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EP0622151
European procedure
Extract from the Register of European Patents
EP About this file: EP0622151
| EP0622151 - Pb-free solder having improved mechanical properties. [Right-click to bookmark this link] | |||
| Former [1994/44] | An Article comprising a pb-free solder having improved mechanical properties | ||
| [1999/18] | Status | No opposition filed within time limit Status updated on 05.01.2001 Database last updated on 22.08.2024 | Most recent event Tooltip | 05.01.2001 | No opposition filed within time limit | published on 21.02.2001 [2001/08] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1994/44] | Inventor(s) | 01 /
Chen, Ho Sou 3 Country Place Lebanon, New Jersey 08833 / US | 02 /
Jin, Sungho 145 Skyline Drive Millington, New Jersey 07946 / US | 03 /
McCormack, Mark Thomas 96 New England Avenue Summit, New Jersey 07901 / US | [1994/44] | Representative(s) | Johnston, Kenneth Graham, et al Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue Enfield, EN3 7XB / GB | [N/P] |
| Former [1994/44] | Johnston, Kenneth Graham, et al AT&T (UK) Ltd. 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 94302785.4 | 20.04.1994 | [1994/44] | Priority number, date | US19930055495 | 30.04.1993 Original published format: US 55495 | [1994/44] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0622151 | Date: | 02.11.1994 | Language: | EN | [1994/44] | Type: | B1 Patent specification | No.: | EP0622151 | Date: | 08.03.2000 | Language: | EN | [2000/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.08.1994 | Classification | IPC: | B23K35/26, C22C13/00 | [1994/44] | CPC: |
C22C13/00 (EP,US);
B23K35/262 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1994/44] | Title | German: | Bleifreies Weichlot mit verbesserten mechanischen Eigenschaften. | [1999/18] | English: | Pb-free solder having improved mechanical properties. | [1999/18] | French: | Soudure tendre sans plomb ayant des propriétés mécaniques améliorées. | [1999/18] |
| Former [1994/44] | Gegenstand, der ein bleifreies Weichlot mit verbesserten mechanischen Eigenschaften enthält | ||
| Former [1994/44] | An Article comprising a pb-free solder having improved mechanical properties | ||
| Former [1994/44] | Article comprenant une soudure tendre sans plomb ayant des propriétés mécaniques améliorées | Examination procedure | 21.04.1995 | Examination requested [1995/25] | 01.10.1997 | Despatch of a communication from the examining division (Time limit: M06) | 09.04.1998 | Reply to a communication from the examining division | 26.06.1998 | Despatch of a communication from the examining division (Time limit: M06) | 05.01.1999 | Reply to a communication from the examining division | 07.05.1999 | Despatch of communication of intention to grant (Approval: Yes) | 07.09.1999 | Communication of intention to grant the patent | 26.11.1999 | Fee for grant paid | 26.11.1999 | Fee for publishing/printing paid | Opposition(s) | 09.12.2000 | No opposition filed within time limit [2001/08] | Fees paid | Renewal fee | 23.04.1996 | Renewal fee patent year 03 | 18.04.1997 | Renewal fee patent year 04 | 16.04.1998 | Renewal fee patent year 05 | 12.04.1999 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]GB131299 (LAMINOIRS ET CABLERIE SA DES [CH]); | [A]DE806820 (RAU FA G); | [A]JPH02197396 ; | [PX]US5242658 (STEVENS LAURENCE G [US], et al) [PX] 1-3,6-9 * the whole document *; | [A] - PATENT ABSTRACTS OF JAPAN, (19901023), vol. 14, no. 486, Database accession no. (M - 1038), & JP02197396 A 19900803 (MITSUBISHI CABLE IND LTD) [A] * abstract * | [A] - B.IRVING, "Host of New Lead-Free Solders Introduced", WELDING JOURNAL., MIAMI US, (199210), vol. 71, no. 10, pages 47 - 49, XP000310155 | [PX] - M.MCCORMACK ET AL, "Progress in the Design of New Lead-Free Solder Alloys", JOM, WARRENDALE US, (199307), vol. 45, no. 7, pages 36 - 40, XP000383232 [PX] 1-9 * page 39 - page 40 * |