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EP0590635
European procedure
Extract from the Register of European Patents
EP About this file: EP0590635
| EP0590635 - A method for producing a multi-layered printed wiring board [Right-click to bookmark this link] | |||
| Former [1994/14] | A plating method, a method for producing a multi-layered printed wiring board using the same, and the multi-layered printed wiring board | ||
| [1996/29] | Status | No opposition filed within time limit Status updated on 23.05.1997 Database last updated on 06.07.2024 | Most recent event Tooltip | 17.10.2008 | Change - applicant | published on 19.11.2008 [2008/47] | Applicant(s) | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [2008/47] |
| Former [1994/14] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Ohaza Kadoma Kadoma-shi, Osaka 571 / JP | Inventor(s) | 01 /
Nakamura, Tsuneshi 11-24-48, Korigaoka Hirakata-shi, Osaka / JP | [1994/14] | Representative(s) | SSM Sandmair Patentanwälte Rechtsanwalt Partnerschaft mbB Joseph-Wild-Straße 20 81829 München / DE | [N/P] |
| Former [1994/14] | Schwabe - Sandmair - Marx Stuntzstrasse 16 D-81677 München / DE | Application number, filing date | 93115712.7 | 29.09.1993 | [1994/14] | Priority number, date | JP19920259548 | 29.09.1992 Original published format: JP 25954892 | [1994/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0590635 | Date: | 06.04.1994 | Language: | EN | [1994/14] | Type: | B1 Patent specification | No.: | EP0590635 | Date: | 17.07.1996 | Language: | EN | [1996/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.02.1994 | Classification | IPC: | C23C18/22, H05K3/38, H05K3/46 | [1994/14] | CPC: |
C23C18/22 (EP);
H05K3/381 (EP);
H05K3/4661 (EP);
H05K1/16 (EP);
H05K1/167 (EP);
H05K2201/0209 (EP);
H05K2201/09509 (EP);
H05K2203/025 (EP);
H05K2203/0285 (EP);
H05K2203/0773 (EP);
H05K3/0094 (EP);
H05K3/426 (EP);
H05K3/4602 (EP)
(-)
| Designated contracting states | DE, GB [1994/14] | Title | German: | Verfahren zur Herstellung einer mehrschichtigen Leiterplatte | [1996/29] | English: | A method for producing a multi-layered printed wiring board | [1996/29] | French: | Procédé pour la fabrication d'une plaque à circuit imprimé multicouche | [1996/29] |
| Former [1994/14] | Plattierungsverfahren, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte unter Verwendung desselben, und die mehrschichtige Leiterplatte | ||
| Former [1994/14] | A plating method, a method for producing a multi-layered printed wiring board using the same, and the multi-layered printed wiring board | ||
| Former [1994/14] | Procédé de plaquage, procédé pour la fabrication d'une plaque à circuit imprimé multicouche en l'utilisant, et la plaque à circuit imprimé multicouche | Examination procedure | 29.09.1993 | Examination requested [1994/14] | 06.02.1995 | Despatch of a communication from the examining division (Time limit: M05) | 29.06.1995 | Reply to a communication from the examining division | 28.07.1995 | Despatch of a communication from the examining division (Time limit: M04) | 14.09.1995 | Reply to a communication from the examining division | 30.10.1995 | Despatch of communication of intention to grant (Approval: Yes) | 18.01.1996 | Communication of intention to grant the patent | 01.04.1996 | Fee for grant paid | 01.04.1996 | Fee for publishing/printing paid | Opposition(s) | 18.04.1997 | No opposition filed within time limit [1997/28] | Fees paid | Renewal fee | 30.08.1995 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]GB1276527 (INTERNATIONAL ELECTRONIC RESEARCH CORPORATION) [X] 1,4,6 * page 3, line 93 - page 4, line 14; figures 3-6 * [Y] 7,8,10,12,13,16-18,21-24; | [Y]EP0478313 (INTERNATIONAL BUSINESS MACHINES CORPORATION) [Y] 7,8,10,12,13,24 * figure 2; claims 8,10 *; | [D]JPH04148590 (...); | [Y]EP0379686 (NIPPON CMK CORPORATION) [Y] 16-18,21-23 * the whole document *; | [X]JPS52123334 ; | [A]EP0197323 (BAYER AG) [A] 1,2,6,7,12,15,24,25 * column 2, line 20 - line 43 * * column 3, line 18 - line 20 * * column 5, line 6 - line 15 * * column 8, line 33 - line 35 *; | [A]FR2227109 (CANON KABUSHIKI KAISHA) [A] 1,3,9,20 * page 5, line 3 - line 9 *; | [A]DE3913966 (IBIDEN CO.) [A] 7,12,13,24,25 * figure -; claim 14 * | [XA] - A.F. BOGENSCHÜTZ ET AL., "Vergleichende Untersuchungen an verschiedenen Vorbehandlungsmethoden für unkaschierte Leiterplatten-Basismaterialien", GALVANOTECHNIK, SAULGAU/WURTT DE, (198303), vol. 74, no. 3, pages 269 - 274 [X] 1,2 * page 270: 2. Mechanische Aufrauhung * [A] 8,19 | [X] - DATABASE WPI, 0, Derwent World Patents Index, vol. 77, no. 47, Database accession no. 77-83991Y, & JPS52123334 A 19771017 (DAINI SEIKOSHA) [X] 1 * abstract * |