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Extract from the Register of European Patents

EP About this file: EP0497596

EP0497596 - Method for fabricating integrated circuit structures [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  15.11.1996
Database last updated on 27.07.2024
Most recent event   Tooltip15.11.1996No opposition filed within time limitpublished on 02.01.1997 [1997/01]
Applicant(s)For all designated states
STMicroelectronics, Inc.
1310 Electronics Drive
Carrollton, TX 75006-5039 / US
[N/P]
Former [1992/32]For all designated states
SGS-THOMSON MICROELECTRONICS, INC.
1310 Electronics Drive
Carrollton Texas 75006 / US
Inventor(s)01 / Liou, Fu-Tai
2027 Lansdown Drive
Carrollton, Texas 75010 / US
02 / Wei, Che-Chia
4313 Purdue Circle
Plano, Texas 75093 / US
[1992/32]
Representative(s)Palmer, Roger, et al
PAGE, WHITE & FARRER 54 Doughty Street
London WC1N 2LS / GB
[1992/32]
Application number, filing date92300795.930.01.1992
[1992/32]
Priority number, dateUS1991064865031.01.1991         Original published format: US 648650
[1992/32]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0497596
Date:05.08.1992
Language:EN
[1992/32]
Type: A3 Search report 
No.:EP0497596
Date:28.10.1992
Language:EN
[1992/44]
Type: B1 Patent specification 
No.:EP0497596
Date:10.01.1996
Language:EN
[1996/02]
Search report(s)(Supplementary) European search report - dispatched on:EP07.09.1992
ClassificationIPC:H01L21/3205, H01L21/28, H01L21/285
[1992/44]
CPC:
H01L21/28052 (EP,KR); H01L21/28518 (EP,KR); H01L29/665 (EP,KR)
Former IPC [1992/32]H01L21/285
Designated contracting statesDE,   FR,   GB,   IT [1992/32]
TitleGerman:Verfahren zum Herstellen von integrierten Schaltstrukturen[1992/32]
English:Method for fabricating integrated circuit structures[1992/32]
French:Procédé de fabrication des structures de circuit intégré[1992/32]
Examination procedure16.04.1993Examination requested  [1993/24]
16.11.1993Despatch of a communication from the examining division (Time limit: M06)
19.05.1994Reply to a communication from the examining division
14.03.1995Despatch of communication of intention to grant (Approval: Yes)
11.07.1995Communication of intention to grant the patent
06.10.1995Fee for grant paid
06.10.1995Fee for publishing/printing paid
Opposition(s)11.10.1996No opposition filed within time limit [1997/01]
Fees paidRenewal fee
20.12.1993Renewal fee patent year 03
16.01.1995Renewal fee patent year 04
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Documents cited:Search[A]US4470189  (ROBERTS STANLEY [US], et al);
 [A]US4128670  (GAENSSLEN FRITZ H);
 [A]EP0071029  (IBM [US])
 [A]  - JOURNAL OF THE ELECTROCHEMICAL SOCIETY. vol. 133, no. 11, November 1986, MANCHESTER, NEW HAMPSHIRE US pages 2386 - 2389; M. LIN ET AL.: 'An Environment-Insensitive Trilayer Structure for Titanium Silicide Formation'
 [A]  - JAPANESE JOURNAL OF APPLIED PHYSICS, SUPPLEMENTS. vol. 20, 1981, TOKYO JA pages 49 - 54; S. SAITHO ET AL.: 'Formation of a Double-Hetero Si/CoSi2/Si Structure Using Molecular Beam and Solid Phase Epitaxies' Supplement 20-1
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 22, no. 2, July 1979, NEW YORK US pages 598 - 599; J.K. HOWARD: 'High Conductivity Transition Metal Silicide (NbSi2) for FET Gate Structures'
 [A]  - APPLIED PHYSICS LETTERS. vol. 50, no. 14, 6 April 1987, NEW YORK US pages 933 - 934; H.T.G. HENTZELL ET AL.: 'Formation of Aluminum Silicide between Two Layers of Amorphous Silicon'
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.