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EP About this file: EP0589678

EP0589678 - Hermetic protection for integrated circuits [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 26.01.2001 Database last updated on 02.11.2024
Most recent event Tooltip	26.01.2001	Application deemed to be withdrawn	published on 14.03.2001 [2001/11]
Applicant(s)	For all designated states Dow Corning Corporation 3901 S. Saginaw Road Midland, Michigan 48686-0994 / US
	[N/P]
Former [1994/13]	For all designated states DOW CORNING CORPORATION 3901 S. Saginaw Road Midland Michigan 48686-0994 / US
Inventor(s)	01 / Keith Winton, Michael 2715 Siebert Midland, Michigan / US
	[1994/13]
Representative(s)	Kyle, Diana Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB
	[N/P]
Former [1994/35]	Kyle, Diana Elkington and Fife Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB
Former [1994/13]	Kyle, Diana ELKINGTON AND FIFE Prospect House, 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB
Application number, filing date	93307461.9	21.09.1993
	[1994/13]
Priority number, date	US19920948570	23.09.1992 Original published format: US 948570
	[1994/13]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0589678
	Date:	30.03.1994
	Language:	EN
	[1994/13]
	Type:	A3 Search report
	No.:	EP0589678
	Date:	12.04.1995
	Language:	EN
	[1995/15]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	21.02.1995
Classification	IPC:	H01L23/29, H01L23/31, H01L21/56, H01L23/02	[1995/13]
	CPC:	H01L24/05 (EP,US); H01L21/56 (KR); H01L21/60 (KR); H01L23/291 (EP,US); H01L23/3171 (EP,US); H01L23/3192 (EP,US); (+) H01L2224/02166 (EP,US); H01L2224/05184 (EP,US); H01L2224/05624 (EP,US); H01L2224/05639 (EP,US); H01L2224/05644 (EP,US); H01L2224/05647 (EP,US); H01L2924/00013 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01014 (EP,US); H01L2924/01022 (EP,US); H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01047 (EP,US); H01L2924/0105 (EP,US); H01L2924/01074 (EP,US); H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/01327 (EP,US); H01L2924/014 (EP,US); H01L2924/04941 (EP,US); H01L2924/12036 (EP,US); H01L2924/12042 (EP,US); H01L2924/14 (EP,US) (-)
	C-Set:	H01L2224/05624, H01L2924/00014 (US,EP); H01L2224/05644, H01L2924/00014 (US,EP); H01L2224/05647, H01L2924/00014 (US,EP); H01L2924/00013, H01L2224/29099 (US,EP); (+) H01L2924/12036, H01L2924/00 (EP,US); H01L2924/12042, H01L2924/00 (EP,US); H01L2924/14, H01L2924/00 (EP,US) (-)
	Former IPC [1994/13]	H01L23/02
Designated contracting states	DE, FR, GB, IT, NL [1994/13]
Title	German:	Hermetischer Schutz für integrierte Schaltungen	[1994/13]
	English:	Hermetic protection for integrated circuits	[1994/13]
	French:	Protection hermétique pour circuits intégrés	[1994/13]
Examination procedure	15.05.1995	Examination requested [1995/28]
	06.03.1998	Despatch of a communication from the examining division (Time limit: M04)
	25.06.1998	Reply to a communication from the examining division
	14.04.2000	Despatch of a communication from the examining division (Time limit: M04)
	25.08.2000	Application deemed to be withdrawn, date of legal effect [2001/11]
	20.10.2000	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2001/11]
Fees paid	Renewal fee
	06.06.1995	Renewal fee patent year 03
	07.06.1996	Renewal fee patent year 04
	05.06.1997	Renewal fee patent year 05
	06.08.1998	Renewal fee patent year 06
	05.08.1999	Renewal fee patent year 07
	31.07.2000	Renewal fee patent year 08
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]JPS5748247 ;
		[A]JPS58166748 ;
		[A]US4622576 (BUYNOSKI MATTHEW S [US]) [A] 1-6 * column 1, line 6 - line 39 * * column 3, line 3 - line 23 ** column 3, line 35 - line 68; figure 2 *;
		[A]GB2184288 (NAT SEMICONDUCTOR CORP) [A] 1-5 * page 2, line 57 - line 118; figures 1-6 *;
		[A]DE4118165 (MITSUBISHI ELECTRIC CORP [JP]) [A] 1,5 * column 1, line 18 - line 45; figures 1,2 * * column 8, line 19 - column 9, line 17; figures 12-15 *;
		[XY]US5136364 (BYRNE ROBERT C [US]) [X] 1-6 * column 1, line 5 - line 24 * * column 1, line 57 - line 68 * * column 2, line 16 - line 46; figures 1,2 * * column 2, line 59 - column 3, line 13; figures 3,4; claims 1,2,6-8 * [Y] 7;
		[YA]DE4201792 (MITSUBISHI ELECTRIC CORP [JP]) [Y] 7 * column 4, line 68 - column 5, line 21; figure 1 * * column 5, line 48 - column 6, line 47; figures 2B-2G * * column 7, line 9 - line 20; figure 7 * * column 7, line 30 - line 35; figure 9; claims 1,3,9,12 * [A] 1,5
		[X] - PATENT ABSTRACTS OF JAPAN, (19820703), vol. 6, no. 119, Database accession no. (E - 116), & JP57048247 A 19820319 (OKI DENKI KOGYO K.K.) [X] 1,5 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19831227), vol. 7, no. 292, Database accession no. (E - 219), & JP58166748 A 19831001 (HITACHI SEISAKUSHO K.K.) [A] 1,5 * abstract *

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