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Extract from the Register of European Patents

EP About this file: EP0675673

EP0675673 - Reinforcement for flexible printed circuit board and reinforced flexible circuit board [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 30.05.2003 Database last updated on 03.09.2024
Most recent event Tooltip	30.05.2003	Application deemed to be withdrawn	published on 16.07.2003 [2003/29]
Applicant(s)	For all designated states NITTO DENKO CORPORATION 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka / JP
	[N/P]
Former [1995/40]	For all designated states NITTO DENKO CORPORATION 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka / JP
Inventor(s)	01 / Eriguchi, Fuyuki c/o Nitto Denko Corp., 1-2, Shimohozumi 1-chome Ibaraki-shi, Osaka / JP
	02 / Sugimoto, Toshihiko c/o Nitto Denko Corp., 1-2, Shimohozumi 1-chome Ibaraki-shi, Osaka / JP
	03 / Watanabe, Seiichi c/o Nitto Denko Corp., 1-2, Shimohozumi 1-chome Ibaraki-shi, Osaka / JP
	[1995/40]
Representative(s)	Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstrasse 4 80802 München / DE
	[N/P]
Former [1995/40]	Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Maximilianstrasse 58 D-80538 München / DE
Application number, filing date	95104573.1	28.03.1995
	[1995/40]
Priority number, date	JP19940085672	30.03.1994 Original published format: JP 8567294
	[1995/40]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0675673
	Date:	04.10.1995
	Language:	EN
	[1995/40]
	Type:	A3 Search report
	No.:	EP0675673
	Date:	05.03.1997
	[1997/10]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	21.01.1997
Classification	IPC:	H05K1/02	[1995/40]
	CPC:	H05K3/281 (EP,US); H05K3/0064 (EP,US); H05K1/0393 (EP,US); H05K2201/0195 (EP,US); H05K2201/2009 (EP,US); H05K3/386 (EP,US)
Designated contracting states	DE, GB [1995/40]
Title	German:	Verstärkung für flexible Leiterplatte und verstärkte flexible Leiterplatte	[1995/40]
	English:	Reinforcement for flexible printed circuit board and reinforced flexible circuit board	[1995/40]
	French:	Renforcement pour plaquette à circuit imprimé flexible et plaquette à circuit imprimé flexible renforcée	[1995/40]
Examination procedure	28.04.1997	Examination requested [1997/26]
	02.09.2002	Despatch of a communication from the examining division (Time limit: M04)
	14.01.2003	Application deemed to be withdrawn, date of legal effect [2003/29]
	14.02.2003	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2003/29]
Fees paid	Renewal fee
	26.03.1997	Renewal fee patent year 03
	31.03.1998	Renewal fee patent year 04
	25.03.1999	Renewal fee patent year 05
	29.03.2000	Renewal fee patent year 06
	29.03.2001	Renewal fee patent year 07
	28.03.2002	Renewal fee patent year 08
	Penalty fee
	Additional fee for renewal fee
	31.03.2003	09 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]JPH03185891 ;
		[A]JPH02177492 ;
		[A]JPH02218194 ;
		[A]JPH0237795
		[A] - PATENT ABSTRACTS OF JAPAN, (19911111), vol. 15, no. 442, Database accession no. (E - 1131), & JP03185891 A 19910813 (HITACHI CHEM CO) [A] 1,2,13,14 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19900926), vol. 14, no. 448, Database accession no. (E - 0983), & JP02177492 A 19900710 (MITSUBISHI KASEI CORP) [A] 1,2,13,14 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19901114), vol. 14, no. 520, Database accession no. (E - 1002), & JP02218194 A 19900830 (SUMITOMO ELECTRIC IND) [A] 1,13 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19900418), vol. 14, no. 190, Database accession no. (E - 0918), & JP02037795 A 19900207 (MITSUBISHI PLASTICS IND) [A] * abstract *

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