EP0526244 - Method of forming a polysilicon buried contact [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.11.2000 Database last updated on 18.11.2024 | Most recent event Tooltip | 03.11.2000 | No opposition filed within time limit | published on 20.12.2000 [2000/51] | Applicant(s) | For all designated states STMicroelectronics, Inc. 1310 Electronics Drive Carrollton, TX 75006-5039 / US | [1999/08] |
Former [1993/05] | For all designated states SGS-THOMSON MICROELECTRONICS, INC. 1310 Electronics Drive Carrollton Texas 75006 / US | Inventor(s) | 01 /
Kalnitsky, Alexander 6651 Clearhaven Circle Dallas, Texas 75248 / US | [1993/05] | Representative(s) | Palmer, Roger, et al PAGE, WHITE & FARRER 54 Doughty Street London WC1N 2LS / GB | [1993/05] | Application number, filing date | 92307018.9 | 30.07.1992 | [1993/05] | Priority number, date | US19910738474 | 31.07.1991 Original published format: US 738474 | [1993/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0526244 | Date: | 03.02.1993 | Language: | EN | [1993/05] | Type: | A3 Search report | No.: | EP0526244 | Date: | 18.08.1993 | Language: | EN | [1993/33] | Type: | B1 Patent specification | No.: | EP0526244 | Date: | 05.01.2000 | Language: | EN | [2000/01] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 29.06.1993 | Classification | IPC: | H01L21/74 | [1993/05] | CPC: |
H01L21/743 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1993/05] | Title | German: | Verfahren zur Herstellung eines vergrabenen Kontaktes aus Polysilizium | [1993/05] | English: | Method of forming a polysilicon buried contact | [1993/05] | French: | Procédé de formation d'un contact enterré en silicium polycristallin | [1993/05] | Examination procedure | 11.02.1994 | Examination requested [1994/15] | 01.06.1995 | Despatch of a communication from the examining division (Time limit: M06) | 11.12.1995 | Reply to a communication from the examining division | 21.05.1996 | Despatch of a communication from the examining division (Time limit: M06) | 02.12.1996 | Reply to a communication from the examining division | 15.05.1997 | Despatch of a communication from the examining division (Time limit: M06) | 29.12.1997 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time | 03.03.1998 | Reply to a communication from the examining division | 25.03.1999 | Despatch of communication of intention to grant (Approval: Yes) | 02.07.1999 | Communication of intention to grant the patent | 25.09.1999 | Fee for grant paid | 25.09.1999 | Fee for publishing/printing paid | Divisional application(s) | EP98201812.9 / EP0877420 | Opposition(s) | 06.10.2000 | No opposition filed within time limit [2000/51] | Request for further processing for: | 03.03.1998 | Request for further processing filed | 03.03.1998 | Full payment received (date of receipt of payment) Request granted | 18.03.1998 | Decision despatched | Fees paid | Renewal fee | 07.07.1994 | Renewal fee patent year 03 | 08.05.1995 | Renewal fee patent year 04 | 16.07.1996 | Renewal fee patent year 05 | 29.07.1997 | Renewal fee patent year 06 | 21.07.1998 | Renewal fee patent year 07 | 28.07.1999 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0209794 (FUJITSU LTD [JP]); | [A]US4413402 (ERB DARRELL M [US]); | [A]US4033026 (PASHLEY RICHARD D); | [A]US4657628 (HOLLOWAY THOMAS C [US], et al); | [A]US4187602 (MCELROY DAVID J [US]) | [Y] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 25, no. 8, January 1983, NEW YORK US pages 4425 - 4426 R. C. DOCKERTY | [Y] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 25, no. 8, January 1983, NEW YORK US pages 4067 - 4068 A. EDENFELD ET AL | [Y] - HEWLETT-PACKARD JOURNAL vol. 33, no. 10, October 1982, AMSTELVEEN NL pages 21 - 27 HORNG-SEN FU ET AL | [A] - IBM TECHNICAL DISCLOSURE BULLETIN. vol. 24, no. 7B, December 1981, NEW YORK US pages 3696 - 3697 G. J. HU ET AL | [A] - PHILIPS JOURNAL OF RESEARCH vol. 44, no. 2/3, 28 July 1989, EINDHOVEN NL pages 257 - 291 K. OSINSKI ET AL |