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EP0624053
European procedure
Extract from the Register of European Patents
EP About this file: EP0624053
| EP0624053 - Mounting device and method of connecting miniaturized electronic components by bump connections [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 01.10.1999 Database last updated on 31.08.2024 | Most recent event Tooltip | 01.10.1999 | No opposition filed within time limit | published on 17.11.1999 [1999/46] | Applicant(s) | For all designated states Sony Corporation 7-35, Kitashinagawa 6-chome Shinagawa-ku Tokyo / JP | [N/P] |
| Former [1998/48] | For all designated states SONY CORPORATION 7-35, Kitashinagawa 6-chome Shinagawa-ku Tokyo / JP | ||
| Former [1998/18] | For all designated states SONY CORPORATION 7-35 Kitashinagawa 6-chome, Shinagawa-ku Tokyo / JP | ||
| Former [1994/45] | For all designated states SONY CORPORATION 7-35, Kitashinagawa 6-chome, Chiyoda-ku Tokyo / JP | Inventor(s) | 01 /
Goodman, Thomas W. c/o Sony Corporation 7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo / JP | 02 /
Fujita, Hiroyuki, c/o Sony Corporation 7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo / JP | 03 /
Murakami, Yoshikazu, c/o Sony Corporation 7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo / JP | 04 /
Murphy, Arthur T. c/o 28-4, Kakinokizaka 1-chome Meguro-ku, Tokyo / JP | [1994/45] | Representative(s) | Müller, Frithjof E. Müller Hoffmann & Partner Patentanwälte Innere Wiener Strasse 17 81667 München / DE | [N/P] |
| Former [1997/12] | Müller, Frithjof E., Dipl.-Ing. Patentanwälte MÜLLER & HOFFMANN, Innere Wiener Strasse 17 81667 München / DE | ||
| Former [1994/45] | TER MEER - MÜLLER - STEINMEISTER & PARTNER Mauerkircherstrasse 45 D-81679 München / DE | Application number, filing date | 94105413.2 | 07.04.1994 | [1994/45] | Priority number, date | JP19930104920 | 08.04.1993 Original published format: JP 10492093 | [1994/45] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0624053 | Date: | 09.11.1994 | Language: | EN | [1994/45] | Type: | A3 Search report | No.: | EP0624053 | Date: | 11.01.1995 | Language: | EN | [1995/02] | Type: | B1 Patent specification | No.: | EP0624053 | Date: | 25.11.1998 | Language: | EN | [1998/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 29.11.1994 | Classification | IPC: | H05K3/34 | [1994/45] | CPC: |
H05K3/303 (EP,US);
H05K3/3485 (EP,US);
H05K3/3436 (EP,US);
H05K2201/09909 (EP,US);
H05K2201/10568 (EP,US);
H05K2201/10734 (EP,US);
H05K2201/10992 (EP,US);
H05K2203/0126 (EP,US);
H05K2203/0195 (EP,US);
H05K2203/0338 (EP,US);
H05K2203/043 (EP,US);
H05K2203/044 (EP,US);
| Designated contracting states | DE, FR, GB [1994/45] | Title | German: | Montagevorrichtung und Verfahren zum Verbinden von miniaturisierten elektronischen Bauteilen mittels Höckerverbindungen | [1994/45] | English: | Mounting device and method of connecting miniaturized electronic components by bump connections | [1994/45] | French: | Dispositif de montage et procédé pour connecter des composants électroniques miniaturiséspar des interconnexions à bosse | [1994/45] | Examination procedure | 09.06.1995 | Examination requested [1995/32] | 24.01.1997 | Despatch of a communication from the examining division (Time limit: M04) | 02.04.1997 | Reply to a communication from the examining division | 24.10.1997 | Despatch of communication of intention to grant (Approval: Yes) | 03.06.1998 | Communication of intention to grant the patent | 06.08.1998 | Fee for grant paid | 06.08.1998 | Fee for publishing/printing paid | Opposition(s) | 26.08.1999 | No opposition filed within time limit [1999/46] | Fees paid | Renewal fee | 16.04.1996 | Renewal fee patent year 03 | 12.04.1997 | Renewal fee patent year 04 | 14.04.1998 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]US5186383 (MELTON CYNTHIA [US], et al) [X] 1-9,12,14 * column 4, line 41 - column 6, line 14 * [Y] 11,13; | [X]US4914814 (BEHUN JOHN R [US], et al) [X] 1-10 * column W * | [Y] - HODSON, "Dispensing surface mount adhesives and solder pastes", ELECTRONIC PACKAGING AND PRODUCTION, MASSACHUSETTS US, (199011), vol. 31, no. 11, pages 36 - 40, XP000234060 [Y] 11 * the whole document * | [YA] - HERTZ ET AL., "Solder embossed PCB location for debossed component", MOTOROLA TECHNICAL DEVELOPMENTS, SCHAUMBURG, ILLINOIS US, (199208), vol. 16, pages 89 - 90, XP000310370 [Y] 13 * page 90; figure 1 * [A] 1,5,14 |