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Extract from the Register of European Patents

EP About this file: EP0547677

EP0547677 - Use of vapor-phase etching in fabrication of semiconductor-on-insulator structure [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  28.11.1997
Database last updated on 03.10.2024
Most recent event   Tooltip28.11.1997Application deemed to be withdrawnpublished on 14.01.1998 [1998/03]
Applicant(s)For all designated states
Koninklijke Philips Electronics N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
[N/P]
Former [1993/25]For all designated states
Philips Electronics N.V.
Groenewoudseweg 1
NL-5621 BA Eindhoven / NL
Inventor(s)01 / Arst, Margareth, c/o Int.Octrooibureau B.V.
Prof. Holstlaan 6
NL-5656 AA Eindhoven / NL
[1993/25]
Representative(s)Veerman, Jan Willem, et al
INTERNATIONAAL OCTROOIBUREAU B.V., Prof. Holstlaan 6
5656 AA Eindhoven / NL
[N/P]
Former [1993/25]Veerman, Jan Willem, et al
INTERNATIONAAL OCTROOIBUREAU B.V., Prof. Holstlaan 6
NL-5656 AA Eindhoven / NL
Application number, filing date92203826.009.12.1992
[1993/25]
Priority number, dateUS1991080946517.12.1991         Original published format: US 809465
[1993/25]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0547677
Date:23.06.1993
Language:EN
[1993/25]
Type: A3 Search report 
No.:EP0547677
Date:16.10.1996
[1996/42]
Search report(s)(Supplementary) European search report - dispatched on:EP29.08.1996
ClassificationIPC:H01L21/76, H01L21/306
[1993/25]
CPC:
H01L21/76251 (EP); H01L21/2007 (EP); H01L21/3065 (EP)
Designated contracting statesDE,   FR,   GB,   IT,   NL [1993/25]
TitleGerman:Verwendung einer Gasphasen-Ätzung für die Herstellung einer Struktur des SOI-Types[1993/25]
English:Use of vapor-phase etching in fabrication of semiconductor-on-insulator structure[1993/25]
French:Utilisation d'une attaque en phase vapeur pour la fabrication d'une structure du type SOI[1993/25]
File destroyed:13.09.2003
Examination procedure01.07.1997Application deemed to be withdrawn, date of legal effect  [1998/03]
20.08.1997Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [1998/03]
Fees paidRenewal fee
02.01.1995Renewal fee patent year 03
02.01.1996Renewal fee patent year 04
Penalty fee
Penalty fee Rule 85b EPC 1973
30.05.1997M01   Not yet paid
Additional fee for renewal fee
31.12.199605   M06   Not yet paid
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Documents cited:Search[PX]EP0488642  (SHIN-ETSU HANDOTAI CY) [PX] 1 * claim 1 *;
 [A]GB1066911  (STANDARD TELEPHONES AND CABLES) [A] 1-4,6-8 * claims 1-7 *;
 [A]US4897366  (HARRIS CORP.) [A] 1 * claims 1-6 *;
 [A]  - T. J.M. KUIJER ET AL., "GAS PHASE ETCHING OF SILICON WITH HCL", JOURNAL OF CRYSTAL GROWTH, AMSTERDAM NL, (1974), vol. 22, pages 29 - 33, XP000577105

DOI:   http://dx.doi.org/10.1016/0022-0248(74)90054-2
 [A]  - ABE T ET AL, "Wafer thinning without an etchstop down to 0.1 mu m", INSPEC, INSTITUTE OF ELECTRICAL ENGINEERS, STEVENAGE, GB, XP002009991 [A] 1 * abstract *
    [ ] - PROCEEDINGS OF THE FIRST INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS, PHOENIX, AZ, USA, 13-18 OCT. 1991, 1992, PENNNINGTON, NJ, USA, ELECTROCHEM. SOC, USA, pages 200 - 210
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.