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Extract from the Register of European Patents

EP About this file: EP0600423

EP0600423 - Apparatus for contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions [Right-click to bookmark this link]
Former [1994/23]Contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions
[1999/16]
StatusNo opposition filed within time limit
Status updated on  01.12.2000
Database last updated on 20.12.2024
Most recent event   Tooltip01.12.2000No opposition filed within time limitpublished on 17.01.2001 [2001/03]
Applicant(s)For all designated states
NEC Corporation
7-1, Shiba 5-chome Minato-ku
Tokyo 108-8001 / JP
[N/P]
Former [2000/05]For all designated states
NEC CORPORATION
7-1, Shiba 5-chome, Minato-ku
Tokyo / JP
Former [1994/23]For all designated states
NEC CORPORATION
7-1, Shiba 5-chome Minato-ku
Tokyo / JP
Inventor(s)01 / Isobe, Akira, c/o NEC Corporation
7-1, Shiba 5-chome, Minato-ku
Tokyo / JP
[1994/23]
Representative(s)Glawe, Delfs, Moll
Partnerschaft mbB von
Patent- und Rechtsanwälten
Postfach 26 01 62
80058 München / DE
[N/P]
Former [1994/23]Glawe, Delfs, Moll & Partner
Patentanwälte Postfach 26 01 62
D-80058 München / DE
Application number, filing date93119232.229.11.1993
[1994/23]
Priority number, dateJP1992031955130.11.1992         Original published format: JP 31955192
[1994/23]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0600423
Date:08.06.1994
Language:EN
[1994/23]
Type: B1 Patent specification 
No.:EP0600423
Date:02.02.2000
Language:EN
[2000/05]
Search report(s)(Supplementary) European search report - dispatched on:EP04.03.1994
ClassificationIPC:H01L21/768, H01L21/321
[1999/16]
CPC:
H01L21/32115 (EP,US); H01L21/76882 (EP,US)
Former IPC [1994/23]H01L21/90, H01L21/321
Designated contracting statesDE,   FR,   GB [1994/23]
TitleGerman:Vorrrichtung zur Kontaktlochauffüllung in einem Halbleiterelement durch Bestrahlung mit einem Plasma aus inerten Gasionen[1999/16]
English:Apparatus for contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions[1999/16]
French:Appareil pour le remplissage de trous de contact dans un dispositif semi-conducteur par irradiation au moyen d'un plasma d'ions de gaz inerte[1999/16]
Former [1994/23]Kontaktlochauffüllung in einem Halbleiterelement durch Bestrahlung mit einem Plasma aus inerten Gasionen
Former [1994/23]Contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions
Former [1994/23]Remplissage de trous de contact dans un dispositif semi-conducteur par irradiation au moyen d'un plasma d'ions de gaz inerte
Examination procedure17.03.1994Examination requested  [1994/23]
21.01.1997Despatch of a communication from the examining division (Time limit: M06)
25.07.1997Reply to a communication from the examining division
13.02.1998Despatch of a communication from the examining division (Time limit: M06)
24.08.1998Reply to a communication from the examining division
12.04.1999Despatch of communication of intention to grant (Approval: Yes)
09.07.1999Communication of intention to grant the patent
12.10.1999Fee for grant paid
12.10.1999Fee for publishing/printing paid
Opposition(s)03.11.2000No opposition filed within time limit [2001/03]
Fees paidRenewal fee
16.11.1995Renewal fee patent year 03
19.11.1996Renewal fee patent year 04
19.11.1997Renewal fee patent year 05
19.11.1998Renewal fee patent year 06
19.11.1999Renewal fee patent year 07
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Documents cited:Search[X]EP0202572  (NIPPON TELEGRAPH & TELEPHONE [JP]) [X] 1,5 * page 5, line 21 - line 24 * * page 13, line 26 - page 14, line 4 * * page 15, line 11 - line 18 * * page 19, line 9 - line 20 *;
 [A]GB2245596  (SAMSUNG ELECTRONICS CO LTD [KR]) [A] 1,9 * page 6, line 15 - page 7, line 7 *;
 [A]EP0401688  (FUJITSU LTD [JP]) [A] 1 * column 5, line 8 - line 55 *;
 [A]EP0251253  (FABBIANI BRUNO)
Examination   - A. SHERMAN, chemical vapor deposition for microelectronics, USA, NOYES PUBL.
    - B. CHAPMAN, Glow Discharge Processes, USA, JOHN WILEY
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.