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EP0630044
European procedure
Extract from the Register of European Patents
EP About this file: EP0630044
| EP0630044 - Forming a prescribed pattern on a semiconducor device layer [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.09.1999 Database last updated on 09.05.2025 | Most recent event Tooltip | 24.09.1999 | No opposition filed within time limit | published on 10.11.1999 [1999/45] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 72, Horikawa-cho, Saiwai-ku Kawasaki-shi Kanagawa-ken 210-8572 / JP | [N/P] |
| Former [1998/47] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 / JP | ||
| Former [1995/01] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP | ||
| Former [1994/51] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 / JP | Inventor(s) | 01 /
Okumura, Katsuya, c/o Intellectual Property Div. Toshiba Corporation, 1-1-1, Shibaura Minato-ku, Tokyo / JP | 02 /
Watanabe, Tohru, c/o Intellectual Property Div. Toshiba Corporation, 1-1-1, Shibaura Minato-ku, Tokyo / JP | 03 /
Watase, Masami, c/o Intellectual Property Div. Toshiba Corporation, 1-1-1, Shibaura Minato-ku, Tokyo / JP | [1994/51] | Representative(s) | Maury, Richard Philip, et al Marks & Clerk LLP 90 Long Acre London WC2E 9RA / GB | [N/P] |
| Former [1994/51] | Maury, Richard Philip, et al MARKS & CLERK, 57-60 Lincoln's Inn Fields London WC2A 3LS / GB | Application number, filing date | 94114930.4 | 15.08.1989 | [1994/51] | Priority number, date | JP19880223503 | 08.09.1988 Original published format: JP 22350388 | [1994/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0630044 | Date: | 21.12.1994 | Language: | EN | [1994/51] | Type: | A3 Search report | No.: | EP0630044 | Date: | 12.07.1995 | Language: | EN | [1995/28] | Type: | B1 Patent specification | No.: | EP0630044 | Date: | 18.11.1998 | Language: | EN | [1998/47] |
| Former [1995/14] | Type: | A3 Search report | |
| No.: | EP0630044 | ||
| Date: | |||
| Status: | (deleted) | ||
| [1995/14] | |||
| [1995/28] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 29.05.1995 | Classification | IPC: | H01L21/768, H01L21/321 | [1998/18] | CPC: |
H01L21/0332 (EP,US);
H01L21/30 (KR);
H01L21/02282 (EP,US);
H01L21/02164 (EP,KR,US);
H01L21/0337 (EP,US);
H01L21/31144 (EP,US);
H01L21/316 (US);
H01L21/32 (EP,US);
H01L21/32139 (EP,US);
|
| Former IPC [1995/28] | H01L21/90, H01L21/321 | ||
| Former IPC [1994/51] | H01L21/90 | Designated contracting states | DE, FR, GB [1994/51] | Title | German: | Herstellung von einem vorbeschriebenem Muster über eine Halbleitervorrichtungsschicht | [1994/51] | English: | Forming a prescribed pattern on a semiconducor device layer | [1994/51] | French: | Formation d'une configuration déterminée sur une couche d'un dispositif semi-conducteur | [1994/51] | Examination procedure | 19.10.1994 | Examination requested [1994/51] | 28.02.1996 | Despatch of a communication from the examining division (Time limit: M06) | 02.07.1996 | Reply to a communication from the examining division | 04.02.1997 | Despatch of a communication from the examining division (Time limit: M06) | 24.06.1997 | Reply to a communication from the examining division | 28.11.1997 | Despatch of communication of intention to grant (Approval: Yes) | 06.03.1998 | Communication of intention to grant the patent | 27.04.1998 | Fee for grant paid | 27.04.1998 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP89308284.2 / EP0358350 | Opposition(s) | 19.08.1999 | No opposition filed within time limit [1999/45] | Fees paid | Renewal fee | 19.10.1994 | Renewal fee patent year 03 | 19.10.1994 | Renewal fee patent year 04 | 19.10.1994 | Renewal fee patent year 05 | 19.10.1994 | Renewal fee patent year 06 | 09.08.1995 | Renewal fee patent year 07 | 10.08.1996 | Renewal fee patent year 08 | 08.08.1997 | Renewal fee patent year 09 | 10.08.1998 | Renewal fee patent year 10 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]FR2354633 (IBM [US]); | [A]EP0178619 (TOSHIBA KK [JP]); | [AD]US4599137 (AKIYA HIDEO [JP]); | [XD]US4624749 (BLACK JIMMY C [US], et al); | [PX]EP0304077 (TOSHIBA KK [JP]) |