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EP0608051
European procedure
Extract from the Register of European Patents
EP About this file: EP0608051
| EP0608051 - Resin-sealed semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 09.10.1998 Database last updated on 28.03.2026 | Most recent event Tooltip | 10.07.2004 | Change - lapse in a contracting state Updated state(s): FR | published on 25.08.2004 [2004/35] | Applicant(s) | For all designated states FUJI ELECTRIC CO. LTD. 1-1, Tanabeshinden, Kawasaki-ku Kawasaki 210 / JP | [1994/30] | Inventor(s) | 01 /
Haraguchi, Koichi c/o Fuji Electric Co Ltd, 1-1 Tanabeshinden Kawasaki-ku, Kawasaki / JP | 02 /
Ichimura, Yuji c/o Fuji Electric Co Ltd, 1-1 Tanabeshinden Kawasaki-ku, Kawasaki / JP | [1994/30] | Representative(s) | Bridge-Butler, Alan James, et al Baron Warren Redfern 19 South End Kensington London W8 5BU / GB | [N/P] |
| Former [1997/49] | Bridge-Butler, Alan James, et al G.F. Redfern & Co., 7 Staple Inn, Holborn London WC1V 7QF / GB | ||
| Former [1994/30] | Topley, Paul, et al G.F. Redfern & Co. Redfern House 149/151 Tarring Road Worthing West Sussex BN11 4HE / GB | Application number, filing date | 94300096.8 | 07.01.1994 | [1994/30] | Priority number, date | JP19930003646 | 13.01.1993 Original published format: JP 364693 | JP19930104849 | 06.05.1993 Original published format: JP 10484993 | [1994/30] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0608051 | Date: | 27.07.1994 | Language: | EN | [1994/30] | Type: | A3 Search report | No.: | EP0608051 | Date: | 21.09.1994 | Language: | EN | [1994/38] | Type: | B1 Patent specification | No.: | EP0608051 | Date: | 03.12.1997 | Language: | EN | [1997/49] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.08.1994 | Classification | IPC: | H01L23/24, H01L23/04 | [1994/30] | CPC: |
H10W76/17 (EP,US);
H10W76/12 (EP,US);
H10W76/47 (EP,US)
| Designated contracting states | DE, FR, GB [1994/30] | Title | German: | In Harz versiegelte Halbleiteranordnung | [1994/30] | English: | Resin-sealed semiconductor device | [1994/30] | French: | Dispositif semi-conducteur scellé par une résine | [1994/30] | Miscellaneous | EPB 1997/49: (deleted) | EPB 1997/49: (deleted) | EPB 1997/49: (deleted) | EPB 1996/47: Teilanmeldung 96114416.9 eingereicht am 09/09/96 | EPB 1996/47: Divisional application 96114416.9 filed on 09/09/96 | EPB 1996/47: Demande divisionnaire 96114416.9 déposée le 09/09/96 | Examination procedure | 26.04.1994 | Examination requested [1994/30] | 29.01.1996 | Despatch of a communication from the examining division (Time limit: M04) | 28.05.1996 | Reply to a communication from the examining division | 07.02.1997 | Despatch of communication of intention to grant (Approval: Yes) | 02.05.1997 | Communication of intention to grant the patent | 12.06.1997 | Fee for grant paid | 12.06.1997 | Fee for publishing/printing paid | Divisional application(s) | EP96114416.9 / EP0749159 | Opposition(s) | 04.09.1998 | No opposition filed within time limit [1998/48] | Fees paid | Renewal fee | 21.10.1995 | Renewal fee patent year 03 | 28.10.1996 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 03.12.1997 | [2004/35] |
| Former [1998/44] | FR | 30.04.1998 | Documents cited: | Search | [A] JPH04274350 | [A] JPS60254643 | [A] JPS61148845 | [A] JPS60119759 | [A] JPS63164245 | [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 071 (E - 1319) 12 February 1993 (1993-02-12) [A] 1,3,5 * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 121 (E - 401) 7 May 1096 (1096-05-07) [A] 1,3,5 * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 347 (E - 457) 21 November 1986 (1986-11-21) [A] 1,3,5 * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 009, no. 277 (E - 355) 6 November 1985 (1985-11-06) [A] 1,4,5 * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 012, no. 425 (E - 681) 10 November 1988 (1988-11-10) [A] 1-3,5,6 * abstract * |