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Extract from the Register of European Patents

EP About this file: EP0615281

EP0615281 - Wafer release method and apparatus [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.08.2001
Database last updated on 17.09.2024
Most recent event   Tooltip24.08.2001No opposition filed within time limitpublished on 10.10.2001 [2001/41]
Applicant(s)For all designated states
Axcelis Technologies, Inc.
55 Cherry Hill Drive
Beverly, MA 01915-1053 / US
[N/P]
Former [2000/33]For all designated states
Axcelis Technologies, Inc.
55 Cherry Hill Drive
Beverly, MA 01915 / US
Former [1994/37]For all designated states
EATON CORPORATION
Eaton Center, 1111 Superior Avenue
Cleveland, Ohio 44114-2584 / US
Inventor(s)01 / Blake, Julian G.
211 Hart Street
Beverly Farms, Massachusetts 01915 / US
02 / Tu, Weilin
6 Oak Street
Natick, Massachusetts 01760 / US
[1994/37]
Representative(s)Burke, Steven David, et al
R.G.C. Jenkins & Co 26 Caxton Street
London SW1H 0RJ / GB
[N/P]
Former [1994/37]Burke, Steven David, et al
R.G.C. Jenkins & Co. 26 Caxton Street
London SW1H 0RJ / GB
Application number, filing date94301606.308.03.1994
[1994/37]
Priority number, dateUS1993002915410.03.1993         Original published format: US 29154
[1994/37]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0615281
Date:14.09.1994
Language:EN
[1994/37]
Type: B1 Patent specification 
No.:EP0615281
Date:25.10.2000
Language:EN
[2000/43]
Search report(s)(Supplementary) European search report - dispatched on:EP17.06.1994
ClassificationIPC:H01L21/00
[1994/37]
CPC:
H01L21/67259 (EP,US); H01L21/68 (KR); H01L21/6831 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT [1994/37]
TitleGerman:Verfahren und Einrichtung zur Freigabe einer Halbleiterplatte[1994/37]
English:Wafer release method and apparatus[1994/37]
French:Méthode et dispositif pour libérer une galette semi-conductrice[1994/37]
Examination procedure09.03.1995Examination requested  [1995/19]
10.04.1995Despatch of a communication from the examining division (Time limit: M04)
13.07.1995Reply to a communication from the examining division
30.08.1996Despatch of a communication from the examining division (Time limit: M04)
07.01.1997Reply to a communication from the examining division
27.11.1997Despatch of a communication from the examining division (Time limit: M04)
02.04.1998Reply to a communication from the examining division
27.07.1999Despatch of communication of intention to grant (Approval: No)
21.12.1999Despatch of communication of intention to grant (Approval: later approval)
29.12.1999Communication of intention to grant the patent
23.03.2000Fee for grant paid
23.03.2000Fee for publishing/printing paid
Opposition(s)26.07.2001No opposition filed within time limit [2001/41]
Fees paidRenewal fee
07.03.1996Renewal fee patent year 03
07.03.1997Renewal fee patent year 04
05.03.1998Renewal fee patent year 05
04.03.1999Renewal fee patent year 06
06.03.2000Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]EP0460955  (VARIAN ASSOCIATES [US]) [X] 1-5 * the whole document *;
 [X]FR2676603  (UNISEARCH LTD [AU]) [X] 1-8 * the whole document *;
 [DA]US5103367  (HORWITZ CHRISTOPHER M [AU], et al);
 [PX]EP0552877  (APPLIED MATERIALS INC [US]) [PX] 1-8 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.