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EP0663264
European procedure
Extract from the Register of European Patents
EP About this file: EP0663264
| EP0663264 - Semiconductor wafer edge polishing system and method [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 17.03.2000 Database last updated on 12.07.2024 | Most recent event Tooltip | 05.09.2008 | Lapse of the patent in a contracting state | published on 08.10.2008 [2008/41] | Applicant(s) | For all designated states Texas Instruments Incorporated 13500 North Central Expressway Dallas, Texas 75265 / US | [N/P] |
| Former [1995/29] | For all designated states TEXAS INSTRUMENTS INCORPORATED 13500 North Central Expressway Dallas Texas 75265 / US | Inventor(s) | 01 /
Simpson, Vikki S. 209 West McGee Sherman, TX / US | 02 /
Gullett, Tom G. 114 High Country Sherman, TX / US | 03 /
Medders, Jerry B. 1007 South Waco Van Alstyne, TX / US | 04 /
Robbins, Bobby R. 2914 Stafford Denison, TX 75020 / US | 05 /
Dyer, Lawrence D. 905 Waterview Circle Richardson, TX / US | 06 /
King, Clyde A. P.O. Box 462, 207 Pecan Bells, TX 75414 / US | 07 /
Clark, Arthur R. 355 Dickson Circle Sherman, TX 75090 / US | 08 /
Newton, Danny R. 1818 Skyline Drive Sherman, TX 75092 / US | 09 /
Bilderback, Douglas W. 4132 West Crawford Denison, TX 75020 / US | [1995/29] | Representative(s) | Schwepfinger, Karl-Heinz, et al Prinz & Partner GbR Manzingerweg 7 81241 München / DE | [N/P] |
| Former [1995/29] | Schwepfinger, Karl-Heinz, Dipl.-Ing., et al Prinz & Partner, Manzingerweg 7 D-81241 München / DE | Application number, filing date | 95100062.9 | 03.01.1995 | [1995/29] | Priority number, date | US19940178186 | 04.01.1994 Original published format: US 178186 | [1995/29] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0663264 | Date: | 19.07.1995 | Language: | EN | [1995/29] | Type: | B1 Patent specification | No.: | EP0663264 | Date: | 12.05.1999 | Language: | EN | [1999/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.05.1995 | Classification | IPC: | B24B9/06 | [1995/29] | CPC: |
B24B9/065 (EP,US);
H01L21/304 (KR);
Y10S414/141 (EP,US);
Y10S438/959 (EP,US)
| Designated contracting states | DE, FR, GB, IT, NL [1995/29] | Title | German: | Verfahren und Vorrichtung zum Abfasen von Halbleiterscheiben | [1995/29] | English: | Semiconductor wafer edge polishing system and method | [1995/29] | French: | Procédé et dispositif de polissage du bord d'une plaquette semi-conductrice | [1995/29] | Examination procedure | 08.01.1996 | Examination requested [1996/10] | 21.05.1997 | Despatch of a communication from the examining division (Time limit: M08) | 04.03.1998 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time | 14.05.1998 | Reply to a communication from the examining division | 17.07.1998 | Despatch of communication of intention to grant (Approval: Yes) | 09.11.1998 | Communication of intention to grant the patent | 19.02.1999 | Fee for grant paid | 19.02.1999 | Fee for publishing/printing paid | Opposition(s) | 15.02.2000 | No opposition filed within time limit [2000/18] | Request for further processing for: | 14.05.1998 | Request for further processing filed | 14.05.1998 | Full payment received (date of receipt of payment) Request granted | 04.06.1998 | Decision despatched | Fees paid | Renewal fee | 27.01.1997 | Renewal fee patent year 03 | 27.01.1998 | Renewal fee patent year 04 | 28.01.1999 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 31.01.2000 | [2008/41] | Documents cited: | Search | [DA]US5128281 (DYER LAWRENCE D [US], et al) [DA] 1 * column A; figure - *; | [PA]JPH0677188 ; | [A]EP0226772 (TOSHIBA KK [JP]) [A] 1 * abstract *; | [A]EP0354586 (SHINETSU HANDOTAI KK [JP]) [A] 1-3 * column 5, line 33 - column 6, line 53; figures 3-5 *; | [A]US4846623 (OTANI MASAMI [JP], et al) [A] 3 * column A; figure - *; | [A]US5240557 (DYER LAWRENCE D [US], et al) [A] 1 * column A; figure - * | [PA] - DATABASE WPI, 2, Derwent World Patents Index, vol. 94, no. 16, Database accession no. 94-129938, & JPH0677188 A 19940318 (KAWASAKI STEEL CO.) [PA] 1 * abstract * |