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EP0516334
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EP About this file: EP0516334
| EP0516334 - Method of etching a window in a dielectric layer on an integrated circuit and planarization thereof [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 18.05.2001 Database last updated on 29.10.2024 | Most recent event Tooltip | 05.10.2005 | Change: Appeal number | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1992/49] | Inventor(s) | 01 /
Lee, Kuo-Hua 1308, Country Club Road Wescosville, Pennsylvania 18106 / US | 02 /
Yu, Chen-Hua Douglas 1019 Hillview Drive Allentown, Pennsylvania 18103 / US | [1992/49] | Representative(s) | Watts, Christopher Malcolm Kelway, et al Lucent Technologies (UK) Ltd, 5 Mornington Road Woodford Green Essex IG8 OTU / GB | [N/P] |
| Former [1992/49] | Watts, Christopher Malcolm Kelway, Dr., et al AT&T (UK) LTD. AT&T Intellectual Property Division 5 Mornington Road Woodford Green Essex IG8 OTU / GB | Application number, filing date | 92304590.0 | 20.05.1992 | [1992/49] | Priority number, date | US19910707721 | 30.05.1991 Original published format: US 707721 | [1992/49] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0516334 | Date: | 02.12.1992 | Language: | EN | [1992/49] | Type: | A3 Search report | No.: | EP0516334 | Date: | 09.12.1992 | Language: | EN | [1992/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.10.1992 | Classification | IPC: | H01L21/90, H01L21/311, H01L21/3105 | [1992/50] | CPC: |
H01L21/3105 (EP,US);
H01L21/76804 (EP,US)
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| Former IPC [1992/49] | H01L21/3105, H01L21/90, H01L21/311 | Designated contracting states | DE, ES, FR, GB, IT [1992/49] | Title | German: | Verfahren zum Ätzen einer Öffnung in einer dielektrischen Schicht über einer integrierten Schaltung und ihre Planarisierung | [1992/49] | English: | Method of etching a window in a dielectric layer on an integrated circuit and planarization thereof | [1992/49] | French: | Méthode d'attaque d'une fenêtre dans une couche diélectrique sur un circuit intégré et sa planarisation | [1992/49] | Examination procedure | 26.05.1993 | Examination requested [1993/30] | 31.03.1995 | Despatch of a communication from the examining division (Time limit: M06) | 03.10.1995 | Reply to a communication from the examining division | 15.04.1996 | Despatch of communication that the application is refused, reason: substantive examination {1} | 01.12.2000 | Application deemed to be withdrawn, date of legal effect [2001/27] | 10.01.2001 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2001/27] | Appeal following examination | 12.06.1996 | Appeal received No. T1104/96 | 15.08.1996 | Statement of grounds filed | 08.03.2001 | Invitation to file observations in an appeal (Time limit: M02) [2001/10] | 18.12.2001 | Result of appeal procedure: the application was deemed to be withdrawn | Fees paid | Renewal fee | 12.05.1994 | Renewal fee patent year 03 | 12.05.1995 | Renewal fee patent year 04 | 20.05.1996 | Renewal fee patent year 05 | 20.05.1997 | Renewal fee patent year 06 | 18.05.1998 | Renewal fee patent year 07 | 14.05.1999 | Renewal fee patent year 08 | Penalty fee | Additional fee for renewal fee | 31.05.2000 | 09 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US4948743 (OZAKI HIDETO [JP]); | [A]DE2723499 (LICENTIA GMBH); | [A]US4916091 (FREEMAN DEAN W [US], et al) | [X] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 28, no. 11, April 1986, NEW YORK US pages 4921 - 4922 'TECHNIQUE FOR TAPERING CONTACT WINDOWS' |