on 05.12.1994 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IT | 07.01.1998 | NL | 07.01.1998 | [2003/07] |
| Former [1999/42] | IT | 07.01.1998 | Documents cited: | Search | [A]JP63073651 ; | [A]DE3924225 (MITSUBISHI ELECTRIC CORP [JP]); | [A]EP0297569 (SUMITOMO ELECTRIC INDUSTRIES [JP]); | [A]EP0113088 (SUMITOMO ELECTRIC INDUSTRIES [JP]) | [A] - PATENT ABSTRACTS OF JAPAN vol. 12, no. 304 (E-646)18 August 1988 & JP-A-63 073 651 ( MITSUBISHI ELECTRIC ) 4 April 1988, & JP63073651 A 19880404 |