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EP0608603
European procedure
Extract from the Register of European Patents
EP About this file: EP0608603
| EP0608603 - Copper-based metallization for hybrid integrated circuits [Right-click to bookmark this link] | |||
| Former [1994/31] | Improved copper-based metallizations for hybrid integrated circuits | ||
| [1998/19] | Status | No opposition filed within time limit Status updated on 05.11.1999 Database last updated on 04.11.2024 | Most recent event Tooltip | 05.11.1999 | No opposition filed within time limit | published on 22.12.1999 [1999/51] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1994/40] |
| Former [1994/31] | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | Inventor(s) | 01 /
Frankenthal, Robert Peter 18 Dunnder Drive Summit, New Jersey 07901 / US | 02 /
Ibidunni, Ajibola O. 30 Riverview Circle Litchfield, New Hampshire 03051 / US | 03 /
Krause, Dennis Lyle 16 Maple Avenue Atkinson, New Hampshire 03811 / US | [1994/31] | Representative(s) | Johnston, Kenneth Graham, et al Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue Enfield, EN3 7XB / GB | [N/P] |
| Former [1994/31] | Johnston, Kenneth Graham, et al AT&T (UK) Ltd. 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 93308338.8 | 20.10.1993 | [1994/31] | Priority number, date | US19920968810 | 30.10.1992 Original published format: US 968810 | [1994/31] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0608603 | Date: | 03.08.1994 | Language: | EN | [1994/31] | Type: | B1 Patent specification | No.: | EP0608603 | Date: | 30.12.1998 | Language: | EN | [1998/53] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 14.06.1994 | Classification | IPC: | H01L23/498 | [1994/31] | CPC: |
H05K3/244 (EP,US);
H01L21/302 (KR);
C23C28/021 (EP,US);
C25D5/022 (EP,US);
C25D5/12 (EP,KR,US);
H01L23/49866 (EP,US);
H05K3/108 (EP,US);
H05K3/388 (EP,US);
H01L2924/0002 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, ES, FR, GB, NL [1994/31] | Title | German: | Kupferbasierte Metallisierung für hybride integrierte Schaltungen | [1998/19] | English: | Copper-based metallization for hybrid integrated circuits | [1998/19] | French: | Métallisation à base de cuivre pour circuits intégrés hybrides | [1998/19] |
| Former [1994/31] | Verbesserte kupferbasierte Metallisierung für hybride integrierte Schaltungen | ||
| Former [1994/31] | Improved copper-based metallizations for hybrid integrated circuits | ||
| Former [1994/31] | Métallisations améliorées à base de cuivre pour circuits intégrés hybrides. | Examination procedure | 19.01.1995 | Examination requested [1995/12] | 12.05.1997 | Despatch of a communication from the examining division (Time limit: M06) | 12.11.1997 | Reply to a communication from the examining division | 07.05.1998 | Despatch of communication of intention to grant (Approval: Yes) | 03.07.1998 | Communication of intention to grant the patent | 14.09.1998 | Fee for grant paid | 14.09.1998 | Fee for publishing/printing paid | Opposition(s) | 01.10.1999 | No opposition filed within time limit [1999/51] | Fees paid | Renewal fee | 17.10.1995 | Renewal fee patent year 03 | 23.10.1996 | Renewal fee patent year 04 | 10.10.1997 | Renewal fee patent year 05 | 16.10.1998 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DA]US4109297 (LESH NATHAN GEORGE, et al) [DA] 1,5,8,12 * column 2, line 20 - column 4, line 14 * | [A] - FEINSTEIN AND SBAR, "Performance of New Copper-Based Metallization Systems in an 85 C, 78% RH, SO2 Contaminated Environment", IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS AND MANUFACTURING TECHNOLOGY, NEW YORK,USA, (197906), vol. CHMT-2, no. 2, pages 159 - 171 [A] 1,8 * page 159, column R, paragraph 3 - paragraph 5 * | [A] - KEMMERER AND MILLS, "Adhesion of thin films of evaporated titanium-copper after electroplating", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY, NEW YORK US, (197903), vol. 16, no. 2, pages 352 - 355 [A] 1,8 * page 355, column R, paragraph 3 * |