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EP0595343
European procedure
Extract from the Register of European Patents
EP About this file: EP0595343
| EP0595343 - Method of forming solder film [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 23.12.1998 Database last updated on 12.07.2024 | Most recent event Tooltip | 23.12.1998 | No opposition filed within time limit | published on 10.02.1999 [1999/06] | Applicant(s) | For all designated states SHOWA DENKO K.K. 13-9, Shiba Daimon 1-chome Minato-ku, Tokyo / JP | [N/P] |
| Former [1994/18] | For all designated states SHOWA DENKO KABUSHIKI KAISHA 13-9, Shiba Daimon 1-chome Minato-ku, Tokyo / JP | Inventor(s) | 01 /
Kuramoto, Takeo c/o Showa Denko K.K., 13-9, Shibadaimon 1-chome Minato-ku, Tokyo / JP | 02 /
Watabe, Masataka c/o Showa Denko K.K., 13-9, Shibadaimon 1-chome Minato-ku, Tokyo / JP | 03 /
Noda, Satoshi c/o Showa Denko K.K., 13-9, Shibadaimon 1-chome Minato-ku, Tokyo / JP | 04 /
Shoji, Takashi c/o Showa Denko K.K., Chichibu Res. 1505, Shimokagemori, Chichibu-shi Saitama / JP | 05 /
Sakai, Takekazu c/o Showa Denko K.K., 13-9, Shibadaimon 1-chome Minato-ku, Tokyo / JP | [1994/18] | Representative(s) | Henkel & Partner mbB Patentanwaltskanzlei, Rechtsanwaltskanzlei Maximiliansplatz 21 80333 München / DE | [N/P] |
| Former [1994/18] | Henkel, Feiler, Hänzel & Partner Möhlstrasse 37 D-81675 München / DE | Application number, filing date | 93117573.1 | 29.10.1993 | [1994/18] | Priority number, date | JP19920315738 | 30.10.1992 Original published format: JP 31573892 | JP19930019366 | 11.01.1993 Original published format: JP 1936693 | [1994/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0595343 | Date: | 04.05.1994 | Language: | EN | [1994/18] | Type: | A3 Search report | No.: | EP0595343 | Date: | 08.06.1994 | Language: | EN | [1994/23] | Type: | B1 Patent specification | No.: | EP0595343 | Date: | 18.02.1998 | Language: | EN | [1998/08] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.04.1994 | Classification | IPC: | H05K3/34, B23K35/36, B23K35/02 | [1994/23] | CPC: |
B23K3/0607 (EP);
B23K3/0623 (EP);
B23K35/0244 (EP);
B23K35/3613 (EP);
B23K35/3615 (EP);
H01L23/49582 (EP);
H05K3/3485 (EP);
B23K2101/40 (EP);
B23K2101/42 (EP);
H01L2924/0002 (EP);
H05K2201/10984 (EP);
H05K2203/0425 (EP);
H05K2203/043 (EP);
H05K2203/0522 (EP);
H05K2203/0557 (EP);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP)
|
| Former IPC [1994/18] | H05K3/34, B23K35/36 | Designated contracting states | DE, FR, GB [1994/18] | Title | German: | Verfahren zum Bilden eines Lotfilms | [1994/18] | English: | Method of forming solder film | [1994/18] | French: | Procédé de formation d'un film de soudure | [1994/18] | Examination procedure | 06.07.1994 | Examination requested [1994/35] | 07.07.1995 | Despatch of a communication from the examining division (Time limit: M04) | 16.11.1995 | Reply to a communication from the examining division | 30.10.1996 | Despatch of communication of intention to grant (Approval: No) | 31.07.1997 | Despatch of communication of intention to grant (Approval: later approval) | 06.08.1997 | Communication of intention to grant the patent | 04.11.1997 | Fee for grant paid | 04.11.1997 | Fee for publishing/printing paid | Opposition(s) | 19.11.1998 | No opposition filed within time limit [1999/06] | Fees paid | Renewal fee | 26.10.1995 | Renewal fee patent year 03 | 28.10.1996 | Renewal fee patent year 04 | 31.10.1997 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP0285266 (ICI PLC [GB]) [Y] 1-3,5,10 * column 1, line 23 - line 55 * * column 3, line 34 - line 38 * * column 4, line 23 - line 43 *; | [Y]JPH04279088 ; | [AX]EP0428383 (SHIKOKU CHEM [JP]) [A] 1,3,5,10 * page 4, line 11 - line 46 * [X] 12; | [A]US3716421 (BURKHART J, et al) [A] 1,12 * column 1, line 34 - line 67 *; | [DA]JPH0350853 ; | [A]JPH01227491 ; | [DA]JPH0410694 ; | [A]JPH03238195 ; | [A]JPH03221295 ; | [A]JPS5751255 ; | [A]US4298407 (TAYLOR BARRY E) [A] 13 * claims 1-6 *; | [A]US3736653 (MAIERSON T, et al) [A] 13 * column 2, line 35 - column 3, line 9 *; | [A]US4380518 (WYDRO SR RICHARD A) [A] 13 * claim - * | [Y] - PATENT ABSTRACTS OF JAPAN, (19930218), vol. 017, no. 081, Database accession no. (E - 1321), & JP04279088 A 19921005 (SONY CORP) [Y] 1-3,5,10 * abstract * | [DA] - PATENT ABSTRACTS OF JAPAN, (19910516), vol. 015, no. 191, Database accession no. (E - 1068), & JP03050853 A 19910305 (TOSHIBA CORP.) [DA] 1,2,4,8,9 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19891207), vol. 013, no. 548, Database accession no. (E - 856), & JP01227491 A 19890911 (MATSUSHITA ELECTRIC IND CO) [A] 1,2,4,7-9 * abstract * | [DA] - PATENT ABSTRACTS OF JAPAN, (19920417), vol. 016, no. 158, Database accession no. (E - 1191), & JP04010694 A 19920114 (TOSHIBA CORP) [DA] 1-3,10 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19920122), vol. 016, no. 026, Database accession no. (M - 1202), & JP03238195 A 19911023 (NIPPON ALPHA METALS KK) [A] 1 * abstract * | [A] - DATABASE WPI, 0, Derwent World Patents Index, vol. 91, no. 45, Database accession no. 91-329848, & JPH03221295 A 19910930 (UCHIHASHI ESTEK KK) [A] 1 * abstract * | [A] - DATABASE WPI, 0, Derwent World Patents Index, vol. 82, no. 18, Database accession no. 82-36159, & JPS5751255 A 19820326 (NIPPON ELECTRIC KK) [A] 6 * abstract * |