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Extract from the Register of European Patents

EP About this file: EP0577099

EP0577099 - Cooling apparatus for electronic elements [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  11.12.1998
Database last updated on 03.08.2024
Most recent event   Tooltip11.12.1998No opposition filed within time limitpublished on 27.01.1999 [1999/04]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo 101 / JP
[N/P]
Former [1994/01]For all designated states
HITACHI, LTD.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101 / JP
Inventor(s)01 / Kuwahara, Heikichi
33-11, Komatsu-1-chome
Tsuchiura-shi / JP
02 / Fujioka, Kazumasa
1-25-2, Inayoshiminami, Chiyodamachi
Niiharu-gun, Ibaraki-ken / JP
03 / Takasaki, Toshio
10-1, Aobacho
Katsuta-shi / JP
04 / Saitoo, Syuuji
2153-43, Tsuda
Katsuta-shi / JP
05 / Toyota, Eiichi
1432-5, Ikazuchi
Tabiko, Katsuta-shi / JP
[1994/01]
Representative(s)Beetz & Partner mbB
Patentanwälte
Prinzregentenstraße 54
80538 München / DE
[N/P]
Former [1994/11]Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr
Steinsdorfstrasse 10
D-80538 München / DE
Former [1994/01]Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr
Steinsdorfstrasse 10
D-80538 München / DE
Application number, filing date93110438.430.06.1993
[1994/01]
Priority number, dateJP1992017649703.07.1992         Original published format: JP 17649792
[1994/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0577099
Date:05.01.1994
Language:EN
[1994/01]
Type: A3 Search report 
No.:EP0577099
Date:16.03.1994
Language:EN
[1994/11]
Type: B1 Patent specification 
No.:EP0577099
Date:04.02.1998
Language:EN
[1998/06]
Search report(s)(Supplementary) European search report - dispatched on:EP25.01.1994
ClassificationIPC:H01L23/367, H01L23/40, H01L23/427
[1994/06]
CPC:
H01L23/427 (EP,US); H01L23/34 (KR); F28D15/0275 (EP,US);
H01L25/072 (EP,US); H05K7/20936 (EP,US); H01L2924/0002 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Former IPC [1994/01]H01L23/367, H01L23/40
Designated contracting statesCH,   DE,   FR,   LI [1994/01]
TitleGerman:Kühlvorrichtung für elektronische Elemente[1994/01]
English:Cooling apparatus for electronic elements[1994/01]
French:Appareil de refroidissement pour éléments électroniques[1994/01]
Examination procedure07.02.1994Examination requested  [1994/14]
04.08.1995Despatch of a communication from the examining division (Time limit: M06)
14.02.1996Reply to a communication from the examining division
18.07.1996Despatch of a communication from the examining division (Time limit: M02)
30.09.1996Reply to a communication from the examining division
21.05.1997Despatch of communication of intention to grant (Approval: Yes)
06.08.1997Communication of intention to grant the patent
27.10.1997Fee for grant paid
27.10.1997Fee for publishing/printing paid
Opposition(s)05.11.1998No opposition filed within time limit [1999/04]
Fees paidRenewal fee
29.06.1995Renewal fee patent year 03
28.06.1996Renewal fee patent year 04
26.06.1997Renewal fee patent year 05
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Documents cited:Search[A]FR2288395  (GEN ELECTRIC [US]);
 [A]DE2825582  (GEN ELECTRIC)
ExaminationJP1192148
 EP0363687
    - W. Bresch, "Hybride Leistungs-IC", Technische Rundschau, 78 (1986), Nov., No. 45, Bern, Schweiz, 106-109
    - PATENT ABSTRACTS OF JAPAN vol. 13 no. 483, 2nd November 1989 (E-839); & JP-A-1 192 148, & JP1192148 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.