Extract from the Register of European Patents

EP About this file: EP0500189

EP0500189 - Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  03.05.1996
Database last updated on 28.03.2026
Most recent event   Tooltip03.05.2002Lapse of the patent in a contracting state
New state(s): ES
published on 19.06.2002  [2002/25]
Applicant(s)For all designated states
TULIP COMPUTERS INTERNATIONAL B.V.
Hambakenwetering 4
NL-5231 DC 's-Hertogenbosch / NL
[1992/35]
Inventor(s)01 / de Veer, Henricus Johannes Maria
Valkseweg 2
NL-5397 AP Lith / NL
[1992/35]
Representative(s)Smulders, Theodorus A.H.J., et al
Vereenigde Postbus 87930
2508 DH Den Haag / NL
[N/P]
Former [1992/35]Smulders, Theodorus A.H.J., Ir., et al
Vereenigde Octrooibureaux Nieuwe Parklaan 97
NL-2587 BN 's-Gravenhage / NL
Application number, filing date92200517.821.02.1992
[1992/35]
Priority number, dateNL1991000032122.02.1991         Original published format: NL 9100321
[1992/35]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0500189
Date:26.08.1992
Language:EN
[1992/35]
Type: B1 Patent specification 
No.:EP0500189
Date:28.06.1995
Language:EN
[1995/26]
Search report(s)(Supplementary) European search report - dispatched on:EP21.05.1992
ClassificationIPC:H05K3/30, H05K1/00
[1992/35]
CPC:
H05K1/11 (EP,US); H05K1/029 (EP,US); H05K1/0295 (EP,US);
H05K1/141 (EP,US); H05K2201/049 (EP,US); H05K2201/09227 (EP,US);
H05K2201/09954 (EP,US); H05K2201/10689 (EP,US) (-)
Designated contracting statesBE,   DE,   DK,   ES,   FR,   GB,   IT,   NL,   SE [1992/35]
TitleGerman:Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen[1995/26]
English:Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways[1992/35]
French:Dispositif pour connecter les broches de connexion d'un circuit intégré montré dans un boîtier dual-in-line (DIL) aux circuits imprimés sur une plaque à circuit imprimé de n différantes manières[1992/35]
Former [1992/35]Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf verschiedenen Weisen
Examination procedure28.01.1993Examination requested  [1993/12]
11.01.1994Despatch of a communication from the examining division (Time limit: M06)
07.07.1994Reply to a communication from the examining division
21.10.1994Despatch of communication of intention to grant (Approval: Yes)
21.12.1994Communication of intention to grant the patent
29.03.1995Fee for grant paid
29.03.1995Fee for publishing/printing paid
Opposition(s)29.03.1996No opposition filed within time limit [1996/25]
Fees paidRenewal fee
28.02.1994Renewal fee patent year 03
28.02.1995Renewal fee patent year 04
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Lapses during opposition  TooltipBE28.06.1995
DK28.06.1995
ES28.06.1995
SE28.09.1995
[2002/25]
Former [1998/15]BE28.06.1995
DK28.06.1995
SE28.09.1995
Former [1996/04]BE28.06.1995
SE28.09.1995
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