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Extract from the Register of European Patents

EP About this file: EP0508359

EP0508359 - Process and apparatus for coating at least one object [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  15.08.1997
Database last updated on 31.08.2024
Most recent event   Tooltip23.12.1999Lapse of the patent in a contracting state
New state(s): LU
published on 09.02.2000 [2000/06]
Applicant(s)For all designated states
BALZERS AKTIENGESELLSCHAFT
9496 Balzers / LI
[N/P]
Former [1992/42]For all designated states
BALZERS AKTIENGESELLSCHAFT
FL-9496 Balzers / LI
Inventor(s)01 / Kuegler, Eduard, Dr. Dipl.-Ing.
Rappenwaldstrasse 19
A-6807 Feldkirch-Tisis / AT
[1994/03]
Former [1993/48]01 / Kuegler, Eduard, Dr. Dipl.-Ing.
Rappenwaldstrasse 19
A-6807 Feldkirch-Tisis / AT
02 / ellerdieck, Klaus Dr. Dipl.-El.-Ing.
Turnhallenstrasse 9
CH-9470 Buchs / CH
03 / Stock, Jakob Maschinenschlosser
Tobel 35
CH-7303 Mastrils / CH
04 / Grünenfelder, Pius, Laborant.
Buelweg
CH-7323 Wangs / CH
Former [1992/42]01 / Kuegler, Eduard, Dr. Dipl.-Ing.
Rappenwaldstrasse 19
A-6807 Feldkirch-Tisis / AT
Representative(s)Troesch Scheidegger Werner AG
Patentanwälte
Postfach
8032 Zürich / CH
[N/P]
Former [1992/42]Troesch Scheidegger Werner AG
Patentanwälte, Siewerdtstrasse 95, Postfach
CH-8050 Zürich / CH
Application number, filing date92105963.007.04.1992
[1992/42]
Priority number, dateCH1991000109512.04.1991         Original published format: CH 109591
[1992/42]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0508359
Date:14.10.1992
Language:DE
[1992/42]
Type: B1 Patent specification 
No.:EP0508359
Date:09.10.1996
Language:DE
[1996/41]
Search report(s)(Supplementary) European search report - dispatched on:EP28.07.1992
ClassificationIPC:C23C14/34, C23C14/54, H01J37/34
[1992/42]
CPC:
C23C14/0094 (EP,US); C23C14/0042 (EP,US); C23C14/34 (EP,US);
H01J37/3405 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FR,   GB,   IT,   LI,   LU,   NL,   SE [1992/42]
TitleGerman:Verfahren und Anlage zur Beschichtung mindestens eines Gegenstandes[1992/42]
English:Process and apparatus for coating at least one object[1992/42]
French:Procédé et dispositif pour le revêtement d'au moins un objet[1992/42]
Examination procedure26.09.1992Examination requested  [1992/48]
24.02.1994Despatch of a communication from the examining division (Time limit: M04)
11.01.1995Despatch of a communication from the examining division (Time limit: M04)
19.05.1995Reply to a communication from the examining division
16.02.1996Despatch of communication of intention to grant (Approval: Yes)
11.04.1996Communication of intention to grant the patent
01.07.1996Fee for grant paid
01.07.1996Fee for publishing/printing paid
Opposition(s)10.07.1997No opposition filed within time limit [1997/40]
Fees paidRenewal fee
09.03.1994Renewal fee patent year 03
27.02.1995Renewal fee patent year 04
28.02.1996Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipDK09.10.1996
LU30.04.1997
[2000/06]
Former [1998/15]DK09.10.1996
Documents cited:Search[XD]JP63111173  ;
 [AD]EP0328257  (OPTICAL COATING LABORATORY INC [US]);
 [XD]EP0416241  (LEYBOLD AG [DE])
 [XD]  - PATENT ABSTRACTS OF JAPAN vol. 12, no. 353 (C-530)(3200) 21. September 1988 & JP-A-63 111 173 ( ANELVA CORP ) 16. Mai 1988, & JP63111173 A 00000000
 [AD]  - SURFACE AND COATINGS TECHNOLOGY Bd. 33, 1987, AMSTERDAM Seiten 405 - 423; SCHILLER ET AL.: 'Reactive DC high-rate sputtering as production technology'
 [A]  - JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART A. Bd. 6, Nr. 3, Juni 1988, NEW YORK US Seiten 1845 - 1848; ESTE ET AL.: 'A quasi-direct-current sputtering technique for the deposition of dielectrics at enhanced rates'
Examination   - SCHILLER ET AL.: 'Reactive DC high-rate sputtering as production technology'
    - Thin Solid Films, Vol. 101 (1983) March, No.1, Elsevier Sequoia, Lausanne, Switzerland; pages 1-5: "Effect of N2-Ar Mixing on the Reactive Sputtering Characteristics of Silicon", T. Serikawa et al.
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.